公开(公告)号：US08431833B2

公开(公告)日：2013-04-30

申请号：US12645791

申请日：2009-12-23

Applicant: Kazuki Kajihara

Inventor： Kazuki Kajihara

IPC: H05K1/11

CPC classification number: H05K3/427 ,  H05K1/0366 ,  H05K3/0032 ,  H05K3/0038 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/1572 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed wiring board includes a substrate having a first surface, a second surface on the opposite side of the first surface and a through-hole extending between the first and second surfaces, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor filling the through-hole and connecting the first and second conductive circuits. The through-hole has a first opening portion tapering from the first surface toward the second surface and a second opening portion tapering from the second surface toward the first surface. The substrate is made of a resin and a reinforcing material portion in the resin. The reinforcing material portion has a protruding portion protruding into the through-hole at the intersection of the first and second opening portions. The protruding portion encroaches into the through-hole conductor.

Abstract translation: 印刷电路板包括具有第一表面，在第一表面的相对侧上的第二表面和在第一和第二表面之间延伸的通孔的基板，形成在基板的第一表面上的第一导电电路， 形成在基板的第二表面上的第二导电电路和填充通孔并连接第一和第二导电电路的通孔导体。 通孔具有从第一表面朝向第二表面渐缩的第一开口部分和从第二表面朝向第一表面渐缩的第二开口部分。 基板由树脂和增强材料部分在树脂中制成。 增强材料部分具有在第一和第二开口部分的相交处突出到通孔中的突出部分。 突出部分侵入通孔导体。