公开(公告)号：US11971226B2

公开(公告)日：2024-04-30

申请号：US17573558

申请日：2022-01-11

Applicant: Purdue Research Foundation

Inventor： Zubin Jacob ,  Xueji Wang ,  Ali Jishi ,  Avra Sankar Bandyopadhyay

IPC: F28F13/18 ,  C23C14/08 ,  C23C14/14 ,  C23C14/30 ,  C23C14/34

CPC classification number: F28F13/185 ,  C23C14/083 ,  C23C14/14 ,  C23C14/30 ,  C23C14/3464 ,  Y10T428/24917

Abstract: A thermal dual-barrier coating system is disclosed which includes a first thermal barrier layer having a first thermal conductivity, one or more composite structures vertically disposed adjacent the first thermal barrier layer, each of the one or more composite structures includes an ultra-thin disordered semi-continuous metallic film and a layer of a second thermal barrier layer.