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公开(公告)号:US20250169193A1
公开(公告)日:2025-05-22
申请号:US19032752
申请日:2025-01-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Henry Litzmann EDWARDS , Akram A. SALMAN , Binghua Hu
IPC: H10D89/60 , H01L21/265 , H01L21/762 , H01L21/763 , H10D62/10 , H10D62/17 , H10D84/01 , H10D84/03 , H10D84/40
Abstract: An ESD cell includes an n+ buried layer (NBL) within a p-epi layer on a substrate. An outer deep trench isolation ring (outer DT ring) includes dielectric sidewalls having a deep n-type diffusion (DEEPN diffusion) ring (DEEPN ring) contacting the dielectric sidewall extending downward to the NBL. The DEEPN ring defines an enclosed p-epi region. A plurality of inner DT structures are within the enclosed p-epi region having dielectric sidewalls and DEEPN diffusions contacting the dielectric sidewalls extending downward from the topside surface to the NBL. The inner DT structures have a sufficiently small spacing with one another so that adjacent DEEPN diffusion regions overlap to form continuous wall of n-type material extending from a first side to a second side of the outer DT ring dividing the enclosed p-epi region into a first and second p-epi region. The first and second p-epi region are connected by the NBL.
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公开(公告)号:US20250168406A1
公开(公告)日:2025-05-22
申请号:US19031743
申请日:2025-01-18
Applicant: Texas Instruments Incorporated
Inventor: Minhua Zhou
IPC: H04N19/61 , H04N19/119 , H04N19/124 , H04N19/13 , H04N19/15 , H04N19/157 , H04N19/172 , H04N19/174 , H04N19/176 , H04N19/184 , H04N19/463 , H04N19/625 , H04N19/86
Abstract: A method for encoding a picture of a video sequence in a bit stream that constrains slice header processing overhead is provided. The method includes computing a maximum slice rate for the video sequence, computing a maximum number of slices for the picture based on the maximum slice rate, and encoding the picture wherein a number of slices used to encode the picture is enforced to be no more than the maximum number of slices.
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公开(公告)号:US20250167800A1
公开(公告)日:2025-05-22
申请号:US19027257
申请日:2025-01-17
Applicant: Texas Instruments Incorporated
Inventor: Anil Mani , Sandeep Rao , Karthik Ramasubramanian
Abstract: A radar system is provided that includes a compression component configured to compress blocks of range values to generate compressed blocks of range values, and a radar data memory configured to store compressed blocks of range values generated by the compression component. In an example, the compression component parameter determination engine to determine a compression parameter for a type of compression to yield a compressed output of the block of range values that is less than or equal to a specified size. The compression parameter may be a scale factor, or may be a Golomb parameter and a scale factor, depending on the type of compression. The compression component further includes an encoder to compress, using the type of compression, the block of range values to generate a compressed block of range values based on the compression parameter.
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公开(公告)号:US20250165050A1
公开(公告)日:2025-05-22
申请号:US19033728
申请日:2025-01-22
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Mustafa Ulvi Erdogan , Suzanne Mary Vining , Bharath Kumar Singareddy , Douglas Edward Wente
IPC: G06F1/3215 , G06F1/3234 , G06F13/38 , G06F13/42
Abstract: High-speed data communication devices, e.g., repeaters, interfacing between a host and a peripheral operate such that high-speed components except for a host-side squelch detector are set or maintained in a deactivated state during an idle period of a micro frame. In an example, a start of a micro frame is detected on a data bus during a first time period. In a second time period after the first time period, the high-speed communication device determines whether at least one data packet is contained in the micro frame. When it is determined during the second time period that no data packet is contained in the micro frame, active components, except a squelch detector, are controlled to be inactive during a third time period after the second time period.
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公开(公告)号:US20250159167A1
公开(公告)日:2025-05-15
申请号:US19022947
申请日:2025-01-15
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Minhua Zhou , Mehmet Umut Demircin , Madhukar Budagavi
IPC: H04N19/124 , H04N19/117 , H04N19/13 , H04N19/15 , H04N19/159 , H04N19/167 , H04N19/172 , H04N19/176 , H04N19/184 , H04N19/196 , H04N19/43 , H04N19/463 , H04N19/60 , H04N19/61
Abstract: A method is provided that includes receiving a coded largest coding unit in a video decoder, wherein the coded largest coding unit includes a coded coding unit structure and a plurality of coded quantization parameters, and decoding the coded largest coding unit based on the coded coding unit structure and the plurality of coded quantization parameters.
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公开(公告)号:US20250158603A1
公开(公告)日:2025-05-15
申请号:US18508565
申请日:2023-11-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Anmol Sharma , Orlando Lazaro
Abstract: The techniques and circuits, described herein, include solutions for compensating for integrator drift. A drift compensation circuit has a first terminal coupled to an output of an integrator, and a second terminal coupled to an input of the integrator. The drift compensation circuit is configured to sense integrator drift at the output of the integrator, and provide a compensation signal to the input of the integrator based on the sensed drift. The input of the integrator may be coupled to an output of an additional integrator. By sensing the integrator drift at the end of the signal chain, and providing the compensation signal earlier in the signal chain, the compensation signal can compensate for integrator drift from multiple integrators in the system.
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公开(公告)号:US20250155327A1
公开(公告)日:2025-05-15
申请号:US18508889
申请日:2023-11-14
Applicant: Texas Instruments Incorporated
Inventor: Anand Kumar G , Veeramanikandan Raju
IPC: G01M99/00
Abstract: An example apparatus includes: interface circuitry; and diagnostic circuitry configured to: determine a set of signal chains that may be used by an application, a signal chain in the set to include an ordered sequence of one or more circuit modules; identify a first signal chain from the set that was used by the application; and run, in response to a determination that the circuit modules in the first signal chain are idle, a diagnostic test on the first signal chain.
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公开(公告)号:US12302007B2
公开(公告)日:2025-05-13
申请号:US18147964
申请日:2022-12-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Hrushikesh Garud , Rajasekhar Allu , Gang Hua , Jing-Fei Ren , Mayank Mangla , Niraj Nandan , Mihir Mody , Pandy Kalimuthu
IPC: H04N23/76 , H04N23/11 , H04N23/667 , H04N23/81 , H04N23/84
Abstract: A system is provided. The system generally includes a first processor configured to receive image input data from a red-green-blue infrared (RGBIR) sensor. The first processor of the system is configured to generate a first intermediate image data from the image input data. The system generally includes a second processor. The second processor of the system is configured to generate a second intermediate image data that includes red-green-blue (RGB) image data from the first intermediate image data, and to generate a third intermediate image data that includes infrared (IR) image data from the first intermediate image data. The system generally includes a third processor. The third processor of the system is configured to process the third intermediate image data. The system generally includes a fourth processor. The fourth processor of the system is configured to process the second image data.
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公开(公告)号:US12300678B2
公开(公告)日:2025-05-13
申请号:US18334317
申请日:2023-06-13
Applicant: Texas Instruments Incorporated
Inventor: Sreenivasan K. Koduri , Steven R. Tom , Paul Brohlin
IPC: H01L23/48 , H01L21/48 , H01L23/13 , H01L23/498 , H01L25/16 , H01L23/00 , H01L23/31 , H01L23/367 , H01L23/373
Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.
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公开(公告)号:US12298345B2
公开(公告)日:2025-05-13
申请号:US18171951
申请日:2023-02-21
Applicant: Texas Instruments Incorporated
Inventor: Brett Forejt , Hansheng Wang , Noah Robb
IPC: G01R31/317
Abstract: Low-frequency oscillator (LFO) monitoring circuits and methods. An example of an LFO monitoring circuit includes a resistor having first and second resistor terminals with the first resistor terminal coupled to a ground terminal, first and second transistors coupled between a supply voltage terminal and the second resistor terminal, the first transistor having a first control terminal and the second transistor having a second control terminal, a ramp generator having first and second outputs coupled to the first and second control terminals, respectively, and first and second inputs configured to receive, respectively, first and second signals representative of a frequency of a low-frequency oscillator, the ramp generator being configured to provide, at the first output, a first ramp signal based on the first signal and, at the second output, a second ramp signal based on the second signal, and a comparator having a comparator input coupled to the second resistor terminal.
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