公开(公告)号：US20200164645A1

公开(公告)日：2020-05-28

申请号：US16629120

申请日：2017-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Anthony Fuller ,  Chien-Hua Chen ,  Zhen Yi Li

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

公开(公告)号：US10559512B2

公开(公告)日：2020-02-11

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L21/56 ,  H01L23/29

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US10464324B2

公开(公告)日：2019-11-05

申请号：US15872713

申请日：2018-01-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/155 ,  B41J2/14 ,  B41J2/16 ,  B41J2/145 ,  B41J25/34

Abstract: A method of manufacturing a fluid flow structure may include coupling a flex circuit to a carrier. The flex circuit may include at least one conductor. The method may include coupling an orifice side of a fluidic die to the carrier at an opening on the carrier. The fluidic die may include at least one electrical terminal. The method may include coupling the electrical terminal to the conductor, and overmolding the fluid flow structure with a moldable material. The overmolded fluid flow structure may include a channel molded therein, and the channel may be fluidically coupled to the fluidic die. The conductor may be surrounded by the moldable material.

公开(公告)号：US10319657B2

公开(公告)日：2019-06-11

申请号：US15546846

申请日：2015-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: H01L23/29 ,  H01L21/00 ,  H01L23/31 ,  H01L21/56 ,  B81B7/00 ,  H01L23/373 ,  H01L23/00

Abstract: A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.

公开(公告)号：US20190168511A1

公开(公告)日：2019-06-06

申请号：US16092652

申请日：2016-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Anthony D. Studer

IPC: B41J2/175 ,  G01F23/24

Abstract: A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.

公开(公告)号：US20190143325A1

公开(公告)日：2019-05-16

申请号：US16097460

申请日：2016-07-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: B01L3/00 ,  B01D29/03 ,  B01D29/56 ,  B01D29/01 ,  B81B1/00 ,  B81C1/00

Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, pattering a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.

公开(公告)号：US20190120678A1

公开(公告)日：2019-04-25

申请号：US16092572

申请日：2016-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Greg Scott Long

IPC: G01F23/24 ,  B41J2/175 ,  B41J2/195 ,  G01F23/26 ,  G01N27/22

Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.

公开(公告)号：US20190111694A1

公开(公告)日：2019-04-18

申请号：US16092350

申请日：2016-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Devin Alexander Mourey ,  Anthony D. Studer

IPC: B41J2/175 ,  G01F23/24

Abstract: In one example in accordance with the present disclosure a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.

公开(公告)号：US20190111683A1

公开(公告)日：2019-04-18

申请号：US16231057

申请日：2018-12-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  B41J2/175

Abstract: A fluid dispenser may include fluid dispensing dies in an end-to-end staggered arrangement, a non-fluid dispensing die electronic device and a molding covering the fluid dispensing dies and the electronic device.

公开(公告)号：US10226926B2

公开(公告)日：2019-03-12

申请号：US15885458

申请日：2018-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/165 ,  B41J2/14 ,  B41J2/16

Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a plurality of recesses extending partially through the PCB and a plurality of dams surrounding the plurality of recesses. An adhesive material may be applied to each of the plurality of recesses and a plurality of printhead die slivers may be positioned in the plurality of recesses. The Plurality of printhead die slivers may be bonded with the PCB and the plurality of printhead die slivers and the PCB may be encapsulated with a molding compound. In response to encapsulating, a plurality of slots, extending through the PCB and the adhesive material may be formed, wherein the plurality of slots are in fluidic communication with fluid feed holes of the plurality of printhead die slivers to provide direct fluidic communication without fan-out.