公开(公告)号：US09765439B2

公开(公告)日：2017-09-19

申请号：US14499172

申请日：2014-09-27

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Mark E. Sprenger ,  Songnan Yang ,  Kwan Ho X. Lee

IPC: H01Q7/00 ,  C25D7/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/00 ,  H05K3/18 ,  C25D5/02 ,  C25D5/10 ,  C25D5/48

CPC classification number: C25D7/00 ,  C25D5/022 ,  C25D5/10 ,  C25D5/48 ,  H05K1/0284 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/18 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/0723

Abstract: In one example an electronic device comprises a controller and a chassis comprising a polymer layer, a first metallic layer deposited on a first side of the polymer layer, and a second metallic layer deposited on a second side of the polymer layer, wherein at least one of the first metallic layer or the second metallic layer comprises an electrically functional integrated structure. Other examples may be described.