Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film
    91.
    发明授权
    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film 有权
    形成多晶硅膜的方法和制造包括多晶硅膜的薄膜晶体管的方法

    公开(公告)号:US07923316B2

    公开(公告)日:2011-04-12

    申请号:US11808521

    申请日:2007-06-11

    CPC classification number: H01L29/66757 H01L29/78603 H01L29/78606

    Abstract: In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

    Abstract translation: 在形成多晶硅膜的方法中,包括多晶硅膜的薄膜晶体管和包括多晶硅膜的薄膜晶体管的制造方法,薄膜晶体管包括基板,基板上的第一导热膜, 与所述第一导热膜相邻的所述第二导热膜,所述第二导热膜的热导率低于所述第一导热膜,所述第二导热膜上的多晶硅膜和与所述第二导热膜相邻的所述第一导热膜 膜和多晶硅膜上的栅极堆叠。 第二导热膜可以在第一导热膜上,或者第一导热膜可以不连续,并且第二导热膜可以介于不连续的第一导热膜的部分之间。

    Organic electroluminescent display and method of fabricating the same

    公开(公告)号:US07851280B2

    公开(公告)日:2010-12-14

    申请号:US12730344

    申请日:2010-03-24

    CPC classification number: H01L27/3244 H01L27/1255 H01L27/3265

    Abstract: An organic electroluminescent display (“OELD”) includes an organic light-emitting diode (“OLED”), a circuit region, and an interlayer dielectric (“ILD”) layer. The OLED is disposed in each of a plurality of pixels arranged on a substrate. The circuit region includes two or more thin film transistors (“TFTs”) and a storage capacitor. The ILD layer has two or more insulating layers and includes a first region disposed between both electrodes of the storage capacitor and a second region covering the TFTs. At least one of the insulating layers has a window exposing the insulating layer directly beneath the at least one insulating layer so that that the ILD layer is thinner in the first region than in the second region. Accordingly, it is possible to reduce an occupation area of the storage capacitor while maintaining the necessary capacitance of the storage capacitor and expanding the area of the luminescent region.

    Method of manufacturing single crystal Si film
    99.
    发明授权
    Method of manufacturing single crystal Si film 有权
    制造单晶Si膜的方法

    公开(公告)号:US07479442B2

    公开(公告)日:2009-01-20

    申请号:US11071175

    申请日:2005-03-04

    CPC classification number: H01L21/76254

    Abstract: Provided is a method of manufacturing a single crystal Si film. The method includes: preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed; forming a dividing layer at a predetermined depth from a surface of the Si substrate by implanting hydrogen ions from above the first oxide layer; bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer; and forming a single crystal Si film having a predetermined thickness on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate. Therefore, a single crystal Si film having a predetermined thickness can be formed on an insulating substrate.

    Abstract translation: 提供制造单晶Si膜的方法。 该方法包括:制备其上形成有第一氧化物层的Si衬底和形成有第二氧化物层的绝缘衬底; 通过从所述第一氧化物层上方注入氢离子,从所述Si衬底的表面形成预定深度的分隔层; 将绝缘基板接合到Si衬底,使得第一氧化物层接触第二氧化物层; 以及通过从绝缘基板上方照射激光束切割分隔层,在绝缘基板上形成具有预定厚度的单晶硅膜。 因此,可以在绝缘基板上形成具有预定厚度的单晶Si膜。

    Method of forming channel region of TFT composed of single crystal Si
    100.
    发明授权
    Method of forming channel region of TFT composed of single crystal Si 有权
    形成由单晶硅构成的TFT的沟道区的方法

    公开(公告)号:US07390706B2

    公开(公告)日:2008-06-24

    申请号:US11289312

    申请日:2005-11-30

    Abstract: A method of forming a high quality channel region of a TFT by forming a large size monocrystalline silicon thin film using a patterned metal mask and a grain boundary filtering region is provided. The method includes sequentially stacking a first buffer layer and an amorphous silicon layer on a substrate, forming a first silicon region in which crystallization begins, a second silicon region having a width smaller than a width of the first silicon region and located on a central portion of a side of the first silicon region, and a third silicon region having a width than greater the width of the second silicon region and contacting the second silicon region, forming a metal mask partly on the first silicon region, and crystallizing the amorphous silicon layer by cooling the amorphous silicon layer after melting the entire amorphous silicon layer except for a portion of the amorphous silicon layer under the metal mask by radiating laser beams to the patterned amorphous silicon layer.

    Abstract translation: 提供了通过使用图案化金属掩模和晶界过滤区域形成大尺寸单晶硅薄膜来形成TFT的高质量沟道区域的方法。 该方法包括在基板上依次层叠第一缓冲层和非晶硅层,形成开始结晶的第一硅区域,第二硅区域的宽度小于第一硅区域的宽度并位于中心部分 并且第三硅区域的宽度大于第二硅区域的宽度并与第二硅区域接触,部分地在第一硅区域上形成金属掩模,并且使非晶硅层结晶 通过对图案化的非晶硅层照射激光束,在金属掩模下方的非晶硅层的一部分熔融了整个非晶硅层之后,冷却非晶硅层。

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