公开(公告)号：US5770807A

公开(公告)日：1998-06-23

申请号：US737349

申请日：1996-11-04

Applicant: David Finn ,  Manfred Rietzler

Inventor： David Finn ,  Manfred Rietzler

IPC: H01L21/60 ,  B23K20/02 ,  B23K37/02 ,  B23P19/04 ,  B23Q1/58 ,  B23Q17/09 ,  H01L21/603 ,  B23K11/24

CPC classification number: B23K37/0211 ,  B23K20/023 ,  B23P19/04 ,  B23Q1/58 ,  B23Q17/0966

Abstract: An apparatus for taking up and guiding a tool device, especially a connection device, comprises a feed device that can move along a feed axis by a servo-element. A take-up device moves along an axis so that the take-up device can move relative to the feed device. A force measuring device is disposed on the feed device. An elastic element is disposed between the force measuring device and the take-up device so that the elastic element is deformed when a relative motion takes place between the force measuring device and the take-up device.

Abstract translation: PCT No.PCT / DE95 / 00642 Sec。 371日期：1996年11月4日 102（e）日期1996年11月4日PCT提交1995年5月11日PCT公布。 公开号WO95 / 32073 日期：1995年11月30日。一种用于抓取和引导工具装置，特别是连接装置的装置，包括可通过伺服元件沿进给轴线移动的进给装置。 卷取装置沿轴线移动，使得卷绕装置可以相对于进给装置移动。 力测量装置设置在进给装置上。 弹性元件设置在力测量装置和卷取装置之间，使得当在力测量装置和卷取装置之间发生相对运动时弹性元件变形。

公开(公告)号：US10762413B2

公开(公告)日：2020-09-01

申请号：US16242009

申请日：2019-01-08

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16 ,  H04B5/00 ,  H05K3/10 ,  H01F38/14

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) component contributing to the inductance of the booster antenna (BA). At least a portion of the coupler coil (CC) component may have a sense which is opposite to a sense of at least a portion of the card antenna (CA) component. At least a portion of one of the components may be interleaved with (i) a portion of another component, or (ii) another portion of the same component. A capacitive extension (CE) may extend from at least one of the card antenna (CA), coupler coil (CC) and extension antenna (EA) components.

公开(公告)号：US20200257953A1

公开(公告)日：2020-08-13

申请号：US16742903

申请日：2020-01-14

Applicant: Mustafa Lotya ,  Darren Molloy ,  David Finn

Inventor： Mustafa Lotya ,  Darren Molloy ,  David Finn

IPC: G06K19/077 ,  H01Q1/22

Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.

公开(公告)号：US10733494B2

公开(公告)日：2020-08-04

申请号：US15939281

申请日：2018-03-29

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  H04B5/00 ,  H01Q1/22

Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).

公开(公告)号：US20200226443A1

公开(公告)日：2020-07-16

申请号：US16798368

申请日：2020-02-23

Applicant: Mustafa Lotya ,  David Finn

Inventor： Mustafa Lotya ,  David Finn

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/16

Abstract: A wireless connection may be established between at least two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed in close proximity with the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone, and provide the energy to the two modules via the two coupler coils.

公开(公告)号：US10518518B2

公开(公告)日：2019-12-31

申请号：US15969816

申请日：2018-05-03

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  B32B37/14 ,  B32B37/02 ,  B32B37/12 ,  G06K19/077 ,  H01Q7/00 ,  H01Q1/22 ,  G06K19/02

Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

公开(公告)号：US20190197385A1

公开(公告)日：2019-06-27

申请号：US16242009

申请日：2019-01-08

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H05K1/16 ,  H01Q7/00

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) component contributing to the inductance of the booster antenna (BA). At least a portion of the coupler coil (CC) component may have a sense which is opposite to a sense of at least a portion of the card antenna (CA) component. At least a portion of one of the components may be interleaved with (i) a portion of another component, or (ii) another portion of the same component. A capacitive extension (CE) may extend from at least one of the card antenna (CA), coupler coil (CC) and extension antenna (EA) components.

公开(公告)号：US20190156073A1

公开(公告)日：2019-05-23

申请号：US15818785

申请日：2017-11-21

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K7/10 ,  H05K1/02 ,  H01Q23/00 ,  H05K13/00 ,  H05K9/00 ,  H05K3/36 ,  H05K3/00 ,  H05K3/30

Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like coating filling the slit. Key fobs similarly fabricated. Plastic-Metal-Plastic smart cards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

公开(公告)号：US09622359B2

公开(公告)日：2017-04-11

申请号：US14619186

申请日：2015-02-11

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: H05K3/46 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  B23K26/00 ,  B23K26/0622 ,  G06K19/077 ,  B23K101/40 ,  B23K103/00

CPC classification number: H05K3/46 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/352 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07754 ,  G06K19/07794 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  Y10T29/49018 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

公开(公告)号：US20170077589A1

公开(公告)日：2017-03-16

申请号：US15358138

申请日：2016-11-22

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q1/2225 ,  G06K19/077 ,  H04B5/0056 ,  H04B5/0062

Abstract: A conductive coupling frame (CF) or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S), extending from an inner end to a periphery of the metal layer, and not terminating in a distinct opening sized to accommodate a transponder chip module (TCM).

Abstract translation: 布置在应答器芯片模块（TCM）周围并紧密相邻的导电耦合框架（CF）或非连续金属层，并且与应答器芯片模块（TCM）中的天线结构（AS，CES，LES）基本共面。 金属卡体（MCB，CB）或具有不连续金属层的交易卡，具有从金属层的内端延伸到周边的狭缝（S），并且不终止于尺寸适于容纳应答器的不同开口 芯片模块（TCM）。