公开(公告)号：US12300964B2

公开(公告)日：2025-05-13

申请号：US18405337

申请日：2024-01-05

Applicant: Skorpios Technologies, Inc.

Inventor： Murtaza Askari ,  Stephen B. Krasulick ,  Majid Sodagar ,  John Zyskind

IPC: H01S5/022 ,  G02B6/13 ,  H01S5/02 ,  H01S5/028

Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.

公开(公告)号：US11901692B2

公开(公告)日：2024-02-13

申请号：US17541933

申请日：2021-12-03

Applicant: Skorpios Technologies, Inc.

Inventor： Murtaza Askari ,  Stephen B. Krasulick ,  Majid Sodagar ,  John Zyskind

IPC: H01S5/022 ,  H01S5/02 ,  H01S5/028 ,  G02B6/13

CPC classification number: H01S5/022 ,  G02B6/13 ,  H01S5/0202 ,  H01S5/028

Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.

公开(公告)号：US20230124445A1

公开(公告)日：2023-04-20

申请号：US17949022

申请日：2022-09-20

Applicant: Skorpios Technologies., Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/16 ,  H01L25/075 ,  H01L25/00

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US11249253B2

公开(公告)日：2022-02-15

申请号：US16239811

申请日：2019-01-04

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/38 ,  G02B6/00 ,  G02B6/27 ,  G02B6/26 ,  G02B5/30 ,  G02B6/126 ,  G02B6/10 ,  G02F1/00 ,  G02F1/09 ,  G02B6/12

Abstract: Photonic rotators integrated on a substrate are disclosed for manipulating light polarization.

公开(公告)号：US20200152615A1

公开(公告)日：2020-05-14

申请号：US16452212

申请日：2019-06-25

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/16 ,  H01L25/00 ,  H01S5/022 ,  H01S5/10 ,  H01L25/075 ,  G02B6/136 ,  G02B6/12 ,  G02B6/122

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US10330871B2

公开(公告)日：2019-06-25

申请号：US14996001

申请日：2016-01-14

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  Derek Van Orden ,  Stephen B. Krasulick

IPC: G02B6/42 ,  G02B6/28 ,  G02B6/122 ,  G02B6/14 ,  G02B6/26 ,  H01S5/026 ,  H01S5/30 ,  G02B6/12

Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

公开(公告)号：US20190170944A1

公开(公告)日：2019-06-06

申请号：US16171132

申请日：2018-10-25

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Stephen B. Krasulick ,  John Zyskind ,  Paveen Apiratikul ,  Luca Cafiero

IPC: G02B6/30

Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.

公开(公告)号：US10200131B2

公开(公告)日：2019-02-05

申请号：US15947555

申请日：2018-04-06

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/00 ,  H04B10/556 ,  H04B10/50 ,  H04L27/20 ,  H04J14/02 ,  H04B10/564 ,  H04B10/079 ,  H04J14/00

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

公开(公告)号：US09960854B2

公开(公告)日：2018-05-01

申请号：US15274714

申请日：2016-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/00 ,  H04B10/556 ,  H04L27/20 ,  H04B10/079 ,  H04B10/564 ,  H04J14/02 ,  H04B10/50 ,  H04J14/00

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

公开(公告)号：US09923105B2

公开(公告)日：2018-03-20

申请号：US14509975

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L31/0232 ,  H01S5/022 ,  H01S5/026 ,  H01S5/30 ,  H01S5/02

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.