Gesture and handedness determination

    公开(公告)号:US11954260B2

    公开(公告)日:2024-04-09

    申请号:US17374815

    申请日:2021-07-13

    CPC classification number: G06F3/017 H04M1/0281

    Abstract: A system and method for determining handedness in a device. The system including a first electrode, a second electrode, a sensor, and a processing circuit coupled to each other. The first electrode is placed at a first location, and the second electrode is placed at a second location on the device—the first location is different from the second location. The electrodes are configured to sense a variation in an electrostatic field in response to a user interacting with the device. The sensor detects a differential potential between the first electrode and the second electrode, and the processing circuit determines whether the user is interacting with the device using a left hand or a right hand. The determining is based on data received from the sensor corresponding to the differential potential.

    Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device

    公开(公告)号:US11948806B2

    公开(公告)日:2024-04-02

    申请号:US17549280

    申请日:2021-12-13

    Inventor: Paolo Crema

    Abstract: In a method of manufacturing a multi-die semiconductor device, a metal leadframe includes a die pad and electrically-conductive leads arranged around the die pad. First and second semiconductor dice are arranged on the die pad. A laser-activatable material is disposed on the dice and leads, and a set of laser-activated lines is patterned, including a first subset coupling selected bonding pads of the dice to selected leads, a second subset coupling selected bonding pads amongst themselves, and a third subset coupling the lines in the second subset to at least one line in the first subset. A first metallic layer is deposited onto the laser-activated lines to provide first, second and third subsets of electrically-conductive lines. A second metallic layer is selectively deposited onto the first and second subsets by electroplating to provide first and second subsets of electrically-conductive tracks. The electrically-conductive lines in the third subset are selectively removed.

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