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    OPTICAL AND OPTOELECTRONIC ASSEMBLIES INCLUDING MICRO-SPACERS, AND METHODS OF MANUFACTURING THE SAME
    4.
    发明申请
    OPTICAL AND OPTOELECTRONIC ASSEMBLIES INCLUDING MICRO-SPACERS, AND METHODS OF MANUFACTURING THE SAME 审中-公开
    包含微小间隔物的光学和光电子组件及其制造方法

    公开(公告)号：WO2018004459A1

    公开(公告)日：2018-01-04

    申请号：PCT/SG2017/050318

    申请日：2017-06-28

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： WU, Guo Xiong ,  LEE, Ming Jie ,  GUBSER, Simon ,  YU, Qichuan ,  TAN, Joon Heng

    IPC: B32B3/26 ,  G02B5/20 ,  H01L25/16 ,  H01L31/0232 ,  H01L23/04

    Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.

    Abstract translation: 本公开描述了光学和光电子组件，其在一些情况下包括丝网印刷的微间隔物以及用于制造这种组件和模块的方法。 例如，可以在第一光学元件层上施加微间隔物，并且可以在第一微间隔物上提供第二光学元件层。 通过在第一微间隔体上提供第二光学元件层，第二光学元件层和第一光学元件层可以通过空气或真空间隙彼此分离，所述空气间隙或真空间隙中的每一个由第一微型间隔体的一部分横向围绕， 间隔物。

    THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE
    5.
    发明申请
    THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE 审中-公开
    薄型光电子模块及其制造

    公开(公告)号：WO2017146645A1

    公开(公告)日：2017-08-31

    申请号：PCT/SG2017/050078

    申请日：2017-02-21

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： YU, Qichuan ,  RUDMANN, Hartmut ,  WANG, Ji ,  NG, Kian Siang ,  GUBSER, Simon ,  EILERTSEN, James ,  GNANA SAMBANDAM, Sundar Raman

    IPC: G01S7/481 ,  H01L31/00 ,  H01L51/44 ,  H01L23/28 ,  H01L33/52 ,  H01L25/16

    CPC classification number: G01S7/481 ,  G01S17/02 ,  G01S17/026 ,  H01L25/16 ,  H01L31/00 ,  H01L33/54 ,  H01L33/58 ,  H01L51/44 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2924/00014

    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

    Abstract translation: 晶圆级制造方法使得可以制造诸如光电模块的超薄光学装置。 对包括有源光学元件和晶圆尺寸衬底的初始晶圆进行清晰的封装。 其中，产生包括孔的可光结构化不透明涂层。 然后，产生穿过透明封装并建立中间产品侧壁的沟槽。 然后，将不透明封装施加到中间产品上，从而填充沟槽。 通过切割存在于沟槽中的不透明封装材料，产生经分割的光学模块，其中中间产品的侧壁被不透明封装材料覆盖。 在大多数工艺步骤中，晶圆尺寸的基板可以连接到刚性载体晶圆上。

    OPTICAL ELEMENT STACK ASSEMBLIES
    9.
    发明申请
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开
    光学元件组件

    公开(公告)号：WO2017082820A1

    公开(公告)日：2017-05-18

    申请号：PCT/SG2016/050545

    申请日：2016-11-04

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： WANG, Ji ,  LEONG, Kam Wah ,  TESANOVIC, Bojan ,  YU, Qichuan ,  SENN, Tobias ,  SPRING, Nicola ,  LENART, Robert

    IPC: G02B7/00 ,  B29C33/00 ,  B29C64/106 ,  G02B3/00 ,  G02B7/02 ,  G02B9/04 ,  G02B11/02

    CPC classification number: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  B29K2995/0031 ,  B29L2011/00 ,  G02B7/021

    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬ structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

    Abstract translation: 光学堆叠组件及其制造技术。 光学堆叠组件包括第一和第二子组件，其中的每一个包括基底和固定到相应基底的子结构。 每个子结构包括相应的第一边缘特征和从该子结构的基板突出的相应的第二边缘特征，每个第二边缘特征侧向地比第一边缘更靠近相应子结构的外周布置 具有相同子结构的特征。 第一子结构的第一边缘特征与第二子结构的第一边缘特征直接接触， 结构，而第一子结构的第二边缘特征和第二子结构的第二边缘特征通过粘合剂彼此附接。 第一或第二子结构中的至少一个包括在子结构的与该子结构的第一和第二边缘特征相同的一侧上的光学元件。 光学元件叠层组件还包括侧向围绕第一和第二子组件的并且模制到第一和第二子组件的隔离件。

    OPTOELECTRONIC MODULES INCLUDING AN IMAGE SENSOR HAVING REGIONS OPTICALLY SEPARATED FROM ONE ANOTHER
    10.
    发明申请
    OPTOELECTRONIC MODULES INCLUDING AN IMAGE SENSOR HAVING REGIONS OPTICALLY SEPARATED FROM ONE ANOTHER 审中-公开
    包含图像传感器的光电模块，其中一个区域光电隔离

    公开(公告)号：WO2016013977A1

    公开(公告)日：2016-01-28

    申请号：PCT/SG2015/050224

    申请日：2015-07-22

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： GUBSER, Simon ,  HANSELMANN, Sonja ,  YU, Qichuan ,  CALSENA, Cris ,  WU, Guo Xiong ,  RUDMANN, Hartmut

    IPC: H01L27/146 ,  H01L31/00

    CPC classification number: H01L27/14618 ,  H01L27/14623 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

    Abstract translation: 本公开描述了光电子模块，其包括图像传感器，该图像传感器具有通过壁彼此光学地分离的至少两个区域。 壁可以包括在图像传感器上延伸的桥接部分，并且还可以包括固化的粘合剂部分，其部分设置在桥接部分的下表面和图像传感器的上表面之间。 描述了用于制造模块的各种技术，以帮助防止粘合剂污染图像传感器的敏感区域。 壁可以是基本上不透光的，以便防止例如在位于壁的一侧的光发射器和位于壁的另一侧的图像传感器的光敏区域之间的不期望的光学串扰。

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