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1.发明申请RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT 审中-公开辐射加热电路板，具有该辐射加热装置的发热装置包装以及背光单元
公开(公告)号：WO2012047002A2
公开(公告)日：2012-04-12
申请号：PCT/KR2011/007337
申请日：2011-10-05
Applicant: LG INNOTEK CO., LTD. , PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
Inventor： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC classification number: H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
Abstract translation: 提供了一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括：金属板，该金属板包括集成金属突起，多个发热器件附接到金属突起;暴露集成金属突起的绝缘层，绝缘层设置在金属板上;以及多个电极焊盘 设置在所述绝缘层上，所述多个电极垫向每个所述发热器件施加电压。 因此，辐射投影可以设置在发热设备之间以改善热辐射。
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公开(公告)号：WO2012087058A2
公开(公告)日：2012-06-28
申请号：PCT/KR2011/010024
申请日：2011-12-23
Applicant: LG INNOTEK CO., LTD. , LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
CPC classification number: H05K1/0298 , H05K3/064 , H05K3/388 , H05K3/428 , H05K3/4647 , H05K3/4652 , H05K3/4682 , H05K2201/0341 , H05K2203/0376
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述通孔包括第一部分，在所述第一部分下方的第二部分，在所述第一部分和所述第二部分之间的第三部分以及包括与所述第一部分至第三部分中的金属不同的金属的至少一个阻挡层。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。
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3.发明申请RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 审中-公开辐射热管电路板，制造该电路板的方法，具有该电路板的热生成装置包装以及背光
公开(公告)号：WO2012050333A2
公开(公告)日：2012-04-19
申请号：PCT/KR2011/007494
申请日：2011-10-10
Applicant: LG INNOTEK CO., LTD. , PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
Inventor： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC classification number: H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
Abstract translation: 提供了一种用于安装多个发热装置的辐射热电路板。 该辐射热电路板包括金属板，该金属板包括集成金属突起，该多个发热器件附接到集成金属突起，暴露该集成金属突起的绝缘构件，该绝缘构件包括设置在该金属板上的多个绝缘层，以及 设置在绝缘构件上的第一和第二电极焊盘，设置的第一和第二电极焊盘彼此电隔离。 第一电极焊盘和第二电极焊盘从设置在绝缘构件的彼此不同的绝缘层上的电路布线接收电压。 因此，辐射投影可以设置在发热设备之间以改善热辐射。
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公开(公告)号：WO2012011701A2
公开(公告)日：2012-01-26
申请号：PCT/KR2011/005218
申请日：2011-07-15
Applicant: LG INNOTEK CO., LTD. , AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
Inventor： AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
CPC classification number: H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
Abstract translation: 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，金属板包括具有焊料的金属突起，发热器件附着到金属突起，金属突起上的接合层，金属突起上的绝缘层 暴露金属突起的金属板以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，从发热装置发出的热量直接传递到金属板，从而提高散热效率。 散热突起的表面镀有包含铜的合金，从而改善了与焊料的粘附性，从而降低了故障率。
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5.发明申请ELECTRODE MATERIAL FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE COMPRISING THE SAME 审中-公开用于电子设备的电极材料和包含该电极的电子器件
公开(公告)号：WO2016153284A1
公开(公告)日：2016-09-29
申请号：PCT/KR2016/002978
申请日：2016-03-24
Applicant: LG INNOTEK CO., LTD.
Inventor： HONG, Seung Kwon , LEE, Hyuk Soo , CHO, In Hee , PARK, Hyun Gyu
Abstract: An electrode material according to one exemplary embodiment of the present invention includes a silicon carbide powder including mesopores having a diameter of 2 to 50 nm and micropores having a diameter of 2 nm or less.
Abstract translation: 根据本发明的一个示例性实施方案的电极材料包括包含直径为2至50nm的中孔的碳化硅粉末和直径为2nm或更小的微孔。
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Patent Agency Ranking
公开(公告)号：WO2012087060A2
公开(公告)日：2012-06-28
申请号：PCT/KR2011/010026
申请日：2011-12-23
Applicant: LG INNOTEK CO., LTD. , LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
CPC classification number: H05K1/0298 , H05K3/202 , H05K3/4647 , H05K3/465 , H05K3/4652 , H05K3/4682 , H05K2201/098 , H05K2203/0323 , H05K2203/0376
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述过孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。
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公开(公告)号：WO2010036051A3
公开(公告)日：2010-04-01
申请号：PCT/KR2009/005481
申请日：2009-09-25
Applicant: LG INNOTEK CO., LTD. , KIM, Ji Yun , SHIN, Hyun Sub , LEE, Sung Won , LEE, Hyung Eui , SEO, Yeong Uk , RYU, Sung Wuk , LEE, Hyuk Soo
Inventor： KIM, Ji Yun , SHIN, Hyun Sub , LEE, Sung Won , LEE, Hyung Eui , SEO, Yeong Uk , RYU, Sung Wuk , LEE, Hyuk Soo
IPC: H01L23/495 , H01L21/60
Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
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8.发明申请HEAT RADIATION PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE 审中-公开热辐射印刷电路板，其制造方法，包括其的背光单元和液晶显示装置
公开(公告)号：WO2013094950A1
公开(公告)日：2013-06-27
申请号：PCT/KR2012/011019
申请日：2012-12-17
Applicant: LG INNOTEK CO., LTD.
Inventor： PARK, Hyun Gyu , CHO, In Hee , HONG, Seung Kwon , KIM, Min Jae , LEE, Hyuk Soo
IPC: H05K7/20 , H05K1/02 , G02F1/13357
CPC classification number: H05K1/028 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F2001/133628 , H01L25/0753 , H01L33/641 , H01L33/642 , H01L2224/73204 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/056 , H05K1/09 , H05K2201/10106 , H05K2201/10136 , H05K2203/302 , H01L2924/00
Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.
Abstract translation: 本发明提供一种散热印刷电路板及其制造方法，其特征在于，通过以下方法制造所述散热印刷电路板：在第一区域形成具有绝缘层，电路图案和阻焊剂的电路层 金属基板的一个表面; 并且在不形成绝缘层的第二区域中形成弯曲部分，通过弯曲金属基板，从而可以预先防止在绝缘层中产生裂缝，并且印制的热辐射的耐久性和可靠性 可以提高电路板和使用其的背光单元。
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公开(公告)号：WO2013002611A9
公开(公告)日：2013-01-03
申请号：PCT/KR2012/005203
申请日：2012-06-29
Applicant: LG INNOTEK CO., LTD. , PARK, Joo Hyang , KIM, Min Jae , PARK, Hyun Gyu , LEE, Hyuk Soo , CHO, In Hee , HONG, Seung Kwon
Inventor： PARK, Joo Hyang , KIM, Min Jae , PARK, Hyun Gyu , LEE, Hyuk Soo , CHO, In Hee , HONG, Seung Kwon
IPC: G02F1/1333
Abstract: Disclosed is a radiant heat circuit board mounted in a chassis providing a light guide passage of a backlight unit. The radiant heat circuit board includes a first region on which a heat generating element is mounted and a second region bent with respect to the first region, in which a bottom surface of the second region is bonded to the radiant heat adhesion layer to make contact with the bottom surface of the chassis. The radiant heat circuit board is bent to have an angle equal to or greater than 90 so that a mask is easily formed during a solder paste coating procedure, and a length of the radiant heat circuit board is extended so that thermal radiation is improved.
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公开(公告)号：WO2012087059A3
公开(公告)日：2012-06-28
申请号：PCT/KR2011/010025
申请日：2011-12-23
Applicant: LG INNOTEK CO., LTD. , LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
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