公开(公告)号：WO2016106269A1

公开(公告)日：2016-06-30

申请号：PCT/US2015/067257

申请日：2015-12-22

Applicant: MEDTRONIC, INC.

Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  H05K3/32 ,  H05K3/42

Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

Abstract translation: 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。

公开(公告)号：WO2017091432A1

公开(公告)日：2017-06-01

申请号：PCT/US2016/062445

申请日：2016-11-17

Applicant: MEDTRONIC, INC.

Inventor： DAY, John K. ,  RUBEN, David A. ,  SANDLIN, Michael S.

IPC: H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0306 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/10 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09036

Abstract: A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

Abstract translation: 提供了一种在玻璃中嵌入金属结构的器件。 该器件包括第一晶片，至少一个导电迹线，平坦化的绝缘层和第二晶片。 第一晶片具有至少一个填充有导电材料的第一晶片通孔。 该至少一个导电迹线形成在第一晶片上。 所述至少一个导电迹线经由填充有导电材料的至少一个第一晶片与所述至少一个第一晶片接触。 平坦化的绝缘层形成在第一晶片和至少一个导电迹线上。 平坦化的绝缘层还具有至少一个绝缘层通孔，其提供通向至少一个导电迹线的一部分的路径。 第二个晶圆粘接到平面化的绝缘层上。

公开(公告)号：WO2015054485A1

公开(公告)日：2015-04-16

申请号：PCT/US2014/059886

申请日：2014-10-09

Applicant: MEDTRONIC, INC.

Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

IPC: A61N1/375 ,  A61N1/05 ,  H01L23/057 ,  H05K5/00

CPC classification number: C03B23/20 ,  A61N1/3754 ,  A61N1/3756 ,  B81B2207/095 ,  B81C1/00301 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0095 ,  H01L2924/00

Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

Abstract translation: 玻璃晶片具有由晶片厚度分离的内表面和相对的外表面。 密封的导电馈通通过晶片从内表面延伸到相对的外表面。 馈通包括具有沿着内表面暴露的内表面的馈通构件，用于电耦合到电路。 馈通构件从内表面部分地延伸通过晶片厚度到密封地嵌入晶片内的面向外部的外表面。

公开(公告)号：WO2008134615A2

公开(公告)日：2008-11-06

申请号：PCT/US2008/061738

申请日：2008-04-28

Applicant: MEDTRONIC, INC. ,  RUBEN, David A.

Inventor： RUBEN, David A.

IPC: A61B5/02

CPC classification number: A61B5/0215 ,  A61B2562/028 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05672 ,  H01L2224/05679 ,  H01L2224/371 ,  H01L2224/37166 ,  H01L2224/37169 ,  H01L2224/37179 ,  H01L2224/37181 ,  H01L2224/37599 ,  H01L2224/45 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/01072 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.

Abstract translation: 本发明涉及用于可植入医疗装置的互连。 该互连包括衬垫和引入该衬垫上的第一层。 垫或第一层中的至少一个包括负热膨胀系数（CTE）材料。

公开(公告)号：WO2019182848A1

公开(公告)日：2019-09-26

申请号：PCT/US2019/022200

申请日：2019-03-14

Applicant: MEDTRONIC, INC.

Inventor： HE, Xiangnan ,  RUBEN, David A.

IPC: B23K26/122 ,  A61F2/82 ,  A61N1/04 ,  B23K26/12 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/352

Abstract: In some examples, a system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber may surround at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller may be configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

公开(公告)号：WO2016106274A1

公开(公告)日：2016-06-30

申请号：PCT/US2015/067262

申请日：2015-12-22

Applicant: MEDTRONIC, INC.

Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

IPC: A61N1/375

CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

Abstract translation: 公开了馈通组件的各种实施例以及形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 并且外部接触可以通过围绕通孔的键气密密封到非导电衬底的外表面。 在一个或多个实施方案中，该键可以是激光键。

公开(公告)号：WO2016106272A1

公开(公告)日：2016-06-30

申请号：PCT/US2015/067260

申请日：2015-12-22

Applicant: MEDTRONIC, INC.

Inventor： RUBEN, David A.

IPC: A61N1/375

CPC classification number: H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K7/06 ,  H05K2203/107

Abstract: Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

Abstract translation: 公开了密封封装的各种实施例和形成这种封装的方法。 在一个或多个实施例中，密封封装可以包括形成壳体的一部分的壳体和馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 此外，外部接触可以通过围绕通孔的激光键气密地密封到非导电衬底的外表面。

公开(公告)号：WO2022165296A1

公开(公告)日：2022-08-04

申请号：PCT/US2022/014483

申请日：2022-01-31

Applicant: MEDTRONIC, INC.

Inventor： FENNER, Andreas ,  RUBEN, David A. ,  RIES, Andrew J. ,  PATEL, Chetan

IPC: A61B5/0215

Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

公开(公告)号：WO2022165295A1

公开(公告)日：2022-08-04

申请号：PCT/US2022/014481

申请日：2022-01-31

Applicant: MEDTRONIC, INC.

Inventor： RUBEN, David A. ,  RIES, Andrew J. ,  SHAH, Pankti N. ,  HAMACK, Jason D.

IPC: A61N1/39 ,  A61N1/02 ,  H01R4/00 ,  H01R9/00 ,  H05K7/00 ,  B81B7/00 ,  A61N1/378 ,  A61N1/375 ,  A61N1/36

Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

公开(公告)号：WO2018106785A1

公开(公告)日：2018-06-14

申请号：PCT/US2017/064875

申请日：2017-12-06

Applicant: MEDTRONIC, INC.

Inventor： FENNER, Andreas ,  MARCKMANN, Jennifer Lorenz ,  RUBEN, David A. ,  WASSON, James R.

IPC: G21H1/06 ,  G21H1/12

Abstract: Various embodiments of a power source and a method of forming such power source are disclosed. The power source can include an enclosure, a substrate disposed within the enclosure, and radioactive material disposed within the substrate and adapted to emit radioactive particles. The power source can further include a diffusion barrier disposed over an outer surface of the substrate, and a carrier material disposed within the enclosure, where the carrier material includes an oxide material.