Abstract:
PROBLEM TO BE SOLVED: To provide a non-volatile resistance change element having a highly reliable rectification function.SOLUTION: A non-volatile resistance change element includes: an upper electrode 1 including at least one of Ag, Ni, Co, Al, Zn, Ti and Cu; a lower electrode 2; a resistance change layer 3 sandwiched between the upper electrode 1 and the lower electrode 2; and a rectification function layer 4 arranged between the lower electrode 2 and the resistance change layer 3 and including an element constituting the resistance change layer 3 and at least one element of Ag, Ni and Co. The electrical resistance between the upper electrode 1 and the lower electrode 2 reversibly changes in accordance with a voltage applied between the upper electrode 1 and the lower electrode 2.
Abstract:
PROBLEM TO BE SOLVED: To reduce an operating voltage of a memory device in which amorphous silicon is used for a memory unit, and to form the memory device by a low-temperature process.SOLUTION: The memory device according to an embodiment comprises: a first electrode EL1 including a crystallized SiGe(0≤x
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which has small parasitic resistance of a source/drain region, and to provide a method of manufacturing the same. SOLUTION: The method of manufacturing the semiconductor device includes the steps of: forming a gate portion on an Si layer; introducing As into the Si layer located across the gate portion; depositing an Ni layer on the Si layer into which As is introduced; allowing the Ni layer to react with the Si layer using a heat treatment to form a first silicide layer and segregating As on the interface between the first silicide layer and Si layer; introducing Pt elements into the first silicide layer; and diffusing the Pt elements up to the Si layer by using a heat treatment to form a second silicide layer between the first silicide layer and Si layer and also segregating As on the interface of the second silicide layer and Si layer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a direct methanol fuel cell power generator capable of decreasing an imbalance in output every electromotive portion units and stably supplying fuel in the direct methanol fuel cell power generator composed of a plurality of electromotive portions. SOLUTION: The direct fuel cell power generator is equipped with at least two electromotive portion units 108a, 108b each including an anode having an anode catalyst layer, a cathode having a cathode catalyst layer, and electrolyte membrane disposed between the anode and the cathode; a fuel container housing fuel; and a fuel passage 103 for supplying fuel to the electromotive portion units 108a, 108b. In the power generator, the fuel passage 103 has a passage which produces flow-back again from the fuel container to the first electromotive portion unit via the first electromotive portion unit 108a and the second electromotive portion 108b, and which is not branched during the flow-back. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having a p-type MISFET or an n-type MISEFET and its manufacturing method, capable of reducing source-drain electrode interface resistance of the p-type MISFET or the n-type MISEFET. SOLUTION: The semiconductor device includes the p-type MISFET 200 on a semiconductor substrate 100. The p-type MISFET 200 includes a channel region 204 in the semiconductor substrate 100, a gate insulating film 206 formed on the channel region 204, a gate electrode 208 formed on the gate insulating film 206, source-drain electrodes which are silicide layers 210 containing Ni on both sides of the channel region 204, and interface layers 230 formed on a semiconductor substrate 100 side of an interface of the source-drain electrode and the semiconductor substrate 100, and containing Mg, Ca, or Ba. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a harmful substance removal filter for direct type liquid fuel batteries which cleanses harmful substances produced and ejected in power generation by a direct type liquid fuel battery generator, without increasing the output of an auxiliary apparatus of the direct type liquid fuel battery generator. SOLUTION: The harmful substance removal filter for direct type fuel battery generators is for removing harmful substances contained in ejected substances from electrodes, and is equipped with a liquid-gas separating member 5 for making gas components in the ejected substances penetrate selectively, and a catalyst portion 3 for oxidizing and burning the gas components having penetrated the separating member 5. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a direct methanol fuel cell system capable of supplying electric power to a load stably for a long period of time. SOLUTION: The direct methanol fuel cell system comprises a stack cell 11 for generating an electromotive force through a chemical reaction of methanol solution supplied to an anode side and air supplied to a cathode side, a mixing tank 14 for mixing methanol and water to generate methanol solution, a first liquid feeding pump 13 for feeding the methanol inside a fuel cartridge 12 to the mixing tank 14, a heat exchanger 20 for heating and supplying the methanol solution from the mixing tank 14 to the anode and for cooling the methanol solution discharged from the anode, a second liquid feeding pump 19 deployed between the mixing tank 14 and the heat exchanger 20, an air feeding pump 22 for discharging air from the cathode, and a cooler 15 for cooling the air discharged from the air feeding pump 22 to supply water to the mixing tank 14. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a portable terminal having a plurality of batteries, which improves energy efficiency by enabling a long time of driving while keeping the downsizing of a battery for driving itself. SOLUTION: A power source 101 and a power source 151 are independent batteries stored in the portable terminal 100. The battery 101 supplies voltage only to its first functional circuit 102 which requires temporally constant current consumption. Likewise, the battery 151 supplies voltage only to its second functional circuit 152 which requires temporally changing current consumption. For the battery 101, a battery suitable to a temporally large current output is used, and for the battery 151, a battery suitable to the output of a temporally changing current is used. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high performance semiconductor device, which forms an electrode by utilizing a reaction between fine metal particles and a semiconductor substrate, and to provide a high performance semiconductor device which has an electrode having a small grain particle size. SOLUTION: The method of manufacturing a semiconductor device includes: a step of applying a solution wherein fine metal particles having a diameter of ≤20 nm are dispersed in a solvent, onto the semiconductor substrate; a step of evaporating the solvent; and a step of forming a metal-semiconductor compound thin film on a surface of the semiconductor substrate by causing the reaction between the fine metal particles and the semiconductor substrate. The semiconductor substrate has the metal-semiconductor compound thin film on the semiconductor substrate, and the metal-semiconductor compound thin film is formed of single grains in a film thickness direction, and a particle size of the single grains is ≤40 nm. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device improved in performance by reduction in contact resistance of an electrode, and also to provide a semiconductor device. SOLUTION: The semiconductor device manufacturing method has steps of: forming a gate insulating film on a semiconductor substrate; forming a gate electrode on the gate insulating film; depositing a first metal on the semiconductor substrate; forming each metal semiconductor compound layer on each surface of the semiconductor substrate on both sides of the gate electrode by reacting the first metal with the semiconductor substrate by first heat treatment; implanting ions having a mass exceeding the atomic weight of Si into each metal semiconductor compound layer; depositing a second metal on each metal semiconductor compound layer; and diffusing the second metal throughout each metal semiconductor compound layer by second heat treatment so as to form an interface layer on the interface between each metal semiconductor compound layer and the semiconductor substrate by segregating the second metal. COPYRIGHT: (C)2009,JPO&INPIT