公开(公告)号：US20250149776A1

公开(公告)日：2025-05-08

申请号：US18977272

申请日：2024-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungkoo PARK ,  Seunghwan KIM ,  Haeyeon KIM ,  Hojung NAM ,  Kyungjae LEE ,  Kookjoo LEE ,  Jaebong CHUN ,  Soonho HWANG

IPC: H01Q1/24 ,  H01Q5/30 ,  H03H11/28 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a hinge module, a first housing having at least a portion coupled to a first side of the hinge module, a printed circuit board which is disposed inside the first housing and includes a wireless communication module, a processor, and a ground, and a second housing having at least a portion coupled to a second side of the hinge module and configured to be unfoldable and foldable with respect to the first housing using the hinge module, wherein the first housing includes a first conductive portion, a second conductive portion, and a third conductive portion which are electrically connected to the wireless communication module, a first non-conductive portion disposed between the first conductive portion and the third conductive portion, and a second non-conductive portion disposed between the second conductive portion and the third conductive portion, wherein the third conductive portion is configured to be electrically connected to a first matching circuit through a first point, wherein the first matching circuit is configured to be electrically connected to the processor through a first electrical path, wherein the processor is configured to control an impedance of the first matching circuit to correspond to a first impedance while the first conductive portion operates to radiate signals in a first frequency band and the second conductive portion operates to radiate signals in the first frequency band, and wherein the processor is further configured to control an impedance of the first matching circuit to correspond to a second impedance while the first conductive portion operates to radiate signals in a second frequency band and the second conductive portion operates to radiate signals in the second frequency band.

公开(公告)号：US20240096748A1

公开(公告)日：2024-03-21

申请号：US18453026

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taejun JEON ,  Yongkwan LEE ,  Gyuhyeong KIM ,  Seunghwan KIM ,  Jongwan KIM ,  Junwoo PARK

IPC: H01L23/473 ,  H01L23/00

CPC classification number: H01L23/473 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16052 ,  H01L2224/16175 ,  H01L2224/16225 ,  H01L2224/32221 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/17151 ,  H01L2924/172 ,  H01L2924/177

Abstract: A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.

公开(公告)号：US20240040020A1

公开(公告)日：2024-02-01

申请号：US18483995

申请日：2023-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soonho HWANG ,  Himchan YUN ,  Kookjoo LEE ,  Hojung NAM ,  Sungkoo PARK ,  Kyungjae LEE ,  Donguk CHOI ,  Seunghwan KIM ,  Jaebong CHUN

IPC: H04M1/02 ,  H01Q1/24

CPC classification number: H04M1/0214 ,  H01Q1/243 ,  H04M1/0268

Abstract: A foldable electronic device is provided that includes a hinge module, a first housing coupled to a first side of the hinge module, a first printed circuit board disposed inside the first housing and including a first wireless communication module, a processor, and a first ground or a second ground, and a second housing coupled to a second side of the hinge module, in which the first housing includes a first segmenting portion, a second segmenting portion, a first conductive portion, and a second conductive portion, in which the second housing includes a second wireless communication module, a third segmenting portion, a fourth segmenting portion, a third conductive portion, and a fourth conductive portion, and in which a matching circuit is disposed between the first conductive portion and the first ground, and a first filter circuit is connected to a signal path between the first conductive portion and the matching circuit.

公开(公告)号：US20230282533A1

公开(公告)日：2023-09-07

申请号：US18315558

申请日：2023-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung OH ,  Hyunggil BAEK ,  Seunghwan KIM ,  Jungjoo KIM ,  Jongho PARK ,  Yongkwan LEE

IPC: H01L23/16 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/16 ,  H01L25/0657 ,  H01L23/49811 ,  H01L23/3128 ,  H01L23/5389

Abstract: A semiconductor package is provided. The semiconductor package includes: a first package substrate; a first semiconductor chip on the first package substrate; an interposer substrate including a lower surface facing the first package substrate, an upper surface opposite to the lower surface, and an upper conductive pad in the upper surface of the interposer substrate; a first dam structure on the upper surface of the interposer substrate and extending along an edge of the upper conductive pad; a first molding layer in contact with the lower and upper surfaces of the interposer substrate and with an outer wall of the first dam structure; and a conductive connector in contact with an inner wall of the at least one first dam structure and with the upper conductive pad.

公开(公告)号：US20230147580A1

公开(公告)日：2023-05-11

申请号：US17980109

申请日：2022-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyung KIM ,  Seunghwan KIM

IPC: G02C11/00 ,  H01Q1/27 ,  G02C5/14 ,  G02C5/02

CPC classification number: G02C11/10 ,  H01Q1/273 ,  G02C5/14 ,  G02C5/02

Abstract: An example wearable electronic device including an antenna may include: a bridge; a first rim disposed in a first direction of the bridge, and a second rim disposed in a second direction of the bridge opposite to the first direction; and a first temple configured to be folded or unfolded with respect to the first rim using a first hinge, and a second temple configured to be folded or unfolded with respect to the second rim using a second hinge, wherein the first temple may include a first cut-off portion, and a first conductive portion and a second conductive portion separated by the first segmenting portion, wherein the second temple may include a second segmenting portion, and a third conductive portion and a fourth conductive portion separated by the second segmenting portion, and wherein the first conductive portion may include a printed circuit board on which a wireless communication circuit is disposed, a feeding point electrically connected to the wireless communication circuit, and at least one conductive connection member electrically connecting the first conductive portion and the second conductive portion.

公开(公告)号：US20230046166A1

公开(公告)日：2023-02-16

申请号：US17890483

申请日：2022-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soonho HWANG ,  Sungkoo PARK ,  Kyungjae LEE ,  Sewoong KIM ,  Seunghwan KIM ,  Taeik KIM

IPC: H04M1/02

Abstract: According to an embodiment, an electronic device comprises: a foldable housing comprising a first housing hingably connected to a second housing, a first side member disposed about a side surface of the first housing and comprising a first plurality of conductive parts, and a second side member disposed about a side surface of the second housing and comprising a second plurality of conductive parts; a communication circuit electrically connected to a first conductive part among the first plurality of conductive parts and configured to transmit and receive a signal in a selected or specified frequency band; a first sensor integrated circuit (IC) electrically connected to at least one of the first plurality of conductive parts and configured to measure capacitance; a second sensor IC electrically connected to at least one of the second plurality of conductive parts and configured to measure capacitance; a first switching circuit electrically connected to the first conductive part and a second conductive part among the first plurality of conductive parts; and a processor and a memory, wherein the memory stores instructions that, when executed, cause the processor to perform a plurality of operations, the plurality of operations comprising: controlling the first switching circuit wherein the first conductive part and the second conductive part are electrically connected, based on at least one of the capacitance measured by the first sensor IC and the capacitance measured by the second sensor IC when the foldable housing is in a folded state.

公开(公告)号：US20220093519A1

公开(公告)日：2022-03-24

申请号：US17306290

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Seunghwan KIM ,  Junyoung OH ,  Yonghyun KIM ,  Yongkwan LEE ,  Junga LEE

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

Abstract: A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

公开(公告)号：US20240396207A1

公开(公告)日：2024-11-28

申请号：US18641663

申请日：2024-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongsu WON ,  Seunghwan KIM ,  Hongchil KIM ,  Bongdae LEE ,  Hyung Sun LIM ,  Youngchan CHOI

IPC: H01Q3/24 ,  H01Q1/24 ,  H01Q21/30 ,  H04B17/318 ,  H04B17/382

Abstract: An electronic device includes antennas to receive a satellite signal from a satellite, electrical paths connected to the antennas, each of the electrical paths including a band pass filter to pass a signal of a corresponding frequency band, a bypass path connected in parallel with the electrical paths and connected to the antennas, and processing circuitry connected to the electrical paths and the bypass path, the processing circuitry being configured to receive the satellite signal through a first antenna and a first electrical path based on a quality of a signal received through the first electrical path connected to the first antenna being highest among qualities of respective signals received through the electrical paths, and receive the satellite signal through one of the antennas and the bypass path based on an intensity of a signal received through the first electrical path being less than a reference value.

公开(公告)号：US20230213771A1

公开(公告)日：2023-07-06

申请号：US18114405

申请日：2023-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaewon CHOE ,  Seunghwan KIM ,  Jaehoon JO ,  Nakchung CHOI

IPC: G02B27/01 ,  G06T19/00

CPC classification number: G02B27/0172 ,  G06T19/006

Abstract: Augmented reality (AR) glasses may include a main housing configured to accommodate lenses of the AR glasses, with at least a portion of the main housing formed of a conductive member A sub-housing forms a leg of the AR glasses. A PCB is disposed in the sub-housing. A conductive hinge structure is configured to interconnect the main housing and the sub-housing such that the sub-housing is foldable with respect to the main housing. The conductive hinge structure is electrically connected to the PCB and the conductive member. A wireless communication circuit is disposed in the sub-housing and is configured to transmit and/or receive a signal of a predetermined frequency band based on an electrical path including the conductive hinge structure and the conductive member by directly feeding power to the conductive hinge structure. Various other embodiments identified through the specification are possible.

公开(公告)号：US20170047639A1

公开(公告)日：2017-02-16

申请号：US15217516

申请日：2016-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-Jae LEE ,  Kyung-Jong LEE ,  Sewoong KIM ,  Soo-Young JANG ,  Seunghwan KIM ,  Hosaeng KIM ,  Jinwoo JUNG

IPC: H01Q1/24 ,  H01Q7/00 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/42

Abstract: An electronic device is provided. The electronic device includes a housing including a first face, a second face, and a side face that at least partially encloses a space between the first face and the second face, a conductive member configured to form at least a portion of the side face, a ground member, at least one communication circuit, and a conductive pattern positioned within the housing, the conductive pattern electrically connected to the communication circuit and the ground member, a first electric path positioned within the housing, and configured to electrically interconnect another end of the conductive member and the communication circuit, a second electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and a third electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and including a switching circuit.

Abstract translation: 提供电子设备。 电子设备包括壳体，其包括第一面，第二面和至少部分地围绕第一面和第二面之间的空间的侧面;导电构件，被配置为形成侧面的至少一部分， 接地构件，至少一个通信电路和定位在壳体内的导电图案，导电图案电连接到通信电路和接地构件，第一电路定位在壳体内，并且被配置为将互连的另一端 所述导电构件和所述通信电路，被配置为使所述第一电路或所述导电构件与所述接地构件电互连的第二电气路径，以及被配置为将所述第一电路或所述导电构件与所述接地构件 并且包括开关电路。