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    Physical layer adapted for EHF contactless communication
    91.
    发明授权
    Physical layer adapted for EHF contactless communication 有权

    公开(公告)号：US10581489B2

    公开(公告)日：2020-03-03

    申请号：US15935774

    申请日：2018-03-26

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles ,  Roger D. Isaac

    IPC: H04B5/00 ,  H04W76/10 ,  H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    EXTREMELY HIGH FREQUENCY SYSTEMS AND METHODS OF OPERATING THE SAME
    92.
    发明申请
    EXTREMELY HIGH FREQUENCY SYSTEMS AND METHODS OF OPERATING THE SAME 审中-公开

    公开(公告)号：US20190297664A1

    公开(公告)日：2019-09-26

    申请号：US16435281

    申请日：2019-06-07

    Applicant: Keyssa, Inc.

    Inventor： Ian A. Kyles ,  Kenneth R. Kveton ,  Michael A. Bourdess ,  John Wolcott ,  Steve Novak ,  Roger D. Isaac ,  Gary D. McCormack

    IPC: H04W76/28 ,  H04B1/401 ,  H04B5/02 ,  H04W76/14

    Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.

    CONTACTLESS AUDIO ADAPTER, AND METHODS
    93.
    发明申请
    CONTACTLESS AUDIO ADAPTER, AND METHODS 审中-公开

    公开(公告)号：US20190215605A1

    公开(公告)日：2019-07-11

    申请号：US16197247

    申请日：2018-11-20

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04R3/00 ,  H01Q1/22

    CPC classification number: H04R3/00 ,  H01L2224/48137 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H04R2420/07 ,  H04R2420/09 ,  H01L2924/00

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

    Dielectric coupling systems for EHF communications
    95.
    发明授权
    Dielectric coupling systems for EHF communications 有权

    公开(公告)号：US10069183B2

    公开(公告)日：2018-09-04

    申请号：US15360973

    申请日：2016-11-23

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Yanghyo Kim ,  Emilio Sovero

    IPC: H01Q1/12 ,  H01Q1/50 ,  H01P3/16 ,  H01P3/12

    Abstract: Dielectric coupler devices and dielectric coupling systems for communicating EHF electromagnetic signals, and their methods of use. The coupler devices include an electrically conductive body having a major surface, the electrically conductive body defining an elongate recess, and the elongate recess having a floor, where a dielectric body is disposed in the elongate recess and configured to conduct an EHF electromagnetic signal.

    Tightly-coupled near-field communication-link connector-replacement chips
    97.
    发明授权
    Tightly-coupled near-field communication-link connector-replacement chips 有权

    公开(公告)号：US09853696B2

    公开(公告)日：2017-12-26

    申请号：US14047924

    申请日：2013-10-07

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack

    IPC: H04B5/00 ,  H04B5/02

    CPC classification number: H04B5/02

    Abstract: Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.

    Virtualized physical layer adapted for EHF contactless communication
    98.
    发明授权
    Virtualized physical layer adapted for EHF contactless communication 有权

    公开(公告)号：US09750068B2

    公开(公告)日：2017-08-29

    申请号：US15408937

    申请日：2017-01-18

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles ,  Roger D. Isaac

    IPC: H04B7/00 ,  H04W76/02 ,  H04B5/00

    CPC classification number: H04B5/0031 ,  H04B5/0037 ,  H04W76/10 ,  H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    CONTACTLESS AUDIO ADAPTER, AND METHODS
    99.
    发明申请
    CONTACTLESS AUDIO ADAPTER, AND METHODS 审中-公开

    公开(公告)号：US20170142516A1

    公开(公告)日：2017-05-18

    申请号：US15421181

    申请日：2017-01-31

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04R3/00 ,  H01Q1/22

    CPC classification number: H04R3/00 ,  H01L2224/48137 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H04R2420/07 ,  H04R2420/09 ,  H01L2924/00

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

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