公开(公告)号：JP2014048640A

公开(公告)日：2014-03-17

申请号：JP2012194258

申请日：2012-09-04

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU

IPC: G02B6/42

CPC classification number: G02B6/424 ,  G02B6/26 ,  G02B6/32 ,  G02B6/3861 ,  G02B6/4214 ,  G02B6/4239 ,  Y10T29/49826

Abstract: PROBLEM TO BE SOLVED: To provide a connector to which an optical fiber is more easily attachable, and a method of manufacturing the connector, as well as an optical communication system.SOLUTION: A connector includes: a fiber attachment path in which at least a part thereof has a height less than an outer diameter of an optical fiber; and a light-direction changing section provided at an end of the fiber attachment path.

Abstract translation: 要解决的问题：提供一种光纤更易于安装的连接器，以及一种制造连接器的方法以及光通信系统。一种连接器，包括：纤维连接路径，其中至少一个 其一部分的高度小于光纤的外径; 以及设置在光纤安装路径的端部的光方向改变部。

公开(公告)号：JP2013098063A

公开(公告)日：2013-05-20

申请号：JP2011240830

申请日：2011-11-02

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU ,  TOBA KAZUAKI ,  SANO KAZUKI ,  SUZUKI HIDEYUKI

IPC: H01R13/46

CPC classification number: G02B6/3817 ,  G02B6/32 ,  G02B6/3853 ,  G02B6/3885 ,  G02B6/3897 ,  H01R27/02

Abstract: PROBLEM TO BE SOLVED: To provide a connector and an electronic device, having an optical transmission function and capable of attaching to an electronic device (connector) having only an existing electrical transmission function.SOLUTION: The connector comprises: an electrical transmission part 11; an optical transmission part 21 adjacent to the electrical transmission part 11; and a partition part 10U provided between the electrical transmission part 11 and the optical transmission part 21.

Abstract translation: 要解决的问题：提供具有光传输功能并能够附接到仅具有现有电传输功能的电子设备（连接器）的连接器和电子设备。

解决方案：连接器包括：电气传输部分11; 邻近电气传输部分11的光传输部分21; 以及设置在电气传输部分11和光传输部分21之间的分隔部分10U。版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012227514A

公开(公告)日：2012-11-15

申请号：JP2012031853

申请日：2012-02-16

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU

IPC: H01L33/58 ,  F21S2/00 ,  F21Y101/02 ,  G09F9/30 ,  G09F9/33 ,  H01L33/62

CPC classification number: G09G3/3208 ,  H01L25/0753 ,  H01L2224/73204

Abstract: PROBLEM TO BE SOLVED: To provide a pixel chip capable of preventing erroneous activation of light-emitting device, a display panel and an illumination panel including such pixel chip as pixel, a display device including such display panel, and an illumination device including such illumination panel.SOLUTION: The pixel chip includes one or plural light-emitting devices; a driver IC that drives the light-emitting device; a connecting part disposed between the light-emitting device and the driver IC; and a light shielding part. The connecting part electrically connects the light-emitting device and the driver IC to each other. The light shielding part shields the driver IC from the light emitted from the light-emitting device to directly enter into the driver IC together with the connecting part.

Abstract translation: 要解决的问题：提供一种能够防止发光装置，显示面板和包括像素这样的像素芯片的照明面板的错误激活的像素芯片，包括这种显示面板的显示装置和照明装置 包括这种照明面板。 像素芯片包括一个或多个发光器件; 用于驱动发光装置的驱动器IC; 设置在所述发光装置和所述驱动器IC之间的连接部; 和遮光部。 连接部将发光装置与驱动器IC电连接。 遮光部将驱动IC与发光装置发出的光屏蔽起来，与连接部一起直接进入驱动IC。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010123780A

公开(公告)日：2010-06-03

申请号：JP2008296512

申请日：2008-11-20

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU ,  AOYANAGI TETSUTOSHI ,  TOMOTA KATSUHIRO

IPC: H01L23/12 ,  H01L21/52 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/20 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29298 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: PROBLEM TO BE SOLVED: To provide a mounting substrate on which each chip is fixed on a predetermined position of the substrate at high positional accuracy. SOLUTION: Each solder wettable pattern 21a of a planar shape obtained by radially protruding protrusions from a center of the mounting substrate 1 is formed on the mounting substrate 1, a solder pattern 23a having substantially the same planar shape as the solder wettable pattern is selectively formed on the solder wettable pattern and the solder pattern is depressed to flatten the surface of the solder pattern. Then, a chip-like light-emitting device 10 is mounted on the surface-flattened solder pattern. Then, when the solder pattern is reflowed, the chip-like light-emitting device is moved and fixed to the center like self alignment by surface tension of a solder material. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种安装基板，其中每个芯片以高位置精度固定在基板的预定位置上。 解决方案：通过从安装基板1的中心径向突出的凸起获得的平面形状的每个焊料可湿性图案21a形成在安装基板1上，具有与焊料可润湿图案基本相同的平面形状的焊料图案23a 被选择性地形成在焊料可润湿图案上，并且焊接图案被压下以使焊料图案的表面变平。 然后，在表面平坦的焊料图案上安装芯片状发光器件10。 然后，当焊料图案被回流时，芯片状发光器件通过焊料材料的表面张力移动并固定到中心像自对准。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2006259682A

公开(公告)日：2006-09-28

申请号：JP2005285149

申请日：2005-09-29

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU

IPC: G02B6/42 ,  G02B6/122 ,  H01L31/0232 ,  H01L33/58

Abstract: PROBLEM TO BE SOLVED: To provide a composite photoelectric device capable of enhancing the relative positioning precision between an interposer and an optical waveguide with respect to an optical coupling method based on an IC socket. SOLUTION: The interposers 106a and 106b, on the back surfaces of which optical elements (a light emitting element array 107 and a light receiving element array 108) are mounted, are fixed on protruded surfaces of the IC sockets 102a and 102b mounted on a substrate 101. The end parts of an optical waveguide array 103 are disposed on grooved recesses 102d of the IC sockets 102a, 102b so as to face the optical elements. The positioning of the interposers and the optical waveguide array is performed by inserting positioning pins 111 of the interposer into positioning holes 112 of the the optical waveguide array 103. The interposer and the optical waveguide array are directly connected by the positioning pins. Accordingly, the relative positioning precision between the interposer and the optical waveguide array can be enhanced. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够相对于基于IC插座的光耦合方法提高插入器和光波导之间的相对定位精度的复合光电装置。 解决方案：安装有光学元件（发光元件阵列107和光接收元件阵列108）的背面上的内插器106a和106b固定在安装在IC插座102a和102b的突出表面上 在基板101上。光波导阵列103的端部设置在IC插座102a，102b的凹槽102d上，以面向光学元件。 插入器和光波导阵列的定位通过将插入件的定位销111插入到光波导阵列103的定位孔112中来进行。插入器和光波导阵列通过定位销直接连接。 因此，可以提高插入器与光波导阵列之间的相对定位精度。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005201937A

公开(公告)日：2005-07-28

申请号：JP2004005132

申请日：2004-01-13

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU

IPC: G02B6/42 ,  B29C33/38 ,  B29L11/00 ,  G02B6/122 ,  G02B6/13

Abstract: PROBLEM TO BE SOLVED: To provide an optical waveguide array which has such a structure that the size of cross-section of a light guide, for example, a core in a light incident end surface and a pitch between the light incident end surfaces adjacent to each other is not limited by a pitch between light waveguides and permits the high density integration based on the narrow-pitch formation between the light waveguides, and to provide a manufacturing method capable of mass-production of the optical waveguide array at a high yield and at a low cost. SOLUTION: In the optical waveguide array 10A, a plurality of optical waveguides 2 are juxtaposed, the light incident end surface 3 and a light outgoing end surface 4 are formed on both ends of the optical waveguides 2 as 45° inclined reflective surfaces and a light emitting element 5 and a light receiving element 7 are respectively arranged oppositely to them. Therein, both ends of respective optical waveguides 2 are shifted and arranged in the length direction, the optical guides 2a, 2b of which the waveguiding directions of light are reverse to each other are alternately arranged and, by utilizing a space resultantly formed, the width of the light waveguides (light guide) 2 of a light incident part 9 is enlarged toward the light incident end surface 3. The optical waveguide array is manufactured by injection molding etc. using a die. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种光波导阵列，其具有如下结构：导光体的横截面尺寸例如光入射端面中的芯和光入射端之间的间距 彼此相邻的表面不受光波导之间的间距的限制，并且允许基于光波导之间的窄间距形成的高密度积分，并且提供能够在一个或多个光波导阵列上批量生产光波导阵列的制造方法 高产量和低成本。 解决方案：在光波导阵列10A中，多个光波导2并置，光入射端面3和光出射端面4形成在光波导2的两端，为45°的倾斜反射面 并且发光元件5和光接收元件7分别与它们相对地布置。 其中，各光波导2的两端沿长度方向移位配置，其波导方向相反的光导2a，2b交替排列，通过利用形成的空间， 的光入射部分9的光波导（光导）2朝向光入射端面3扩大。光波导阵列通过使用模具的注射成型等来制造。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005181645A

公开(公告)日：2005-07-07

申请号：JP2003421788

申请日：2003-12-19

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/13

Abstract: PROBLEM TO BE SOLVED: To provide an optical waveguide capable of effectively coupling outgoing light from a light source, a method for manufacturing this optical waveguide easily at a low cost with high productivity, and to provide an optical information processor using this optical waveguide. SOLUTION: The optical waveguide 1 consists of a cemented body of a clad layer 2 and a core layer 4, and is constituted so that the light is made incident to the core layer 4 through the clad layer 2, and a light condensing means 7 is formed integrally with the clad layer 2 at a position corresponding to a light incident part 5 to the core layer 4. The method for manufacturing the optical waveguide 1 includes a process for molding the light condensing means 7 integrally with the clad layer 2 at the position corresponding to the light incident part 5 to the core layer 5, and a process for cementing the clad layer 2 to the core layer 4 on the surface opposite to the light condensing means 7. The optical information processor has: the optical waveguide 1 of this invention; a light incident means 81 for making the light incident to the core layer 4 of the optical waveguide 1; and a light receiving means 91 for receiving the outgoing light from the core layer 4. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够有效地耦合来自光源的出射光的光波导，以高生产率容易地以低成本制造该光波导的方法，并且提供使用该光学的光信息处理器 波导。 解决方案：光波导1由包覆层2和芯层4的粘结体构成，并且被构成为使得光通过包覆层2入射到芯层4，并且聚光 在与核心层4的光入射部分5对应的位置处，与包覆层2一体形成装置7.制造光波导路1的方法包括与聚光装置7一体地模制包层2的工艺 在与核心层5的光入射部5对应的位置，以及在与聚光装置7相反的表面上将包覆层2固定到芯层4的工序。光信息处理器具有：光波导 1发明; 用于使光入射到光波导1的芯层4的光入射装置81; 以及用于接收来自芯层4的出射光的光接收装置91.版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004230505A

公开(公告)日：2004-08-19

申请号：JP2003021360

申请日：2003-01-30

Applicant: Sony Corp ,  ソニー株式会社

Inventor： SATO SHUZO ,  NOGAMI TAKESHI ,  KOMAI HISANORI ,  YASUDA YOSHIYA ,  OTORII SUGURU ,  TAKAHASHI SHINGO ,  HORIKOSHI HIROSHI ,  TAI KAORI

IPC: B23H5/08

Abstract: PROBLEM TO BE SOLVED: To provide a control method of an electrolytic polishing pad for certainly and favorably polishing an article even in a case of doing it in combination of CMP and electrolytic polishing. SOLUTION: This is the control method of the electrolytic polishing pad 3 used by being pressed and slid on the polishing article 1 and constituted to electrify an electrolytic electric current for electrolytic polishing in an electrolytic solution, and it detects lowering of a polishing rate of the electrolytic polishing pad 3 in accordance with a friction coefficient μ provided by monitoring or a change of electric resistance R by monitoring the friction coefficient μ between the polishing article 1 and the electrolytic polishing pad 3 or the electric resistance R at the time of the electrolytic polishing pad 3 electrifying the electrolytic electric current. Additionally, the polishing rate is recovered by a mechanical polishing process, a chemical polishing process or an electric polishing process applied on a surface of the electrolytic polishing pad 3 in case of detecting lowering of the polishing rate. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004198579A

公开(公告)日：2004-07-15

申请号：JP2002364841

申请日：2002-12-17

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OTORII SUGURU ,  NOGAMI TAKESHI ,  TAI KAORI ,  HORIKOSHI HIROSHI ,  TAKAHASHI SHINGO ,  SATO SHUZO

IPC: G02B6/42 ,  G02B6/122

Abstract: PROBLEM TO BE SOLVED: To provide an optical waveguide array and an optical element surface mounted device which can attain densification of optical waveguides while suppressing crosstalks by optical interferences and heat generation of the elements. SOLUTION: In an optical waveguide array 9, positions of light entering and outgoing parts 90a are formed by being shifted in a drawing direction between contiguous optical waveguides 90 and photoelectric conversion elements 71 are arranged corresponding to the light entering and outgoing parts 90a of respective optical waveguides 90. Then, even when spacing between respective optical waveguides 90 arranged in parallel is shortened, since positions of light entering and outgoing parts 90a are shifted in the drawing direction between contiguous optical waveguides 90, the arrangement spacing of the photoelectric conversion elements 71 is secured by this slippage. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2003326419A

公开(公告)日：2003-11-18

申请号：JP2002134621

申请日：2002-05-09

Applicant: Sony Corp ,  ソニー株式会社

Inventor： SATO SHUZO ,  NOGAMI TAKESHI ,  TAKAHASHI SHINGO ,  KOMAI HISANORI ,  TAI KAORI ,  HORIKOSHI HIROSHI ,  OTORII SUGURU

IPC: B23H5/08 ,  C25D7/12 ,  C25D17/10 ,  C25F7/00 ,  H01L21/288

Abstract: PROBLEM TO BE SOLVED: To effect electrolytic plating or electrolytic polishing by energizing in a state that current density distribution is brought into a stable and uniform state and enable manufacture of a semiconductor device by using other device than a conventional washing device and by a manufacture process flow. SOLUTION: An edge cover film 2 is formed throughout the whole periphery of an edge part 1a of a substrate 1. Electrical connection is effected on a seed film electrically connected to the edge cover film 2 from the outer periphery side of the substrate 1 through the edge cover film 2 and a Cu film is formed through electrolytic plating. Similarly, electrical connection is effected on a Cu film electrically connected to the edge film 2 through the edge cover film 2 from the outer periphery side of the substrate 1 and the Cu film is polished through electrolytic polishing. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：通过在电流密度分布达到稳定和均匀的状态下进行激励来进行电解电镀或电解抛光，并且可以通过使用除常规洗涤装置以外的其它装置来制造半导体器件，以及通过 制造工艺流程。 解决方案：边缘覆盖膜2形成在基板1的边缘部1a的整个周边上。电连接在从基板的外周侧电连接到边缘覆盖膜2的种子膜上进行 1通过边缘覆盖膜2形成，并且通过电解电镀形成Cu膜。 类似地，通过边缘覆盖膜2从基板1的外周侧与连接到边缘膜2的Cu膜进行电连接，并且通过电解抛光来抛光Cu膜。 版权所有（C）2004，JPO