-
公开(公告)号:US12270828B2
公开(公告)日:2025-04-08
申请号:US17919742
申请日:2021-04-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.
-
公开(公告)号:US12151461B2
公开(公告)日:2024-11-26
申请号:US18058177
申请日:2022-11-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.
-
公开(公告)号:US11696398B2
公开(公告)日:2023-07-04
申请号:US17209203
申请日:2021-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Dong Eun Lee
CPC classification number: H05K1/0306 , G01R1/07378 , H05K1/115 , H05K2201/09618
Abstract: Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.
-
公开(公告)号:US11632858B2
公开(公告)日:2023-04-18
申请号:US17209178
申请日:2021-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Dong Eun Lee
Abstract: Proposed is an anodic aluminum oxide structure made of anodic aluminum oxide and, more particularly, is an anodic aluminum oxide structure that minimizes damage to a material in the vicinity of a conductor and prevents a problem of delamination between the conductor and a member existing thereon.
-
公开(公告)号:US11619655B2
公开(公告)日:2023-04-04
申请号:US17029979
申请日:2020-09-23
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: A probe card is configured to perform a circuit test on a wafer to realize a reduction in size and pitch of probe insertion holes. The probe card includes a first plate, a second plate coupled to a lower portion of the first plate, an upper guide plate provided on an upper surface of the first plate, a lower guide plate provided on a lower surface of the second plate, and a reinforcing plate coupled to at least a surface of each of the upper and lower guide plates. At least one of the upper and lower guide plates is made of an anodic oxide film material, and as viewed from above, the upper and lower guide plates and the reinforcing plate are configured to have smaller areas than the first and second plates, so that upper and lower surfaces of the first and second plates are exposed.
-
公开(公告)号:US11581210B2
公开(公告)日:2023-02-14
申请号:US16529407
申请日:2019-08-01
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H01L21/677 , H01L21/683 , H01L33/00
Abstract: The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.
-
公开(公告)号:US11543432B2
公开(公告)日:2023-01-03
申请号:US17211812
申请日:2021-03-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.
-
公开(公告)号:US11361575B2
公开(公告)日:2022-06-14
申请号:US16416003
申请日:2019-05-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
IPC: H01L41/187 , H01L41/113 , H01L41/047 , G06V40/13 , B06B1/06
Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.
-
公开(公告)号:US11342207B2
公开(公告)日:2022-05-24
申请号:US16989431
申请日:2020-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H01L21/67 , B65G47/91 , H01L21/683 , H01L25/16
Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.
-
公开(公告)号:US11069584B2
公开(公告)日:2021-07-20
申请号:US16370584
申请日:2019-03-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park
IPC: G01R31/00 , H01L21/66 , G01R31/26 , G01R31/44 , G01R31/52 , H01L25/075 , H01L25/16 , G09G3/00 , G09G3/3233
Abstract: The present invention relates to an inspection method for a micro LED, the method being configured to inspect whether the micro LED is defective.
-
-
-
-
-
-
-
-
-