公开(公告)号：US20160381794A1

公开(公告)日：2016-12-29

申请号：US15196857

申请日：2016-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok-Hwan AHN ,  Mi-Sun HWANG ,  Young-Gwan KO ,  Jong-Seok BAE ,  Myung-Sam KANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K3/12 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/115 ,  H05K1/165 ,  H05K3/007 ,  H05K3/0076 ,  H05K3/12 ,  H05K3/4007 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/09136 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09672 ,  H05K2203/043

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract translation: 多层基板包括在其厚度方向上层叠的单位基板，并且单位基板包括光敏绝缘层，设置在感光绝缘层中的导电图案，以及突出到光敏绝缘层中的凸块，并提供到 导电图案。

公开(公告)号：US20180070458A1

公开(公告)日：2018-03-08

申请号：US15810343

申请日：2017-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok-Hwan AHN ,  Mi-Sun HWANG ,  Young-Gwan KO ,  Jong-Seok BAE ,  Myung-Sam KANG

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.