BOARD-TO-BOARD CONNECTOR ASSEMBLY

    公开(公告)号:US20230065545A1

    公开(公告)日:2023-03-02

    申请号:US17892128

    申请日:2022-08-22

    Abstract: A board-to-board connector assembly includes: a plug connector having: a second body having a second slot and a second sidewall; and third metal members; and a socket connector having: a first body having an island, a first slot, and a first sidewall; and first and second metal members. The first metal members are disposed in the first body and extend from a bottom of the first sidewall to the island through the first slot. The second metal members are disposed in the first body, and straddles and covers a portion of the first sidewall. The third metal members are disposed in the second body, and straddle and cover a portion of the second sidewall. When the connectors are mated, the second sidewall is inserted into the first slot, the island is inserted into the second slot, and the third metal members are pressed against the first and second metal members.

    Board-to-board connector
    4.
    发明授权

    公开(公告)号:US11139601B2

    公开(公告)日:2021-10-05

    申请号:US16884519

    申请日:2020-05-27

    Abstract: A first connector and a second connector are provided. The first connector includes an insulated body, first terminals, and fastening members. The first terminals and the fastening members are on the insulated body. The second connector includes an insulated base, second terminals, and positioning members. The second terminals and the positioning members are on the insulated base. The fastening members and the positioning members are enclosing structures covering the insulated body of the first connector and the insulated base of the second connector, respectively. The fastening members and the positioning members provide multi-point contacts.

    Flexible circuit board
    5.
    发明授权

    公开(公告)号:US11044803B2

    公开(公告)日:2021-06-22

    申请号:US16908740

    申请日:2020-06-23

    Abstract: A flexible circuit board including at least two electrical conducting layers, at least two non-electrical conducting layers, and at least one adhesion layer is provided. The non-electrical conducting layers are disposed between the electrical conducting layers. The non-electrical conducting layers are adhered together via the adhesion layer. A sum of thickness of the non-electrical conducting layers is greater than 4 mil, and there is no electrical conducting layer sandwiched between the at least two non-electrical conducting layers.

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