公开(公告)号：JP2008244174A

公开(公告)日：2008-10-09

申请号：JP2007083023

申请日：2007-03-27

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： BABA TORU ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  MIYAJIMA HISAKAZU ,  OKUTO TAKASHI ,  GOTO KOJI

IPC: H01L29/84 ,  B81C3/00 ,  G01P15/08

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a sensor element capable of improving a manufacturing yield of the sensor element having a small amount of residual stress in a sensor substrate and desired sensor characteristics. SOLUTION: The method includes: an activation process for cleaning and activating respective junction surfaces between the sensor substrate 1 and respective package substrates 2, 3; and a joining process for joining the sensor substrate 1 to the respective package substrates 2, 3 for after the activation process while joining surfaces abut on each other. In the junction process, the sensor substrate 1 is joined to the second packages substrate 3 by the room-temperature joining of one set of combinations selected from the groups of Si-Si, Si-SiO 2 , SiO 2 -SiO 2 , Si-Si 3 N 4 , Si 3 N 4 -Si 3 N 4 , and SiO 2 -Si 3 N 4 . After that, a first metal layer 19 for the electric connection of the sensor substrate 1 is joined to a second metal layer 29 for the electric connection of the first package substrate 2 at ordinary temperatures, and metal layers 18, 28 for sealing the sensor substrate 1 and the first package substrate 2 are joined at ordinary temperatures. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造传感器元件的方法，该传感器元件能够提高传感器基板中具有少量残余应力的传感器元件的制造成品率和期望的传感器特性。 解决方案：该方法包括：用于清洁和激活传感器基板1和各个封装基板2,3之间的各个接合面的激活过程; 以及用于在激活过程之后将传感器基板1连接到各个封装基板2,3的接合工艺，同时接合表面彼此邻接。 在接合处理中，传感器基板1通过室温接合从Si-Si，Si-SiO 2 ，SiO S 2 SiO 2，SB-3，Si-Si 3 SB 3，N 3 SB 3， S 3 3 3 3 3 SB> 4 。 之后，用于传感器基板1的电连接的第一金属层19接合到用于在常温下电连接第一封装基板2的第二金属层29和用于密封传感器基板的金属层18,28 1和第一封装基板2在常温下接合。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008241482A

公开(公告)日：2008-10-09

申请号：JP2007083044

申请日：2007-03-27

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： OKUTO TAKASHI ,  GOTO KOJI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  BABA TORU ,  MIYAJIMA HISAKAZU

IPC: G01P15/08 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a sensor device capable of enhancing the flexibility of a lay-out of pad electrodes for connecting an external circuit, while reducing a size, and capable of reducing a residual stress in a sensor substrate. SOLUTION: The sensor substrate 1 is formed with the first sealing metal layer 18 and the first electric connecting metal layer 19. A displacement recess 21 is formed to allow a displacement of a movable part of a sensing part Ds in the sensor substrate 1, on one face of an electrode forming substrate 2, the second sealing metal layer 28 bonded at ambient temperature to the first sealing metal layer 18, and the second electric connecting metal layer 29 bonded at ambient temperature to the first electric connecting metal layer 19 are arranged in the periphery of the displacement recess 21, and the pad electrodes 25 are arranged on the other face of the electrode forming substrate 2. Respective through hole wires 24 are formed in portions corresponding to the respective pad electrodes 25, one end of at least one part of the through hole wires 24 is positioned on an inner bottom face of the displacement recess 21, and the one end is connected to the second electric connecting metal layer 29 by an intermediate wire 26. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种传感器装置，能够增加用于连接外部电路的焊盘电极布置的灵活性，同时减小尺寸，并且能够减小传感器基板中的残余应力。 传感器基板1形成有第一密封金属层18和第一电连接金属层19.形成位移凹部21以允许传感器基板中的感测部分Ds的可动部分的位移 如图1所示，在电极形成基板2的一个面上，在环境温度下与第一密封金属层18接合的第二密封金属层28和在环境温度下接合到第一电连接金属层19的第二电连接金属层29 布置在位移​​凹部21的周边，并且焊盘电极25布置在电极形成基板2的另一个面上。各个通孔线24形成为与各个焊盘电极25对应的部分，一端 通孔线24的至少一部分位于移动凹部21的内底面上，一端与第二电连接金属层连接 r 29由中间线26。版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008157779A

公开(公告)日：2008-07-10

申请号：JP2006347475

申请日：2006-12-25

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： TAURA TAKUMI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  OKUTO TAKASHI ,  BABA TORU ,  SHIROISHI HISATOKU

IPC: G01P15/08 ,  G01C19/56 ,  G01C19/5783

Abstract: PROBLEM TO BE SOLVED: To prevent a sensor element from colliding with a recessed part bottom surface of an upper substrate, even when the recessed part bottom surface of the upper substrate is bent, and to stabilize operation of the sensor device. SOLUTION: This device has the upper substrate 6 having the recessed part, a lower substrate 1 for sealing airtightly the recessed part by being bonded to the upper substrate 6, and the sensor element 4 mounted on the lower substrate 1 and stored in the recessed part sealed airtightly. The sensor element 4 has a movable part 4a movable in a domain between itself and the recessed part bottom surface; and a frame 4b fixed to the lower substrate 1, for supporting the movable part 4a by surrounding the side face of the movable part 4a, and has a characteristic wherein a stopper part 7a for restricting bending of the recessed part bottom surface to the movable part 4a side is formed between a part facing to the frame 4b of the recessed part bottom surface and the frame 4b. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了防止传感器元件与上基板的凹部底面碰撞，即使当上基板的凹部底面弯曲并且稳定传感器装置的操作时。 解决方案：该装置具有具有凹部的上基板6，用于通过粘合到上基板6而将凹部密封地密封的下基板1和安装在下基板1上的传感器元件4并存储在 凹陷部分密封密封。 传感器元件4具有可在其自身与凹部底面之间的区域中移动的可动部4a​​; 以及固定到下基板1的框架4b，用于通过围绕可动部分4a的侧面来支撑可移动部分4a，并且具有这样的特征，其中，限制部分7a限制凹部底面向可动部分弯曲 4a侧形成在面向凹部底面的框架4b的部分与框架4b之间。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008008672A

公开(公告)日：2008-01-17

申请号：JP2006177059

申请日：2006-06-27

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： SHIROISHI HISATOKU ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  OKUTO TAKASHI ,  KAMAKURA MASANAO ,  BABA TORU ,  TAURA TAKUMI ,  TOMOIDA AKIRA

IPC: G01P15/12 ,  G01P15/18 ,  G01P21/00 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide an acceleration sensor capable of easily recognizing operation in each of a plurality of directions where the acceleration can be detected.
SOLUTION: The acceleration sensor comprises a sensor substrate 1 that has gauge resistors Rx1-Rx4, Ry1-Ry4 and Rz1-Rz4 disposed in a movable section formed of a weight section 12 and four bending sections 13 and can detect accelerations in three directions, a first cover substrate 2 joined to one surface side of the sensor substrate 1, and a second cover substrate 3 joined to the other surface side of the sensor substrate 1. A package is constituted by the cover substrates 2 and 3 and a frame section 11 of the sensor substrate 1. The acceleration sensor has, as a driving means for operation recognition for forcibly moving the movable section with an electrostatic force, a plurality of pairs of movable electrodes 15 disposed in the weight section 12 and fixed electrodes 26 that are disposed on the first cover substrate 2 and face the movable electrodes 15, and can apply driving voltage for operation recognition independently every pair of movable electrode 15 and fixed electrode 26.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供能够容易地识别可以检测加速度的多个方向中的每一个方向上的操作的加速度传感器。 解决方案：加速度传感器包括传感器基板1，该传感器基板1设置在由重量部分12和四个弯曲部分13形成的可移动部分中的测量电阻器Rx1-Rx4，Ry1-Ry4和Rz1-Rz4，并且可以检测三个加速度部分 连接到传感器基板1的一个表面侧的第一覆盖基板2和与传感器基板1的另一个表面侧接合的第二盖基板3.封装由盖基板2和3以及框架 传感器基板1的第11部分。加速度传感器作为用于以静电力强制移动可动部分的操作识别的驱动装置，设置在重物部分12中的多对可动电极15和固定电极26， 设置在第一覆盖基板2上并面对可动电极15，并且可以独立地对每对可动电极15和固定电极26施加用于操作识别的驱动电压。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007266318A

公开(公告)日：2007-10-11

申请号：JP2006089583

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： OKUTO TAKASHI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  BABA TORU ,  GOTO KOJI ,  MIYAJIMA HISAKAZU

IPC: H01L23/02 ,  B81B7/02 ,  G01C19/56 ,  G01P15/08 ,  G01P15/12 ,  G01P15/18 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a sensor device capable of improving the yield of a process for joining a sensor substrate and a substrate for packages, and preventing the disconnection of pull-out wiring for electrically connecting the pad of an IC and a metal layer for electrical connection in the sensor substrate; and to provide a manufacturing method of the sensor device. SOLUTION: In the sensor substrate 1 and the first substrate 2 for packages, the metal layers 18, 28 for sealing and the metal layers 19, 29 for electrical connection are joined directly. A step is formed between a first region in which the pad 42 of the IC E2 is formed, and a second region in which the first metal layer 19 for electrical connection and the first metal layer 18 for sealing are formed in a protective insulating layer 40 on the sensor substrate 1. The film thickness of the pull-out wiring 43 formed along the surface of a protective insulating layer 40 and that of the first metal layer 18 for sealing and the first metal layer 19 for electrical connection are set independently, so that the pad 42 of the IC E2 is electrically connected to the first metal layer 19 for electrical connection. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 解决的问题：提供一种传感器装置，其能够提高用于接合传感器基板和封装用基板的处理的成品率，并且防止用于电连接IC的焊盘的拉出布线的断开，以及 在传感器基板中用于电连接的金属层; 并提供传感器装置的制造方法。 解决方案：在用于封装的传感器基板1和第一基板2中，用于密封的金属层18,28和用于电连接的金属层19,29被直接接合。 在其中形成有IC E2的焊盘42的第一区域和其中用于电连接的第一金属层19和用于密封的第一金属层18形成在保护绝缘层40中的第二区域之间形成台阶 在保护绝缘层40的表面形成的拉出布线43的膜厚以及用于密封的第一金属层18和用于电连接的第一金属层19的膜厚独立地设定，因此 IC E2的焊盘42电连接到第一金属层19用于电连接。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007263766A

公开(公告)日：2007-10-11

申请号：JP2006089584

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： SAIJO TAKASHI ,  KATAOKA KAZUSHI ,  OKUTO TAKASHI ,  BABA TORU ,  GOTO KOJI ,  MIYAJIMA HISAKAZU

IPC: G01P15/08 ,  B81B7/02 ,  G01P15/12 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a sensor device of which the height can be decreased by regulating the travel of a movable section by a package and performing flip-chip packaging.
SOLUTION: A sensor chip 1 is formed on a semiconductor substrate, and has a sensing section Ds and an electrode 19. The sensing section Ds has a mass body 12 and a deflection section 13 allowed to be deflected in the thickness direction of the sensor chip 1. The sensor chip 1 is stored in a package comprising an electrode formation substrate 2 and a cover substrate 3, and a bump 21 is formed on one surface that opposes the sensor chip 1 on the inner surface of the package. The bump 21 is used for performing the flip-chip packaging of the sensor chip 1, and the projection dimensions of the bump 21 are set so that they permit the displacement of the mass body 12 and regulate the amount of displacement in the mass body 12. Therefore, the electrode formation substrate 2 functions as a stopper for regulating the travel of the mass body 12.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种传感器装置，其可以通过通过封装调节可移动部分的行程并执行倒装芯片封装来降低高度。 解决方案：传感器芯片1形成在半导体衬底上，并且具有感测部分Ds和电极19.感测部分Ds具有质量体12和允许偏转部分13沿厚度方向偏转的偏转部分13 传感器芯片1存储在包括电极形成基板2和盖基板3的封装中，并且在封装的内表面上与传感芯片1相对的一个表面上形成凸块21。 凸块21用于执行传感器芯片1的倒装芯片封装，并且凸起21的突出尺寸被设定为使得它们允许质量体12的位移并且调节质量体12中的位移量 因此，电极形成基板2用作用于调节质量体12的行进的止动件。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007263760A

公开(公告)日：2007-10-11

申请号：JP2006089554

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： GOTO KOJI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  OKUTO TAKASHI ,  BABA TORU ,  MIYAJIMA HISAKAZU

IPC: G01P15/08 ,  G01P15/12 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a sensor device capable of making the size compact by using a sensing part as a circuit part forming area. SOLUTION: A sensor substrate 1 is a semiconductor substrate and is provided with a support part 11 arranged with a connecting metal layer 19, serving as a connection part to an external circuit. The support part 11 is formed into a frame shape that surrounds the sensing part Ds. The sensing part Ds is provided with a mass body 12 displaced due to the action of acceleration, and the mass body 12 is connected continuously integrally to the support part 11 via a flexible deflection part 13. The resistance value of a piezoresistance provided in the deflection part 13 is changed, when the mass body 12 displaced, and the acceleration acting on the mass body 12 is found based thereon. One part of a circuit part D that is to be used for detecting the change in the resistance value of the piezoresistance is formed in the mass body 12. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够通过使用感测部件作为电路部件形成区域来使尺寸紧凑的传感器装置。 传感器基板1是半导体基板，并且设有支撑部分11，该支撑部分11布置有用作与外部电路的连接部分的连接金属层19。 支撑部11形成为围绕感测部Ds的框状。 传感部分Ds设置有由于加速度而移动的质量体12，并且质量体12经由柔性偏转部分13连续地一体地连接到支撑部分11.设置在偏转中的压阻的电阻值 当质量体12移动时，部分13被改变，并且基于此发现作用在质量体12上的加速度。 在质量体12中形成用于检测压阻电阻值的变化的电路部分D的一部分。（C）2008，JPO＆INPIT

公开(公告)号：JP2007194574A

公开(公告)日：2007-08-02

申请号：JP2006089636

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： BABA TORU ,  TAKEGAWA YOSHIYUKI ,  OKUTO TAKASHI ,  SUZUKI YUJI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  MIYAJIMA HISAKAZU ,  GOTO KOJI

IPC: H01L23/12 ,  B81B3/00 ,  G01P15/08 ,  G01P15/12 ,  G01P15/18 ,  H01L23/02 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L29/84

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wafer level package structure for realizing simplification of manufacturing processes, a decrease in temperature of processes, and improvement of yield of a joining process; and to provide a sensor element.
SOLUTION: The wafer level package structure 100 has a configuration in which bonding metal layers 18, 28 for sealing for the sensor wafer 10 and the first package wafer 20 and bonding metal layers 16, 23 for connection are directly joined. The metal layers 18, 28 and 19, 29 are each configured of a laminated film of a Ti film and an Au film on insulating films 16, 23. The sensor element is formed by dividing the wafer level package structure 100 into a desired predetermined size on the basis of the size of a sensor substrate (sensor body) 1 in the sensor wafer 10.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种晶片级封装结构，用于实现制造工艺的简化，工艺温度的降低和提高接合工艺的产量; 并提供传感器元件。 解决方案：晶片级封装结构100具有用于密封用于传感器晶片10和第一封装晶片20的接合金属层18,28以及用于连接的接合金属层16,23的结构。 金属层18,28和19,29各自由绝缘膜16,23上的Ti膜和Au膜的层压膜构成。传感器元件通过将晶片级封装结构100分割成期望的预定尺寸 基于传感器晶片10中的传感器基板（传感器体）1的尺寸。版权所有：（C）2007，JPO＆INPIT

公开(公告)号：JP2007194573A

公开(公告)日：2007-08-02

申请号：JP2006089590

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： TAKEGAWA YOSHIYUKI ,  OKUTO TAKASHI ,  BABA TORU ,  SUZUKI YUJI ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  GOTO KOJI ,  MIYAJIMA HISAKAZU

IPC: H01L23/12 ,  B81B3/00 ,  G01P15/08 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L29/84

CPC classification number: H01L2224/16

Abstract: PROBLEM TO BE SOLVED: To provide a sensor element and a wafer level package structure by which a manufacturing process can be simplified, a process temperature can be lowered, and a yield of a bonding process can be improved.
SOLUTION: A wafer level package structure 100 is constituted by directly bonding bonded metal layers 18, 28 for seal and bonded metal layers 19, 29 for connection, respectively. The structure comprises a sensor wafer 10 obtained by forming a plurality of sensor substrates (sensor main bodies) 1, and a first package wafer 20 obtained by forming a plurality of through-hole wiring formation substrates (substrate parts for first package) 2. Film thicknesses of each Au film for seal of the bonded metal layers 18, 28 for seal and each Au film for connection of the bonded metal layers 19, 29 for connection are set to 500 nm or less. A sensor element is formed by dividing the wafer level package structure 100 into a desired size defined based on a size of the sensor substrate 1.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供可以简化制造工艺的传感器元件和晶片级封装结构，可以降低工艺温度，并且可以提高接合工艺的产量。 解决方案：晶片级封装结构100通过分别直接接合用于密封的接合金属层18,28和用于连接的接合金属层19,29来构成。 该结构包括通过形成多个传感器基板（传感器主体）1而获得的传感器晶片10和通过形成多个通孔布线形成基板（第一封装的基板部件）而获得的第一封装晶片20. 2.膜 用于密封的接合金属层18,28的每个用于密封的Au膜的厚度和用于连接用于连接的接合金属层19,29的每个Au膜的厚度被设定为500nm以下。 通过将晶片级封装结构100划分成基于传感器基板1的尺寸限定的所需尺寸来形成传感器元件。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007173757A

公开(公告)日：2007-07-05

申请号：JP2006089635

申请日：2006-03-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： GOTO KOJI ,  MIYAJIMA HISAKAZU ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI ,  OKUTO TAKASHI ,  BABA TORU

IPC: H01L23/12 ,  G01P15/08 ,  G01P15/12 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a sensor element which is high in junction reliability for easily joining a sensor substrate and a through-hole wiring formation substrate. SOLUTION: The sensor element includes a sensor substrate 1 and a through-hole wiring formation substrate 2 sealed at one surface side of the sensor substrate 1 and a cover substrate 3 sealed at the other surface side. The sensor substrate 1 and the through-hole wiring formation substrate 2 are configured by joining a first junction metal layer 18 for sealing and a second junction metal layer 28 for sealing formed on their opposite faces, and joining a first junction metal layer 19 for connection and a second junction metal layer 29 for connection formed on their opposite faces. The through-hole wiring formation substrate 2 is configured by shifting the junction site with the first junction metal layer 19 for connection in the second junction metal layer 29 for connection from the connection site with a through-hole wiring 24 in the second junction metal layer 29 for connection. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种传感器元件，该传感器元件具有高的接合可靠性，用于容易地接合传感器基板和通孔布线形成基板。 传感器元件包括传感器基板1和密封在传感器基板1的一个表面侧的通孔布线形成基板2和在另一个表面侧密封的盖基板3。 传感器基板1和通孔布线形成基板2通过接合用于密封的第一接合金属层18和形成在其相对面上的用于密封的第二接合金属层28构成，并且连接用于连接的第一接合金属层19 以及用于连接的第二接合金属层29形成在其相对的面上。 通孔布线形成基板2通过将第一接合金属层19的连接部位与用于连接的第二接合金属层29的连接部位与第二接合金属层中的通孔布线24从连接位置移位而构成 29连接。 版权所有（C）2007，JPO＆INPIT