公开(公告)号：US20170271229A1

公开(公告)日：2017-09-21

申请号：US15462858

申请日：2017-03-19

Applicant: Infineon Technologies AG

Inventor： Norbert Joson SANTOS ,  Edward FUERGUT ,  Sanjay Kumar MURUGAN

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/3105 ,  H01L21/02 ,  H01L23/495 ,  H01L21/67 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L33/60 ,  H01L33/58 ,  H01L23/40 ,  H01L43/02 ,  H01L23/367

CPC classification number: H01L23/3114 ,  H01L21/0206 ,  H01L21/31058 ,  H01L21/565 ,  H01L21/67126 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L43/02 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.