公开(公告)号：US20240314979A1

公开(公告)日：2024-09-19

申请号：US18182482

申请日：2023-03-13

Applicant: Delphi Technologies IP Limited

Inventor： Alexandre M. S. Reis ,  Bryan Alan Rohl ,  Thomas Alan Degenkolb

IPC: H05K7/20 ,  H01L23/367

CPC classification number: H05K7/20445 ,  H01L23/3675 ,  H05K7/209 ,  H01L25/115

Abstract: A power semiconductor package includes: a first power semiconductor; a cold plate including a floor and a first pedestal extending from the floor, wherein the first pedestal is configured to support the first power semiconductor; a thermal interface material configured to transfer heat from the first power semiconductor to the first pedestal of the cold plate; and a spacer including: a first frame configured to receive at least a portion of the first pedestal, and a second frame configured to receive the thermal interface material; wherein the spacer is configured to provide a uniform thickness of the thermal interface material between the first pedestal of the cold plate and the first power semiconductor.

公开(公告)号：US20240413551A1

公开(公告)日：2024-12-12

申请号：US18318503

申请日：2023-06-06

Applicant: Delphi Technologies IP Limited

Inventor： Alexandre M S Reis ,  Bryan Alan Rohl ,  Thomas Alan Degenkolb

IPC: H01R12/71 ,  H01R12/58 ,  H01R12/72

Abstract: A terminal for a printed circuit board includes a body and a plurality of leads extending from the body at an angle between 180 degrees and 90 degrees relative to a horizontal plane of the body, each lead of the plurality of leads being configured to: mate with a corresponding mounting locations on the printed circuit board; and receive current from at least one electrical component associate with the printed circuit board, wherein the current flows from the at least one electrical component via the plurality of leads to at least one other electrical component.