公开(公告)号：US08148199B2

公开(公告)日：2012-04-03

申请号：US12384853

申请日：2009-04-09

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A microelectronic assembly is provided which can include an element including a first dielectric layer and a second dielectric layer overlying the first dielectric layer, the second dielectric layer having an exposed surface defining an exposed major surface of the element. A plurality of substantially rigid metal posts can project beyond the exposed surface, the metal posts having ends remote from the exposed surface. The microelectronic assembly can include a microelectronic device which has bond pads and overlies the element. The microelectronic device can have a major surface which confronts the posts. Connections electrically connect the ends of the metal posts with the bond pads of the microelectronic device.

Abstract translation: 提供了一种微电子组件，其可以包括包括第一介电层和覆盖在第一介电层上的第二介电层的元件，第二介电层具有限定元件暴露的主表面的暴露表面。 多个基本刚性的金属柱可以突出超过暴露表面，金属柱具有远离暴露表面的端部。 微电子组件可以包括具有接合焊盘并覆盖元件的微电子器件。 微电子器件可以具有面对柱的主表面。 连接电连接金属柱的端部与微电子器件的接合焊盘。

公开(公告)号：US20090236406A1

公开(公告)日：2009-09-24

申请号：US12383293

申请日：2009-03-23

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: B23K31/02

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other portions of the posts. The method can include reflowing the solder provided on the posts so that the solder coats the posts. The providing step may be performed so that, prior to the reflowing step, the solder covers only the tips of the posts. The providing step can include depositing portions of the solder on a surface of a metallic sheet and etching the sheet from the surface. The plurality of posts may comprise elongated posts.

Abstract translation: 处理部件的方法可以包括提供包括大致平行彼此延伸的多个金属柱的部件。 可以执行提供步骤，使得柱在柱的尖端上具有焊料，但不覆盖柱的其他部分。 该方法可以包括回流设置在柱上的焊料，使得焊料涂覆在柱上。 可以执行提供步骤，使得在回流步骤之前，焊料仅覆盖柱的尖端。 提供步骤可以包括在金属片的表面上沉积焊料的一部分并从表面上蚀刻片。 多个柱可以包括细长的柱。

公开(公告)号：US07276400B2

公开(公告)日：2007-10-02

申请号：US11289743

申请日：2005-11-29

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/00

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.

Abstract translation: 制造微电子组件的方法包括提供第一微电子元件，其具有在第一表面处暴露的第一表面和多个触点; 提供第二微电子元件，其具有在顶表面处暴露的顶表面和多个触点，形成多个导电弹性体柱，其将第一微电子元件的至少一些触点连接到第二微电子元件的至少一些触点 微电子元件，以及在所述第一微电子元件的第一表面和所述第二微电子元件的顶表面之间注入柔性材料以形成柔顺层。

公开(公告)号：US20070066046A1

公开(公告)日：2007-03-22

申请号：US11602034

申请日：2006-11-20

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44 ,  H01L21/00

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

Abstract translation: 电连接具有带有多个触点的第一表面的微电子部件的方法。 该方法包括以下步骤：通过将具有支撑结构的连接部件和由支撑结构的第一表面基本上彼此平行延伸的多个细长柱与微电子部件并置而形成子组件，使得支撑结构覆盖在表面 所述部件的柱子远离所述部件并且将所述柱电连接到所述微电子部件的触头。

公开(公告)号：US07112879B2

公开(公告)日：2006-09-26

申请号：US10873883

申请日：2004-06-22

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/52 ,  H01L23/02

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A microelectronic package includes a microelectronic element having contacts accessible at a surface thereof, a layer overlying the microelectronic element, the layer having a first surface and a sloping peripheral edge extending away from the first surface of the layer, and conductive terminals overlying the microelectronic element, wherein the layer supports the conductive terminals over the microelectronic element. The package also includes conductive traces having first ends electrically connected with the contacts of the microelectronic element and second ends electrically connected with the conductive terminals, with at least one of the conductive traces having a section that is in contact with and extends along the sloping peripheral edge of the layer, and a compliant material disposed between the conductive terminals and the microelectronic element so that the conductive terminals are movable relative to the microelectronic element.

Abstract translation: 微电子封装包括具有可在其表面可访问的触点的微电子元件，覆盖微电子元件的层，该层具有远离该第一表面延伸的第一表面和倾斜周边边缘以及覆盖该微电子元件的导电端子 其中所述层支撑所述微电子元件上的导电端子。 封装还包括导电迹线，其导电迹线具有与微电子元件的触点电连接的第一端和与导电端子电连接的第二端，其中至少一个导电迹线具有与倾斜周边接触并沿着倾斜周边延伸的部分 所述层的边缘以及设置在所述导电端子和所述微电子元件之间的柔性材料，使得所述导电端子可相对于所述微电子元件移动。

公开(公告)号：US20050093152A1

公开(公告)日：2005-05-05

申请号：US10964578

申请日：2004-10-12

Applicant: Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

Inventor： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

IPC: H01L20060101 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

Abstract translation: 本发明的成本有效，高性能的IC封装组件包括从IC封装组件的多个表面和电平中的任一个上的至少一个芯片到端子的阶梯层的再分配电路。 组件的关键路径电路没有电镀通孔，并且通过倒装芯片或引线键合方法将互连封装与IC芯片端子互连的互连端直接布线。

公开(公告)号：US06876212B2

公开(公告)日：2005-04-05

申请号：US10728308

申请日：2003-12-04

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: G01R1/073 ,  G01R27/08 ,  G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/0491 ,  G01R1/06727 ,  G01R3/00

Abstract: A probe card for testing an electrical element such as a semiconductor wafer or a printed wiring board includes a substrate with circuitry thereon, an encapsulant layer overlying the substrate and a multiplicity of leads extending upwardly from the substrate through the encapsulant layer to terminals, the terminals projecting above the encapsulant layer. The probe card can be engaged with the electronic element so that the tips of the leads bear on the contact pads of the electronic element, and so that the leads and encapsulant layer deform to accommodate irregularities in the electronic element or probe card. The card can be made by providing the substrate, a sacrificial layer and leads extending between the sacrificial layer and substrate, moving the substrate and sacrificial layer away from one another to deform the leads and injecting a curable material around the leads to form the encapsulant layer.

Abstract translation: 用于测试诸如半导体晶片或印刷线路板的电气元件的探针卡包括其上具有电路的衬底，覆盖衬底的密封剂层和从衬底通过密封剂层向上延伸到端子的多个引线，端子 突出在密封剂层上方。 探针卡可以与电子元件接合，使得引线的尖端承载在电子元件的接触垫上，并且使得引线和密封剂层变形以适应电子元件或探针卡中的不规则。 可以通过提供衬底，牺牲层和在牺牲层和衬底之间延伸的引线来制造该卡，使衬底和牺牲层彼此远离地移动以使引线变形并且在引线周围注入可固化材料以形成密封层 。

公开(公告)号：US06848173B2

公开(公告)日：2005-02-01

申请号：US09766814

申请日：2001-01-22

Applicant: Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

Inventor： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

Abstract translation: 一种制造微电子组件的方法包括将第一元件（例如具有导电引线的电介质片）与其上接触的第二元件（例如半导体芯片）并置，将第一元件上的导电引线接合到触点上 在第二元件上，使得细长的接合线在导电引线和触点之间延伸。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预先选择的位移，以使接合线变形。 可移动介电材料可以在移动步骤期间或之后在第一和第二元件之间以及接合线周围引入。 可流动材料可以固化以形成围绕至少一部分接合线的密封剂。

公开(公告)号：US06847101B2

公开(公告)日：2005-01-25

申请号：US10107094

申请日：2002-03-26

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/498 ,  H01L23/02 ,  H01L23/29 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A microelectronic assembly includes a microelectronic element having a first surface with a plurality of contacts accessible at the first surface, and a compliant layer over the first surface of the microelectronic element, the compliant layer including a plurality of bumped protrusions and openings adjacent the bumped protrusions for providing access to the contacts, wherein each bumped protrusion includes a top surface and at least one sloping edge. The microelectronic assembly also includes conductive terminals over the top surfaces of the bumped protrusions, and a plurality of conductive bond ribbons having first ends in engagement with the contacts, second ends in engagement with the terminals and intermediate sections extending along the sloping edges for electrically interconnecting the contacts and the terminals.

Abstract translation: 微电子组件包括具有第一表面的微电子元件，第一表面具有在第一表面可访问的多个触点，以及柔性层，位于微电子元件的第一表面上方，柔顺层包括多个凸起突起和与凸起凸起相邻的开口 用于提供对触点的访问，其中每个凸起突起包括顶表面和至少一个倾斜边缘。 微电子组件还包括在凸起突起的顶表面上方的导电端子，以及多个导电接合带，其具有与触头接合的第一端，与端子接合的第二端和沿着倾斜边缘延伸的中间部分，用于电互连 触点和端子。

公开(公告)号：US06737265B2

公开(公告)日：2004-05-18

申请号：US10242017

申请日：2002-09-12

Applicant: Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

Inventor： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

IPC: C12M100

CPC classification number: H01L24/02 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13024 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.

Abstract translation: 具有细长固定部分的可释放引线在由部件的介电材料或半导体本体限定的表面上延伸。 还公开了具有连接到一组触点的导电结构的半导体元件。 公开了制造导电结构的方法。