公开(公告)号：JP2000345046A

公开(公告)日：2000-12-12

申请号：JP2000093776

申请日：2000-03-30

Applicant: DOW CORNING TORAY SILICONE

Inventor： AMAKO MASAAKI ,  OKAWA SUNAO ,  NAKAYOSHI KAZUMI ,  MITANI OSAMU

IPC: C08L83/07 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/08 ,  C08K3/40 ,  C08L101/00 ,  C09D183/07 ,  C09J183/07

Abstract: PROBLEM TO BE SOLVED: To provide curable organopolysiloxane compositions capable of quickly curing on the surfaces of various substrates and allowing portions oozed out before or during curing to well cure to adhere to various substrates, cured products to be obtained by curing the compositions, and integrated products of the cured products with the substrates. SOLUTION: A curable organopolysiloxane composition comprises (A) an organopolysiloxane having an average of at least two alkenyl groups and an average of at least two silicon atom-bonded hydrogens in the same molecule, (B) a compound having an alkenyl group and a hydroxyphenyl group in one molecule, and (C) a hydrosilylation reaction catalyst. A cured product is obtained by curing this composition, and an integrated product of a cured product with a substrate is obtained by integrating the cured product of the composition with the substrate.

公开(公告)号：JPH0948960A

公开(公告)日：1997-02-18

申请号：JP21985995

申请日：1995-08-04

Applicant: DOW CORNING TORAY SILICONE

Inventor： TAZAWA RIKAKO ,  NAKAYOSHI KAZUMI ,  MITANI OSAMU ,  MINE KATSUTOSHI

IPC: C09J183/05 ,  C09J183/00 ,  C09J183/07 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To improve the wire bondability to a semiconductor chip and a lead frame by using three specified organopolysiloxanes, a condensation catalyst and a platinum catalyst as the constituents. SOLUTION: A mixture of 5-95wt.% organopolysiloxane (a) which has a viscosity at 25 deg.C of 20-200,000cP, contains at least two alkoxy groups bonded to an Si atom in the molecule and does not contain an alkenyl group bonded to an Si atom and 95-5wt.% organopolysiloxane (b) which has a viscosity at 25 deg.C of 20-200,000cP, contains at least two alkenyl groups bonded to an Si atom in the molecule and does not contain an alkoxy group bonded to an Si atom in an amount of 100 pts.wt. is blended with an organopolysiloxane (c) which has a viscosity at 25 deg.C of 2-20,000cP and contains at least two H atoms bonded to an Si atom in the molecule in an amount sufficient to provide a molar ratio of the alkenyl groups bonded to an Si atom in component (b) to the H atoms bonded to an Si atom of (0.5 to 20): 1, 0.01-10 pts.wt. condensation catalyst and 0.01-1,000ppm (in terms of metal atoms) platinum catalyst.

公开(公告)号：JPH10130508A

公开(公告)日：1998-05-19

申请号：JP30567096

申请日：1996-10-31

Applicant: DOW CORNING TORAY SILICONE

Inventor： MITANI OSAMU ,  NAKAYOSHI KAZUMI ,  TAZAWA RIKAKO ,  MINE KATSUTOSHI

IPC: C08K3/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09J183/04 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To produce a conductive silicone composition, to be cured by an addition reaction, which can cure through an addition reaction and form a conductive silicone cured product having low electrical resistance and low electric receptivity and small in the temperature dependence of electrical resistance and a change of electrical resistance and electric resistivity with time, and to efficiently produce such a conductive silicone cured product. SOLUTION: This conductive silicone composition to be cured by an addition reaction comprises (A) 100 pts.wt. of an organopolysiloxane having, in a molecule, at least two alkenyl groups, (B) a composition-sufficietly curing quantity of an organopolysiloxane having, in a molecule, at least two hydrogens combined with a silicon, (C) 50-2000 pts.wt. of conductive metal-based finely divided powder, (D) a catalytic quantity of platinum-based catalyst for addition reaction and (E) 0.1-10 pts.wt., based on 100 pts.wt. of the total of components A, B, C and D, of a volatile solvent with a higher boiling pint (

公开(公告)号：JPH0948916A

公开(公告)日：1997-02-18

申请号：JP21986095

申请日：1995-08-04

Applicant: DOW CORNING TORAY SILICONE

Inventor： TAZAWA RIKAKO ,  NAKAYOSHI KAZUMI ,  MITANI OSAMU ,  MINE KATSUTOSHI

IPC: C08K3/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09J183/00 ,  C09J183/07 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide a conductive silicone rubber composition which can be cured to form a silicone rubber of excellent conductivity by mixing three specified polyorganosiloxanes with a conductive filler and two catalysts. SOLUTION: This conductive silicone rubber composition comprises 100 pts.wt. mixture of 5-95wt.% organopolysiloxane containing at least two Si- bonded alkoxyl groups in the molecule and freed from any Si-bonded alkenyl groups and having a viscosity of 20200,000cP at 25 deg.C with 95-5wt.% polyorganosiloxane having at least two Si-bonded alkenyl groups in the molecule, freed from any Si-bonded alkoxy groups and having a viscosity of 20-200,000cP at 25 deg.C, an organopolysiloxane containing at least two Si-bonded hydrogen atoms in the molecule, having a viscosity of 2-20,000cP at 25 deg.C and (used in an amount to give a molar ratio of the alkenyl groups to the hydrogen atoms of 0.5-20), 50-2,000 pts.wt. conductive filler and a catalyst component comprising a condensation catalyst and a platinum catalyst.

公开(公告)号：JPH05163435A

公开(公告)日：1993-06-29

申请号：JP35348891

申请日：1991-12-17

Applicant: DOW CORNING TORAY SILICONE

Inventor： MITANI OSAMU ,  MURAKAMI ICHIRO

IPC: C08K5/17 ,  C08K5/18 ,  C08L83/04 ,  C10M169/04

Abstract: PURPOSE:To provide the subject composition causing little rise or fall in its viscosity at elevated temperatures under high shear, also causing no torque variations, durable to use for a long time, comprising an organopolysiloxane fluid and a specific compound at specified proportion. CONSTITUTION:The objective composition can be obtained by heating at 60-130 deg.C a mixture of (A) 100 pts.wt. of an organopolysiloxane fluid of formula I [R is alkyl; R is aryl; (a+b) is 1.95-2.05; b/(a+b) is 0.05-0.30] (pref. with a viscosity of 500-500000cSt at 25 deg.C) and (B) 0.01-5 pts.wt. of a compound of formula II (R is alkyl) (e.g. a compound of formula III).

公开(公告)号：JP2006022278A

公开(公告)日：2006-01-26

申请号：JP2004203661

申请日：2004-07-09

Applicant: Dow Corning Toray Co Ltd ,  東レ・ダウコーニング株式会社

Inventor： MITANI OSAMU ,  ONISHI MASAYUKI ,  KODAMA HARUMI

IPC: C08L83/06 ,  C08K3/36 ,  C08K5/5415 ,  C09D183/04 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a room temperature-curable organopolysiloxane composition forming a cured product which sufficiently adheres to a substrate with which it is brought into contact on the way of curing and which causes interfacial peeling from the substrate even after a prolonged lapse of time, and electric/electronic apparatuses which permit removal of the cured product from electric circuits or electrodes even after a prolonged lapse of time and can be repaired or recycled.
SOLUTION: The room temperature-curable organopolysiloxane composition comprises (A) an organopolysiloxane bearing in one molecule two trialkoxysilyl-containing groups bonded to a silicon atom in the molecular chain, (B) an alkoxysilane or a partial hydrolyzate condensate thereof, (C) a spherical silica fine powder having an average particle size of 0.1-20 μm and (D) a condensation reaction catalyst. The electric/electronic apparatuses have electric circuits or electrodes thereof sealed or coated with the cured product formed of the composition.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种室温可固化的有机基聚硅氧烷组合物，其形成固化产物，该固化产物在固化过程中充分粘附到与基底接触的基底上，并且即使在固化后也引起与基底的界面剥离 延长使用时间，以及即使在长时间的流逝之后也可以从电路或电极中除去固化物的电气/电子设备，并且可以被修复或再循环。 室温可固化的有机基聚硅氧烷组合物包含（A）在一个分子中带有两个与分子链中的硅原子键合的含有三烷氧基甲硅烷基的基团的有机聚硅氧烷，（B）烷氧基硅烷或其部分水解产物缩合物（ C）平均粒度为0.1-20μm的球形二氧化硅细粉末和（D）缩合反应催化剂。 电气/电子设备具有密封或涂覆有由该组合物形成的固化产物的电路或电极。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005075959A

公开(公告)日：2005-03-24

申请号：JP2003309346

申请日：2003-09-01

Applicant: Dow Corning Toray Silicone Co Ltd ,  東レ・ダウコーニング・シリコーン株式会社

Inventor： TAKANAMI SACHIKO ,  USHIO YOSHITO ,  MITANI OSAMU ,  ONISHI MASAYUKI

IPC: B32B25/20 ,  B32B25/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09J7/00 ,  C09J7/02 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC classification number: B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

Abstract: PROBLEM TO BE SOLVED: To provide a transparent adhesive silicone elastomer sheet curable by hydrosilylation reaction and having stable and permanent tacky adhesiveness on the surface. SOLUTION: The adhesive silicone elastomer sheet is produced by curing a hydrosilylation-curable silicone elastomer composition composed of (A) an organopolysiloxane having at least two Si-bonded alkenyl groups and a diorganosiloxane unit in one molecule, (B) an organopolysiloxane resin expressed by the average unit formula: (R 1 3 SiO 1/2 ) x (SiO 4/2 ) 1.0 (R 1 is a substituted or unsubstituted univalent hydrocarbon group; and x is 0.5-1.0), (C) an organopolysiloxane having at least two Si-bonded hydrogen atoms in one molecule and (D) a catalyst for hydrosilylation reaction. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供通过氢化硅烷化反应可固化并在表面上具有稳定和永久粘性的透明粘性硅氧烷弹性体片。 粘合性有机硅弹性体片材是通过将由（A）具有至少两个Si键合的烯基的有机聚硅氧烷和二分子内的二有机硅氧烷单元组成的氢化硅烷化可固化的硅氧烷弹性体组合物，（B）有机聚硅氧烷 由平均单位式表示的树脂：（R 1 SiO 1/2 ） （R 1 SP 2是取代或未取代的一价烃基，x是0.5-1.0），（C）有机聚硅氧烷，其具有 在一个分子中至少两个Si键合的氢原子和（D）氢化硅烷化反应的催化剂。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2006348119A

公开(公告)日：2006-12-28

申请号：JP2005174430

申请日：2005-06-15

Applicant: DOW CORNING TORAY CO LTD

Inventor： USHIO YOSHITO ,  MITANI OSAMU

IPC: C08L83/14 ,  C08K5/5415 ,  C08L83/05 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition which can be well bonded to a non-washed aluminum die-casting or PPS even when cured at a low temperature such as 100°C. SOLUTION: The curable organopolysiloxane composition at least includes (A) (a1) an organopolysiloxane having at least one alkoxysilyl-containing group bonded to a silicon atom and at least 0.5 alkenyl group on average in a molecule or a mixture of the (a1) component and (a2) an organopolysiloxane having at least two alkenyl groups in a molecule and not having the alkoxysilyl-containing group, (B) an organopolysiloxane having at least two silicon atom-bound hydrogen atoms in a molecule, (C) an organosilicon compound having at least one alkoxy group bonded to a silicon atom in a molecule and not having the alkoxysilyl-containing group, and (D) a catalyst for hydrosilylation reaction. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2006022277A

公开(公告)日：2006-01-26

申请号：JP2004203660

申请日：2004-07-09

Applicant: Dow Corning Toray Co Ltd ,  東レ・ダウコーニング株式会社

Inventor： MITANI OSAMU ,  ONISHI MASAYUKI ,  KODAMA HARUMI

IPC: C08L83/06 ,  C08K5/5419 ,  C08L83/04 ,  C09D183/04 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31

CPC classification number: C08L83/04 ,  C08G77/18 ,  C08G77/70 ,  C08K5/0091 ,  C08L83/00 ,  C08L2666/44

Abstract: PROBLEM TO BE SOLVED: To provide a room temperature-curable organopolysiloxane composition forming a cured product which sufficiently adheres to a substrate with which it is brought into contact on the way of curing and which causes interfacial peeling from the substrate even after a prolonged lapse of time, and electric/electronic apparatuses which permit removal of the cured product from electric circuits or electrodes even after a prolonged lapse of time and can be repaired or recycled. SOLUTION: The room temperature-curable organopolysiloxane composition comprises (A) an organopolysiloxane bearing in one molecule two trialkoxysilyl-containing groups bonded to a silicon atom in the molecular chain, (B) a diorganodialkoxysilane or a partial hydrolyzate condensate thereof, (C) an organopolysiloxane bearing in one molecule at least one phenyl group bonded to a silicon atom in the molecular chain and no alkoxyl groups bonded to the silicone atom, and (D) a titanium chelate catalyst. The electric/electronic apparatuses have electric circuits or electrodes thereof sealed or coated with the cured product formed of the composition. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种室温可固化的有机基聚硅氧烷组合物，其形成固化产物，该固化产物在固化过程中充分粘附到与基底接触的基底上，并且即使在固化后也引起与基底的界面剥离 延长使用时间，以及即使在长时间的流逝之后也可以从电路或电极中除去固化物的电气/电子设备，并且可以被修复或再循环。 室温可固化的有机基聚硅氧烷组合物包含（A）在一个分子中带有两个分子链中与硅原子键合的两个含有三烷氧基甲硅烷基的基团的有机聚硅氧烷，（B）二有机二烷氧基硅烷或其部分水解产物缩合物（ C）在一个分子中具有至少一个与分子链中的硅原子键合的苯基并没有与硅原子键合的烷氧基的有机聚硅氧烷，（D）钛螯合催化剂。 电气/电子设备具有密封或涂覆有由该组合物形成的固化产物的电路或电极。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005008693A

公开(公告)日：2005-01-13

申请号：JP2003171991

申请日：2003-06-17

Applicant: Dow Corning Toray Silicone Co Ltd ,  東レ・ダウコーニング・シリコーン株式会社

Inventor： MITANI OSAMU ,  TAKANAMI SACHIKO ,  NAKADA TOSHIKI ,  ONISHI MASAYUKI

IPC: C08L101/06 ,  C08K5/5425

Abstract: PROBLEM TO BE SOLVED: To obtain a photocurable organic polymer composition which quickly cures by photoirradiation with ultraviolet rays, an electron beam, and the like, to form a cured product having moistureproofness, thereafter exhibits adhesiveness by aging, and particularly can prevent the corrosion of an electoroconductive part made of a metal in electric/electronic equipment by a corrosive substance and the stray current corrosion by migration when coated and cured on the electroconductive part made of the metal in the electric/electronic equipment to be exposed to the corrosive substance and moisture.
SOLUTION: This photocurable organic polymer composition comprises at least (A) a liquid organic polymer having at least one hydroxy group in the molecule, (B) an organosilicon compound represented by the formula (wherein R
1 is hydrogen or methyl group; R
2 is a 1-10C divalent hydrocarbon group; R
3 is a monovalent hydrocarbon group; R
4 is an alkyl group; and (a) is 0 or 1), (C) a catalyst for condensation reaction, (D) a photopolymerization initiator, and (E) a metal corrosion inhibitor.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题为了获得通过紫外线，电子束等的光照射快速固化的光固化性有机聚合物组合物，以形成具有防潮性的固化物，其后通过老化显示出粘合性，特别是可以防止 在电气/电子设备中由腐蚀性物质形成的金属导电部件的腐蚀和在电气/电子设备中由金属制成的导电部件上涂覆和固化时的杂散电流腐蚀被暴露于腐蚀性 物质和水分。 解决方案：该可光固化的有机聚合物组合物至少包含（A）在分子中具有至少一个羟基的液体有机聚合物，（B）由下式表示的有机硅化合物（其中R 1 是氢或甲基; R 2是一个1-10C的二价烃基; R 3是一价烃基; R SP 4是 烷基;（a）为0或1），（C）缩合反应用催化剂，（D）光聚合引发剂，（E）金属缓蚀剂。 版权所有（C）2005，JPO＆NCIPI