Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition that is excellent in heat resistance and light resistance, both are required on a practical side, and can form a cured product the transparency of which is not degraded under a high-temperature condition.SOLUTION: The curable composition comprises: polyorganosiloxane [A] that has an epoxy cyclohexyl group and a polystyrene-conversion weight average molecular weight of 500 to 100,000; a hindered phenol compound [B] that has a specific structure; a hindered amine compound [C] that has a specific structure.
Abstract:
PROBLEM TO BE SOLVED: To provide an insulation pattern forming method and a resin composition capable of forming a multilayer structure easily without performing a complicated etching step, etc.SOLUTION: The insulation pattern formation method includes: [I] a process of forming organic patterns on a substrate; [II] a process of embedding insulation material among the organic patterns; [III] a process of removing the organic patterns and obtaining a reversal pattern composed of the insulation material; and [IV] a process of curing the obtained reversal pattern. The insulation pattern formation material for damascene processing to be used in the insulation pattern formation method is also provided.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition for liquid immersion exposure, a cured pattern forming method and a cured pattern which are suitably used in a liquid immersion exposure process for exposing a resist film via a liquid for liquid immersion exposure such as water.SOLUTION: The radiation-sensitive resin composition for liquid immersion exposure of the invention has a structure obtained by hydrolytic condensation of at least one selected from silane compounds represented by the formula [RSiX] and silane compounds represented by the formula [SiX], and contains a silicon-containing polymer having a weight average molecular weight of 1000 to 200000 according to GPC, a fluorine-containing polymer, an acid generator and a solvent. (In the formulas: Rrepresents a fluorine atom, an alkylcarbonyloxy group or an alkyl group having 1 to 20 carbon atoms; X represents a chlorine atom, a bromine atom or OR(where R is a monovalent organic group); and a represents an integer from 1 to 3.)
Abstract:
PROBLEM TO BE SOLVED: To provide a polysiloxane resin composition for forming a reversed pattern and being properly embedded in a gap of a mask pattern which is excels in resistance to dry etching and in preservation stability, without being mixed with a mask pattern formed on a substrate to be processed, and to provide a method for forming the inverted pattern which uses the composition. SOLUTION: The method for forming a reversed pattern includes (1) a mask pattern forming step of forming a mask pattern on a substrate to be processed, (2) an embedding step of burying a polysiloxane resin composition in gaps of the mask pattern, and (3) a reversed pattern forming step of removing the mask pattern and forming a reversed pattern. The polysiloxane resin composition contains [A] polysiloxane having a specific structure, and [B] a organic solvent having a specific structure. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive composition suitable for forming a cured pattern constituting an interlayer insulating film with a low relative dielectric constant and a high elastic modulus. SOLUTION: The radiation-sensitive composition includes a polysiloxane obtained by hydrolytic condensation of a silane compound comprising an organosilicon compound represented by formula (1) and an organosilicon compound represented by formula (2), an acid generator, a solvent, and an acid diffusion inhibitor, wherein R 1 and R 5 represent H, F, alkoxyl, alkyl, cyano, cyanoalkyl or alkylcarbonyloxy; R 2 , R 4 and R 7 represent a monovalent organic group; and R 3 represents a single bond, arylene, methylene or alkylene. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-curable resin composition capable of giving an optical member (for example, a Fresnel lens of a microdisplay type projection television) which comprises a cured product having a high refractive index, capable of maintaining adhesion to various plastic substrates even in a hot humid environment, and having excellent storage stability and light yellowing resistance (property of suppressing yellowing due to light). SOLUTION: The radiation-curable resin composition for the optical member includes (A) a urethane (meth)acrylate which is the reaction product of (a) a hydroxyl group-containing (meth)acrylate, (b) an aliphatic polyisocyanate and (c) a polyol, (B) an epoxy group-containing (meth)acrylate, (C) an ethylenically unsaturated group-containing compound other than the components (A) and (B), and (D) a tertiary phosphine. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation curable resin composition for an optical member capable of forming a cured product having a high refractive index and such a moderate hardness (Young's modulus) as to suppress the distortion of a surface relief structure of a Fresnel lens or the like, and less liable to cause yellowing due to light. SOLUTION: The radiation curable resin composition for an optical member includes: (A) 5-70 mass% of a urethane (meth)acrylate which is a reaction product of (a) a hydroxyl group-containing (meth)acrylate, (b) an aliphatic polyisocyanate and (c) a polyol; and (B) 10-80 mass% of an ethylenically unsaturated group-containing compound other than the component (A). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming composition which is excellent in flattening effect and is useful as a material for an interlayer insulating film used in a semiconductor element etc., a method for forming the insulating film, the insulating film and a semiconductor device. SOLUTION: The film-forming composition contains (A) a hydrolytic condensate obtained by hydrolyzing and condensing an alkoxysilane in the presence of water and at least one of a metal chelate compound and an acid catalyst, (B) a hydrolysis condensate obtained by hydrolyzing and condensing an alkoxysilane in the presence of an alkali catalyst and water, an organic solvent and water. The weight ratio of component (A) is greater than that of component (B). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a film which can form a film having a low relative dielectric constant and exhibiting excellent chemical resistance. SOLUTION: The composition for forming the film comprises a hydrolyzate condensate (I) obtained by hydrolytically condensing (A) at least one silane compound, selected from among a compound (A-1) represented by general formula (1): R a Si(OR 1 ) 4-a , a compound (A-2) represented by general formula (2): Si(OR 2 ) 4 and a compound (A-3) represented by general formula (3): R 3 b (R 4 O) 3-b Si-(R 7 ) d -Si(OR 5 ) 3-c R 6 c , and (B) a cyclic silane compound represented by general formula (4), a compound (II) which is compatible with or dispersible in the hydrolyzate condensate (I) and has a boiling point or a decomposition temperature of 200-400°C, and an organic solvent (III). COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming composition which has a low permittivity and is excellent in surface flatness and improved in moisture absorption and useful for an interlayer insulation film in a semiconductor device or the like. SOLUTION: The film-forming composition contains (A) a hydrolysis condensation product obtained by hydrolyzing and condensating at least one kind of silane compound selected from the group consisting of a compound expressed by general formula (1), a compound expressed by general formula (2) and a compound expressed by general formula (3) in the presence of an acidic or a basic catalyst or a metal chelate compound, (B) a (meth)acrylic copolymer obtained by polymerizing a compound which is expressed by general formulas (4) and (5) and miscible with or dispersible in component (A) and (C) an organic solvent. R a Si(OR 1 ) 4-a (1), Si(OR 2 ) 4 (2), R 3 (3), CH 2 =CR 8 COOR 9 (4), CH 2 =CR 10 COOR 11 (5). COPYRIGHT: (C)2005,JPO&NCIPI