公开(公告)号：US20220185946A1

公开(公告)日：2022-06-16

申请号：US17436498

申请日：2020-03-27

Applicant: ADEKA CORPORATION

Inventor： Shota KOBAYASHI ,  Ken-ichi TAMASO ,  Ryo OGAWA ,  Tamotsu NAGAMATSU

IPC: C08G59/24 ,  C08G59/40 ,  C08G59/56 ,  C08G59/66 ,  C08G59/68 ,  B29C71/02 ,  C08J7/12

Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

公开(公告)号：US20210380749A1

公开(公告)日：2021-12-09

申请号：US17288372

申请日：2019-11-07

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Masato INADOME ,  Yukako ISHIGAMI ,  Ryo OGAWA ,  Tamotsu NAGAMATSU

IPC: C08G18/00 ,  C08G18/48 ,  C09J175/08 ,  C08G18/10 ,  C08G18/28

Abstract: Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

公开(公告)号：US20190249047A1

公开(公告)日：2019-08-15

申请号：US16319352

申请日：2017-06-13

Applicant: ADEKA CORPORATION

Inventor： Mitsunori IDE ,  Keisuke OTA ,  Tamotsu NAGAMATSU

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08G18/58 ,  C08G18/80 ,  C08G59/14 ,  C08G59/20 ,  C09J11/06 ,  C09J175/04

Abstract: To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.