Abstract:
An air disinfection device aimed at improving the efficiency and quality of air disinfection or sterilization may be achieved through an air disinfection device comprising a body housing a power supply and control unit, which, in turn, comprises an energy storage capacitor, a high-voltage constant current source, an ignition pulse generator, a ferrite-core pulse transformer, and a program control unit. The air disinfection device may also comprise an ultra-violet radiation source in the form of a pulsed gas-discharge lamp mounted on the body and enclosed in a tubular quartz casing. Given that the energy storage capacitor and the pulsed gas-discharge lamp may form a discharge circuit connected to the ignition pulse generator through the ferrite-core pulse transformer, the pulsed gas-discharge lamp may be placed in a bactericidal radiation translucent casing, resulting in convection air-cooling due to a natural draft inside the casing that disinfects and sterilizes surrounding air.
Abstract:
A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma display panel (PDP) adjacent to a first side of the chassis base, and a driving circuit board attached on a second side of the chassis base, the second side being opposite to the first side where the PDP is attached. The plasma display apparatus also includes a driver integrated circuit (IC) electrically connected to electrodes of the PDP and the driving circuit board at a position therebetween, the driver IC selectively providing a voltage to the electrodes of the PDP in accordance with signals controlled by the driving circuit board. The plasma display apparatus also has a heat dissipation unit positioned at the edge of the PDP wherein the heat dissipation unit dissipates heat from the driver IC.
Abstract:
A chassis assembly to reduce a discharge delay in a plasma display apparatus and a plasma display apparatus having the same. The chassis assembly includes a chassis having a thermal conductivity in a range of about 10 W/mK to about 100 W/mK.
Abstract:
A plasma display apparatus includes: a panel on which images are displayed; a circuit board for driving the panel; a chassis base for supporting the panel and the circuit board; a case for accommodating the panel, the circuit board and the chassis base; a signal transfer unit, on which at least one device is mounted, for transmitting electrical signals between the panel and the circuit board by connecting the panel to the circuit board; and a porous protection plate having a plurality of pores, and disposed on an outer surface of the signal transfer unit. In accordance with a further feature of the invention, the case includes a front cabinet disposed in front of the panel, and a porous back cover having a plurality of pores, said porous back cover being disposed on a rear surface of the circuit board and being coupled to the front cabinet.
Abstract:
A display apparatus dissipates heat efficiently from a tape carrier package driver integrated circuit providing an address voltage to a display panel. The display apparatus includes a display panel, a chassis base, a driving circuit, an flexible printed circuit electrically connecting electrodes of the display panel to the driving circuit, and a driver integrated circuit connected through the flexible printed circuit to the display panel, the driver integrated circuit providing a voltage selectively to the electrode of the display panel in accordance with signals controlled by the driving circuit. A thermally conductive medium in liquid-phase or gel-phase is placed between the driver integrated circuit and the chassis base. A pressing plate is placed on the outside of the driver integrated circuit opposite to the chassis base, the pressing plate pressing the driver integrated circuit toward the chassis base for good contact and heat dissipation. A thermally conductive medium is placed between the pressing plate and the driver integrated circuit.
Abstract:
A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device.
Abstract:
The invention presented is a method for applying heat spreaders to a plurality of plasma display panels, including (a) providing a plurality of heat spreader composites, each of which comprises a heat spreader material having an adhesive thereon and a release material positioned such that the adhesive is sandwiched between the heat spreader material and the release material; (b) removing the release material from a plurality of the composites; and (c) applying at least one of the composites to each of the plurality of plasma display panels each such that the adhesive adheres the heat spreader material to the plasma display panel.
Abstract:
A plasma display device having a laminar attachment structure capable of increasing attachment of a heat-dissipating plate to a plasma display panel. Through a laminar attachment structure with a plurality of small pieces of thermal pad or adhesive double tape and a closed loop of thermal pad or adhesive double tape accommodating the plurality of small pieces as well as by means of vacuum pumping, the air within the closed loop is drawn out when the heat-dissipating plate is combined to the plasma display panel so as to reduce bubbles formed between the heat-dissipating plate and the plasma display panel and to increase tight attachment therebetween.
Abstract:
A plasma display panel assembly includes a panel assembly, a chassis base affixed to a rear surface of the panel assembly by an adhesive member, a printed circuit board mounted on a rear surface of the chassis base, a case for containing the panel assembly, the chassis base and the printed circuit board, and a heat absorption layer adapted to absorb heat generated by the panel assembly.
Abstract:
A method involves pre-heating a workpiece to an intermediate temperature, heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, and enhancing cooling of the workpiece. Enhancing cooling may involve absorbing radiation thermally emitted by the workpiece. An apparatus includes a first heating source for heating a first surface of a semiconductor wafer, a second heating source for heating a second surface of the semiconductor wafer, and a first cooled window disposed between the first heating source and the semiconductor wafer.