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公开(公告)号：US5228861A
公开(公告)日：1993-07-20
申请号：US897686
申请日：1992-06-12
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
CPC classification number: H01R12/52
Abstract: An electrical connector (10) for interconnecting a component (50) and a circuit (58) having pads (54, 60) on closely spaced centers for high density packaging includes a thin, dielectric member (12) carrying contacts (20) on centers compatible with the centers of the component and circuit pads; the contacts having spring arms (28, 32, 36, 40) extending from a central mounting portion (22) in a star-like configuration to provide an outward wiping engagement with component and contact pads as the contact is compressed by displacement of the component toward the circuit. The contact arms are of a geometry and have characteristics to provide a balanced force precluding rotary or twisting loads on the dielectric member and are tapered to further provide a desired deflection and sufficient normal force to define a stable, low-resistance electrical interface. The component and circuit pads, (54, 60) have lengths appropriate to the length of contact arms to provide an optimum spring deflection and wiping of pad surfaces and a width less than the length to provide closer center-to-center spacings between the pads. The pads of the component are oriented lengthwise transversely to the pads of the circuit to further facilitate close spacing and the pads of both component and circuit are preferably tapered to facilitate close spacing with the ends available for connecting to traces (62) on the same or common surface of a board for enhancing density of packaging.
Abstract translation: 用于将组件（50）和在紧密间隔的中心上具有垫（54,60）的电路（58）互连以用于高密度封装的电连接器（10）包括薄的介电构件（12），其在中心上承载接触件（20） 与组件和电路板的中心兼容; 所述触头具有从中心安装部分（22）以星形构造延伸的弹簧臂（28,32,36,40），以通过所述部件的位移来压缩所述触点，从而提供与部件和触点焊盘的向外擦拭接合 朝向电路。 接触臂具有几何形状并且具有提供平衡力的特性以阻止电介质构件上的旋转或扭转负载，并且是锥形的，以进一步提供期望的偏转和足够的法向力以限定稳定的低电阻电接口。 组件和电路板（54,60）具有适合于接触臂长度的长度，以提供最佳的弹簧挠曲和擦拭垫表面，并且具有小于长度的宽度，以在垫之间提供更靠近的中心至中心间隔 。 组件的焊盘沿横向于电路的焊盘纵向定向，以进一步促进紧密间隔，并且组件和电路的焊盘优选是锥形的，以促进与可用于连接到相同或 用于增强包装密度的板的普通表面。
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公开(公告)号：US5158467A
公开(公告)日：1992-10-27
申请号：US786642
申请日：1991-11-01
Applicant: Dimitry G. Grabbe , Iosif Korsunsky , Daniel R. Ringler
Inventor： Dimitry G. Grabbe , Iosif Korsunsky , Daniel R. Ringler
CPC classification number: H05K7/1023
Abstract: An electrical socket (10) for interconnecting circuits on an integrated circuit chip to circuits on a substrate is disclosed. The socket (10) includes a base section (12), an upper section (16) and a metallized plastic membrane (14) having circuit traces (72) thereon. Contact pins (52) in the upper section (16) electrically connect circuits on the chip to inner ends (82) of the traces (72) and outer ends (84) of the traces (72) engage circuits on a substrate.
Abstract translation: 公开了一种用于将集成电路芯片上的电路与衬底上的电路互连的电插座（10）。 插座（10）包括在其上具有电路迹线（72）的基部（12），上部（16）和金属化塑料膜（14）。 上部（16）中的接触销（52）将芯片上的电路与迹线（72）的内端（82）电连接，迹线（72）的外端（84）接合在基板上的电路。
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公开(公告)号：US5062802A
公开(公告)日：1991-11-05
申请号：US608122
申请日：1990-11-01
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
IPC: H05K7/10
CPC classification number: H05K7/1023 , Y10T29/49147
Abstract: A contact module and method for making a connector for socketing an IC chip carrier is disclosed. The contact module comprised a relatively short body containing a plurality of contacts arranged on a standard center to center spacing, and a locking member. A positioning plate is fabricated having features, such as holes, along its edges for receiving other features, such as projections, formed in the contact modules. A number of the contact modules are assembled to the positioning plate to correspond to a particular chip carrier configuration. The plate and contact modules are then aligned with the pads of a substrate and terminal portions of the contacts are then soldered to the pads. The positioning plate is then removed. The chip carrier is then placed in the connector formed by the contact modules and a locking member inserted into each contact module for contacting the chip carrier leads.
Abstract translation: 公开了一种用于制造用于插入IC芯片载体的连接器的接触模块和方法。 接触模块包括相对短的主体，其包含布置在标准中心到中心间隔的多个触点，以及锁定构件。 制造定位板，其沿着其边缘具有诸如孔的特征，用于接收形成在接触模块中的其它特征，例如突起。 多个接触模块组装到定位板上以对应于特定的芯片载体配置。 然后将板和接触模块与衬底的焊盘对准，然后将触点的端子部分焊接到焊盘。 然后取下定位板。 然后将芯片载体放置在由接触模块形成的连接器中，以及插入到每个接触模块中用于接触芯片载体引线的锁定构件。
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公开(公告)号：US5061827A
公开(公告)日：1991-10-29
申请号：US544300
申请日：1990-06-27
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
CPC classification number: H01R9/053 , H01R4/026 , H01R43/0221 , Y10T29/4919 , Y10T29/49192
Abstract: A small ferrule having inwardly projecting lances is clenched about a small coaxial cable. The tips of the lances pierce the outer plastic covering of the cable and mechanically engage the underlying metal shield layer. Each lance includes an opening adjacent thereto through which a laser beam is directed to disintegrate a portion of the plastic layer adjacent the lance. Solder paste is then deposited into the opening and heated to cause the solder to reflow and form a low-resistance contact between each lance and an adjacent portion of the shield.
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公开(公告)号：US5059143A
公开(公告)日：1991-10-22
申请号：US241649
申请日：1988-09-08
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
IPC: H01R13/03 , H01R13/187 , H01R13/22 , H01R13/53 , H01R13/533 , H01R13/625
CPC classification number: H01R13/22 , H01R13/187 , H01R13/03 , H01R13/53 , H01R13/533 , H01R13/625 , Y10S439/927
Abstract: The present disclosure sets forth a unique contact structure for a separable electrical connector for carrying relatively high levels of current at high frequency in a high temperature environment. The contact utilizes a high loading spring design which permits a relatively low resistance and low inductance contact element. The contact element takes either of two forms. One form being a multiple wire spring formed in an open helical pattern and the other being a number of c-shaped contact elements arranged in concentric circles on a thin disk.
Abstract translation: 本公开提出了用于在高温环境中高频率地承载较高电流的可分离电连接器的独特接触结构。 触点采用高负载弹簧设计，允许相对较低的电阻和低电感接触元件。 接触元件采用两种形式之一。 一种形式是形成为开放螺旋图案的多线弹簧，另一种是在薄盘上以同心圆排列的多个c形接触元件。
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Patent Agency Ranking
公开(公告)号：US5015191A
公开(公告)日：1991-05-14
申请号：US488595
申请日：1990-03-05
Applicant: Dimitry G. Grabbe , Joanne E. Shipe
Inventor： Dimitry G. Grabbe , Joanne E. Shipe
CPC classification number: H05K7/1061 , H01R12/714 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K3/325
Abstract: A separable flat integrated circuit chip connector (22) includes a plurality of contact spring members (44) maintained in a planar array by a dielectric holder (54). The planar array of the contact members (44) on the connector (22) corresponds to the planar arrays of contact pads on the surfaces of the integrated circuit package (14) and the printed circuit board (10) to which it is to be connected. A connector fastening assembly (24, 26) clamps and holds the conncetor (22) between the integrated circuit package (14) and the printed circuit board (10) to provide separable electrical connections between corresponding contact pads.
Abstract translation: 一个可分离的扁平集成电路芯片连接器（22）包括多个由电介质保持器（54）保持在平面阵列中的接触弹簧构件（44）。 连接器（22）上的接触构件（44）的平面阵列对应于集成电路封装（14）和要连接到的集成电路封装（14）和印刷电路板（10）的表面上的接触焊盘的平面阵列 。 连接器紧固组件（24,26）夹紧并保持集成电路封装（14）和印刷电路板（10）之间的连接器（22），以提供相应的接触焊盘之间的可分离的电连接。
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公开(公告)号：US4995817A
公开(公告)日：1991-02-26
申请号：US485337
申请日：1990-02-26
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
CPC classification number: H01R12/82 , H05K7/103 , Y10T29/49204
Abstract: An electrical contact (110) formed as a monolithic element having three beam portions (114, 116, 124) and inherent springiness. The contact (110) is so configured that a relatively large deflection at a contact point (130) is transformed into a small deflection at the point (108) where the spring action is effective so that a relatively flat force/deflection characteristic is attained. A kinematic model and three embodiments of the contact are disclosed, as well as a method of formation thereof.
Abstract translation: 形成为具有三个梁部分（114,116,124）和固有弹性的整体元件的电触点（110）。 触点（110）被配置成使得接触点（130）处的相对大的偏转在弹簧作用有效的点（108）处被变换成小的偏转，使得获得相对平坦的力/偏转特性。 公开了一种运动学模型和该触点的三个实施例，以及其形成方法。
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公开(公告)号：US4969826A
公开(公告)日：1990-11-13
申请号：US464624
申请日：1990-01-03
Applicant: Dimitry G. Grabbe
Inventor： Dimitry G. Grabbe
CPC classification number: H05K7/1069 , Y10S439/937 , Y10T29/49208
Abstract: The present invention is an interposer connector assembly having a small contact grid spacing for interconnecting a relatively large integrated circuit chip carrier with a printed circuit board. The interposer connector assembly includes a holder which is composed of several thin plates having perforations arranged on the desired grid patterns. The thin plates are stacked with their perforations in alignment to form through openings in the holder. Contact modules are then inserted into the through openings to complete the connector assembly. The contact modules comprise a two part plastic housing with a contact member contained in a cavity formed by mating the two parts. The two parts are formed on continuous strips of extruded plastic.
Abstract translation: 本发明是具有小的接触栅极间隔的插入器连接器组件，用于将相对较大的集成电路芯片载体与印刷电路板互连。 插入器连接器组件包括由几个薄板组成的支架，该薄板具有布置在所需网格图案上的穿孔。 薄板以它们的穿孔对准地堆叠，以形成通过支架中的开口。 然后将触头模块插入到通孔中以完成连接器组件。 接触模块包括两部分塑料壳体，其中接触构件包含在通过配合两个部分形成的空腔中。 两部分形成在连续的挤出塑料条上。
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公开(公告)号：USRE33268E
公开(公告)日：1990-07-17
申请号：US313229
申请日：1989-02-21
Applicant: Dimitry G. Grabbe , Iosif Korsunsky
Inventor： Dimitry G. Grabbe , Iosif Korsunsky
CPC classification number: H05K7/1046 , H01R12/58 , H01R43/20 , Y10T29/49147 , Y10T29/5142 , Y10T29/5149 , Y10T29/53174 , Y10T83/658
Abstract: Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.
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公开(公告)号：US4941832A
公开(公告)日：1990-07-17
申请号：US302305
申请日：1989-01-30
Applicant: Iosif Korsunsky , Monte L. Kopp , Dimitry G. Grabbe
Inventor： Iosif Korsunsky , Monte L. Kopp , Dimitry G. Grabbe
CPC classification number: H01R12/57 , H05K7/1046
Abstract: A chip carrier socket has terminals (2) positioned therein to provide an electrical connection between a chip carrier (4) and a substrate (6). The terminals (2) have first arms (10) which cooperate with the chip carrier (4), second arms (12) which engage the housing of the chip carrier socket, and mounting arms (32) which are placed in electrical engagement with the substrate (6). Engagement means (38) are provided between the first arms (10) and the mounting arms (32), and provide a shortened path across which the electrical signals can travel from the chip carrier to the substrate. The engagement means (38) also provide a frictional engagement between the first arms (10) and the mounting arms (32), thereby reducing the resilient characteristics required in the mounting arms. This frictional engagement provided by the engagement means (38) is sufficient to insure that an adequate mating force is provided between the mounting arms (32) and the substrate (6), even if the substrate (6) is warped by environmental conditions.
Abstract translation: 芯片载体插座具有位于其中的端子（2），以在芯片载体（4）和基板（6）之间提供电连接。 端子（2）具有与芯片载体（4）配合的第一臂（10），与芯片承载座的壳体相接合的第二臂（12）和安装臂（32），它们与 基板（6）。 接合装置（38）设置在第一臂（10）和安装臂（32）之间，并且提供了一个缩短的路径，电信号可以穿过该路径从芯片载体行进到基板。 接合装置（38）还在第一臂（10）和安装臂（32）之间提供摩擦接合，从而减小安装臂所需的弹性特性。 由接合装置（38）提供的这种摩擦接合足以确保在安装臂（32）和基板（6）之间提供足够的配合力，即使基板（6）被环境条件扭曲。
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