公开(公告)号：US20160029520A1

公开(公告)日：2016-01-28

申请号：US14870558

申请日：2015-09-30

Applicant: International Business Machines Corporation

Inventor： Richard B. Finch ,  Jason T. Hirst ,  Gerald G. Stanquist

IPC: H05K7/20 ,  F25B47/00

CPC classification number: H05K7/20763 ,  F25B47/006 ,  G06F1/20 ,  G06F2200/201

Abstract: An approach is provided in which a manufacturing test scheduling system predicts a dew point forecast indoor a facility based upon outdoor weather data and indoor environment data. The manufacturing test scheduling system selects time slots in the dew point forecast based upon a pre-defined dew point threshold and, in turn, schedules tests of a liquid cooled computer system during the selected time slots.

公开(公告)号：US20160025613A1

公开(公告)日：2016-01-28

申请号：US14444013

申请日：2014-07-28

Applicant: International Business Machines Corporation

Inventor： Richard B. Finch ,  Jason T. Hirst ,  Gerald G. Stanquist

IPC: G01N17/00

CPC classification number: H05K7/20763 ,  F25B47/006 ,  G06F1/20 ,  G06F2200/201

Abstract: An approach is provided in which a manufacturing test scheduling system predicts a dew point forecast indoor a facility based upon outdoor weather data and indoor environment data. The manufacturing test scheduling system selects time slots in the dew point forecast based upon a pre-defined dew point threshold and, in turn, schedules tests of a liquid cooled computer system during the selected time slots.

Abstract translation: 提供一种方法，其中制造测试调度系统基于室外天气数据和室内环境数据预测室内露点预测设施。 制造测试调度系统基于预定义的露点阈值来选择露点预测中的时隙，并且在选定的时隙期间调度液冷计算机系统的测试。

公开(公告)号：US20160021785A1

公开(公告)日：2016-01-21

申请号：US14578868

申请日：2014-12-22

Applicant: BEIJING LENOVO SOFTWARE LTD. ,  LENOVO (BEIJING) LIMITED

Inventor： Guowen Zhang

IPC: H05K7/20 ,  H01L41/09

CPC classification number: H01L41/09 ,  F04D33/00 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/20145

Abstract: Embodiments of the present disclosure refers to an electronic device, comprising a first bracket that is made of a first material having a thermal conductivity greater than a first threshold and has therein at least one passage including a chamber; wherein the first bracket and the chamber define a closed space in which a cooling medium having a thermal conductivity greater than a second threshold is able to circulate; and wherein the chamber is provided with a driving body at at least one side wall of the chamber and the driving body is deformable under a perdetermined condition to change a capacity of the chamber so as to drive the cooling medium to flow.

Abstract translation: 本公开的实施例涉及一种电子设备，其包括由具有大于第一阈值的导热率的第一材料制成的第一支架，并且其中具有包括腔室的至少一个通道; 其中所述第一支架和所述室限定封闭空间，其中热导率大于第二阈值的冷却介质能够循环; 并且其中所述腔室在所述腔室的至少一个侧壁处设置有驱动体，并且所述驱动体在恒定状态下可变形以改变所述腔室的容量，以驱动所述冷却介质流动。

公开(公告)号：US09229497B2

公开(公告)日：2016-01-05

申请号：US13931730

申请日：2013-06-28

Applicant: Silicon Graphics International Corp.

Inventor： Steven J. Dean ,  Richard B. Salmonson ,  Russell E. Stacy ,  Roger Ramseier ,  Mark Maloney

IPC: H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  H05K7/20 ,  G06F1/18

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract translation: 高性能计算系统包括一个或多个具有冷却歧管并且被配置为保持多个计算刀片的刀片式外壳，以及具有包括两个计算板的至少一个计算刀片的每个刀片机箱中的多个计算刀片。 该系统还包括两个或更多个冷却板，其中每个冷却板位于计算刀片内的两个对应的计算板之间，以及流体连接，其连接到冷却板并与流体冷却歧管流体连通。

公开(公告)号：US20150359141A1

公开(公告)日：2015-12-10

申请号：US14690567

申请日：2015-04-20

Applicant: FUJITSU LIMITED

Inventor： KENJI FUKUZONO ,  Yuki Hoshino

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid-cooled jacket, includes: a cooling chamber including a first inner surface that extends along a to-be-cooled surface of an exothermic component; a heat transfer portion arranged in the cooling chamber and configured to transfer heat from the first inner surface to a second inner surface of the cooling chamber formed to oppose the first inner surface; an inflow path for a refrigerant including one end having an opening at a central portion of the second inner surface; a plurality of outflow holes for the refrigerant arranged in the second inner surface; and an outflow path, formed at a back side of an edge of the second inner surface, through which the refrigerant from the respective outflow holes circulates.

Abstract translation: 液冷套管包括：冷却室，包括沿着放热部件的被冷却表面延伸的第一内表面; 传热部，布置在所述冷却室中并且构造成将热量从所述第一内表面传递到所述冷却室的形成为与所述第一内表面相对的第二内表面; 用于制冷剂的流入路径，所述制冷剂包括在所述第二内表面的中心部分具有开口的一端; 多个用于布置在第二内表面中的制冷剂的流出孔; 以及形成在第二内表面的边缘的后侧的流出路径，来自各流出孔的制冷剂通过该流出路径循环。

公开(公告)号：US20150355941A1

公开(公告)日：2015-12-10

申请号：US14683711

申请日：2015-04-10

Applicant: FUJITSU LIMITED

Inventor： Jumpei KUBOTA

IPC: G06F9/48 ,  G06F1/20 ,  G06F9/50

CPC classification number: G06F9/4893 ,  G06F1/206 ,  G06F1/3206 ,  G06F2200/201 ,  Y02D10/24

Abstract: An information processing device includes arithmetic processing devices, a cooling device, and a job assignment device. Each of the arithmetic processing devices is configured to perform a job. The cooling device is connected to the arithmetic processing devices. The cooling device includes a circulation unit, a cooling unit, and an adjustment unit. The circulation unit is configured to circulate refrigerant through a supply route. The refrigerant absorbs heat generated by the arithmetic processing devices. The cooling unit is configured to cool the refrigerant circulated by the circulation unit. The adjustment unit is configured to adjust, in response to a temperature of the refrigerant, a cooling capacity of the cooling unit to cool the refrigerant. The job assignment device includes a processor configured to control, on the basis of cooling capacity information indicating the cooling capacity, job charging to the arithmetic processing devices.

Abstract translation: 信息处理装置包括算术处理装置，冷却装置和作业分配装置。 每个算术处理装置被配置为执行作业。 冷却装置连接到算术处理装置。 冷却装置包括循环单元，冷却单元和调节单元。 循环单元构造成使制冷剂循环通过供给路径。 制冷剂吸收由运算处理装置产生的热量。 冷却单元构造为冷却由循环单元循环的制冷剂。 调整单元被配置为响应于制冷剂的温度来调节冷却单元的冷却制冷剂的冷却能力。 作业分配装置包括：处理器，被配置为基于指示冷却能力的冷却能力信息来控制对算术处理装置的作业充电。

公开(公告)号：US09187684B2

公开(公告)日：2015-11-17

申请号：US12728637

申请日：2010-03-22

Applicant: Dale A. McCants ,  Andrew M. Hayes

Inventor： Dale A. McCants ,  Andrew M. Hayes

IPC: C09K5/00 ,  C09K5/10 ,  C09K5/08 ,  F28D15/00 ,  F28F13/00 ,  G06F1/20 ,  H01L23/473

CPC classification number: C09K5/10 ,  C09K5/08 ,  F28D15/00 ,  F28F13/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A nanofluid is generally provided for use in a heat transfer system. The nanofluid can include nanoparticles suspended in a base liquid at a nanoparticle concentration in the nanofluid of about 0.01% to about 5% by volume. The nanoparticles can include zinc-oxide nanoparticles. The nanofluid for use in a heat transfer system can, in One embodiment, further include a surfactant. Thermal management systems configured to cool a computer having integrated circuits that generate heat during use are also provided. The thermal management system can include a zinc-oxide nanofluid circurated through a series of tubes via a pump such that heat produced by electronic components of the computer can be captured by the circulating nanofluid and then removed from the nanofluid by a radiator.

Abstract translation: 通常提供用于传热系统的纳米流体。 纳米流体可以包括以约0.01体积％至约5体积％的纳米流体中的纳米颗粒浓度悬浮在基础液体中的纳米流体。 纳米颗粒可以包括氧化锌纳米颗粒。 在一个实施方案中，用于传热系统的纳米流体可以进一步包括表面活性剂。 还提供了配置成冷却具有在使用期间产生热量的集成电路的计算机的热管理系统。 热管理系统可以包括经由泵通过一系列管循环的氧化锌纳米流体，使得由计算机的电子部件产生的热可以被循环的纳米流体捕获，然后通过散热器从纳米流体中除去。

公开(公告)号：US20150316334A1

公开(公告)日：2015-11-05

申请号：US14792196

申请日：2015-07-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： TIMOTHY J. CHAINER ,  MILNES P. DAVID ,  MADHUSUDAN K. IYENGAR ,  PRITISH R. PARIDA ,  ROBERT E. SIMONS

IPC: F28F27/02

CPC classification number: H05K7/20836 ,  F28F27/02 ,  G05D23/1932 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: Cooling control methods and systems include measuring a temperature of air provided to one or more nodes by an air-to-liquid heat exchanger; measuring a temperature of at least one component of the one or more nodes and finding a maximum component temperature across all such nodes; comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold; and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the one or more nodes based on the comparisons.

Abstract translation: 冷却控制方法和系统包括通过空气 - 液体热交换器测量提供给一个或多个节点的空气的温度; 测量所述一个或多个节点的至少一个组件的温度并且在所有这些节点之间找到最大组件温度; 将最大分量温度与第一和第二分量阈值进行比较，并将空气温度与第一和第二空气阈值进行比较; 以及基于所述比较，控制所述空气 - 液体热交换器和所述一个或多个节点的冷却剂流量和冷却剂流量的比例。

公开(公告)号：US09176547B2

公开(公告)日：2015-11-03

申请号：US13688861

申请日：2012-11-29

Applicant: LIQUIDCOOL SOLUTIONS, INC.

Inventor： Chad D. Attlesey

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  F28D1/02 ,  F28D15/02 ,  F28F9/007

CPC classification number: G06F1/20 ,  F28D1/02 ,  F28D1/0206 ,  F28D15/02 ,  F28F9/007 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H05K5/067 ,  H05K7/20218 ,  H05K7/20236 ,  H05K7/20772 ,  H01L2924/00

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract translation: 一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。 该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。 该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。 机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。 机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

公开(公告)号：US09158348B2

公开(公告)日：2015-10-13

申请号：US13538162

申请日：2012-06-29

Applicant: Todd Berk ,  Andre S. Eriksen

Inventor： Todd Berk ,  Andre S. Eriksen

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34 ,  F28D15/00

CPC classification number: H05K7/20254 ,  F28D15/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K7/20772

Abstract: A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid.

Abstract translation: 有助于冷却在线存储器模块的系统可以包括散热器，其包括用于容纳在线存储器模块的通道，热界面材料和包括导热冷板和内部液体的液体冷却器块 通道充满循环冷却液。 还公开了使用管来输送冷却流体的系统。