公开(公告)号：US09526184B2

公开(公告)日：2016-12-20

申请号：US13537361

申请日：2012-06-29

Applicant: Roy J. Lecesse

Inventor： Roy J. Lecesse

IPC: H05K3/42 ,  C23C18/38 ,  C23C18/16

CPC classification number: H05K3/429 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/38 ,  H05K3/42 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/09645 ,  H05K2203/0207 ,  H05K2203/1476

Abstract: A method and system for constructing a printed circuit board with multifunctional holes. A first conductive material is deposited into a hole in a substrate to form a first plating on an inner surface of the hole. At least one outer portion of the hole is modified to have a larger diameter than the original hole and to remove the first conductive material from that outer portion. A seed material is deposited into the modified hole. An etchant is applied to the hole to non-mechanically remove the first conductive material from the unmodified portion of the hole. Another conductive material is deposited to into the modified hole that adheres to the seed material in the modified outer portion via to form a second plating at the outer portion.

Abstract translation: 一种用于构造具有多功能孔的印刷电路板的方法和系统。 将第一导电材料沉积在基底中的孔中以在孔的内表面上形成第一电镀。 孔的至少一个外部部分被修改为具有比原始孔更大的直径并且从该外部部分移除第一导电材料。 种子材料沉积到修改的孔中。 将蚀刻剂施加到孔以从孔的未修改部分非机械地去除第一导电材料。 另一种导电材料被沉积到修饰的孔中，该修饰的孔粘附在改进的外部部分通孔中的种子材料上，以在外部部分形成第二电镀。

公开(公告)号：US20140001150A1

公开(公告)日：2014-01-02

申请号：US13537361

申请日：2012-06-29

Applicant: Roy J. Lecesse

Inventor： Roy J. Lecesse

IPC: H05K3/00

CPC classification number: H05K3/429 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/38 ,  H05K3/42 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/09645 ,  H05K2203/0207 ,  H05K2203/1476

Abstract: A method and system for constructing a printed circuit board with multifunctional holes. A first conductive material is deposited into a hole in a substrate to form a first plating on an inner surface of the hole. At least one outer portion of the hole is modified to have a larger diameter than the original hole and to remove the first conductive material from that outer portion. A seed material is deposited into the modified hole. An etchant is applied to the hole to non-mechanically remove the first conductive material from the unmodified portion of the hole. Another conductive material is deposited to into the modified hole that adheres to the seed material in the modified outer portion via to form a second plating at the outer portion.

Abstract translation: 一种用于构造具有多功能孔的印刷电路板的方法和系统。 将第一导电材料沉积在基底中的孔中以在孔的内表面上形成第一电镀。 孔的至少一个外部部分被修改为具有比原始孔更大的直径并且从该外部部分移除第一导电材料。 种子材料沉积到修改的孔中。 将蚀刻剂施加到孔以从孔的未修改部分非机械地去除第一导电材料。 另一种导电材料被沉积到修饰的孔中，该修饰的孔粘附在改进的外部部分通孔中的种子材料上，以在外部部分形成第二电镀。