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    Device and method for forming conductive pattern on insulative planar substrate, insulative planar substrate and chipset therefor
    2.
    发明专利
    Device and method for forming conductive pattern on insulative planar substrate, insulative planar substrate and chipset therefor 审中-公开
    绝缘平板基板，绝缘平板基板及其基板上形成导电图案的装置及方法

    公开(公告)号：JP2014027323A

    公开(公告)日：2014-02-06

    申请号：JP2013232186

    申请日：2013-11-08

    Applicant: Stora Enso Oyj ,  ストラ エンソ オーワイジェイ

    Inventor： MAIJALA JUHA ,  PETRI SIRVIOE

    IPC: H05K3/12

    Abstract: PROBLEM TO BE SOLVED: To provide a device comprising at least one module configured to form such a predetermined pattern on an insulative planar substrate as to collect conductive particles in accordance with that pattern, a method, the insulative planar substrate and a chipset.SOLUTION: At least different one module is configured to transfer conductive particles to the insulative planar substrate and disposed to collect the conductive particles in accordance with the predetermined pattern. A sinter module is configured to fuse the conductive particles on the insulative planar substrate and disposed to form a conductive plane on the insulative planar substrate by fusing the conductive particles in accordance with the predetermined pattern. The embodiment of the present invention relates to printable electronics or printing electronics on a fiber web.

    Abstract translation: 要解决的问题：提供一种包括至少一个模块的装置，其被配置为在绝缘平面基板上形成这样的预定图案，以根据该图案收集导电颗粒，方法，绝缘平面基板和芯片组。解决方案： 至少不同的一个模块被配置为将导电颗粒转移到绝缘平面基板并且被设置成根据预定图案收集导电颗粒。 烧结模块被构造成将绝缘平面基板上的导电颗粒熔合并且通过根据预定图案融合导电颗粒而设置在绝缘平面基板上形成导电平面。 本发明的实施例涉及光纤网上的可印刷电子器件或印刷电子器件。

    Cup container made of a fiber-based material
    10.
    发明专利
    Cup container made of a fiber-based material 有权
    基于纤维的材料的杯式容器

    公开(公告)号：JP2012131572A

    公开(公告)日：2012-07-12

    申请号：JP2012045008

    申请日：2012-03-01

    Applicant: Stora Enso Oyj ,  ストラ エンソ オーワイジェイ

    Inventor： RAESAENEN JARI ,  KARINE SEPPO

    IPC: B65D77/20 ,  B65D20060101 ,  B65D3/06 ,  B65D3/26 ,  B65D21/02 ,  B65D41/32 ,  B65D43/02 ,  B65D77/32 ,  B65D81/24 ,  B65D85/72

    CPC classification number: B65D77/2056 ,  B65D3/06 ,  B65D77/32

    Abstract: PROBLEM TO BE SOLVED: To modify a cup container made of a fiber-based material such as packaging board, allowing the lid to be reliably heat-sealed to the mouth of the cup without jeopardizing the product to be contained.SOLUTION: The invention relates to a cup container made of a fiber-based material, such as polymer-coated packaging board, comprising a cup 1 containing a contained product 2 and a lid 6 closing the mouth of the cup. The cup 1 has a collar 5 bent downwardly from the mouth of the cup and diverging from the cup skirt 3, and the lid 6 has a rim 8 oriented accordingly downwardly from the collar, the lid being fixed in position by heat-sealing between the collar and rim parts. For opening the container, the lid 6 can be equipped with a tear strip 11 surrounding its rim 8. In addition, the lid 6 may be nested with the cup 1, so that compression and friction between their opposite surfaces retain the lid in position in the reclosed container.

    Abstract translation: 要解决的问题：为了修改由诸如包装板的纤维基材料制成的杯形容器，允许将盖子可靠地热封到杯子的口部，而不会危及要包含的产品。 解决方案：本发明涉及一种由诸如聚合物涂覆的包装板的纤维基材料制成的杯容器，其包括含有容纳产品2的杯1和封闭杯口的盖6。 杯子1具有从杯的口部向下弯曲并从杯状裙部3分叉的套环5，并且盖子6具有相对于套环相应地向下取向的边缘8，盖子通过热封 衣领和边缘部分。 为了打开容器，盖6可以装备有围绕其边缘8的撕裂条11.另外，盖6可以与杯1嵌套，使得它们的相对表面之间的压缩和摩擦将盖保持在适当的位置 重新关闭的集装箱。 版权所有（C）2012，JPO＆INPIT

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