Seamless earbud structures and methods for making the same

    公开(公告)号:US09838770B2

    公开(公告)日:2017-12-05

    申请号:US15006046

    申请日:2016-01-25

    Applicant: Apple Inc.

    Inventor: Jonathan S. Aase

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

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