公开(公告)号：US12252086B2

公开(公告)日：2025-03-18

申请号：US17960761

申请日：2022-10-05

Applicant: Honda Motor Co., Ltd.

Inventor： Takahiro Daibo ,  Hiroshi Suzuki ,  Yusuke Takeuchi

IPC: B60R19/18 ,  B60Q5/00 ,  B60R19/02 ,  B60R19/48

Abstract: The vehicle horn configuration structure includes: a bumper beam arranged at a front of a vehicle and extending in a vehicle left-right direction; a bumper cover arranged at a position forward of the bumper beam in a vehicle front-rear direction; a horn component arranged at a position rearward of the bumper beam in the vehicle front-rear direction, and arranged at a position so that a sound-emitting part faces downward in a vehicle up-down direction and is located above a lower end of the bumper beam; and a duct component extending in the vehicle front-rear direction and arranged at a position located between the horn component and the bumper cover in the vehicle front-rear direction to guide a sound of the horn component to an opening provided on the bumper cover.

公开(公告)号：US12251904B2

公开(公告)日：2025-03-18

申请号：US17728925

申请日：2022-04-25

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takayuki Uchiyama ,  Masashi Matsumoto ,  Takumi Uegane ,  Satoko Monoe ,  Mitsuhiro Nakamura

IPC: B31F5/02 ,  B65H37/04

Abstract: A recording medium processing apparatus includes first teeth that are used for binding processing of a recording medium bundle; second teeth that move toward the first teeth and press the recording medium bundle located between the first teeth and the second teeth; a position detection unit that detects a position of the second teeth; and a control unit that controls movement of the second teeth on the basis of the position detected by the position detection unit.

公开(公告)号：USD1066661S1

公开(公告)日：2025-03-11

申请号：US29901177

申请日：2023-08-30

Applicant: FUJIFILM Corporation

Designer： Ayana Furuta

公开(公告)号：USD1066660S1

公开(公告)日：2025-03-11

申请号：US29901175

申请日：2023-08-30

Applicant: FUJIFILM Corporation

Designer： Ayana Furuta

公开(公告)号：USD1066294S1

公开(公告)日：2025-03-11

申请号：US29915712

申请日：2023-11-02

Applicant: Roland Corporation

Designer： Kohei Hattori ,  Akihito Kimura

公开(公告)号：USD1066233S1

公开(公告)日：2025-03-11

申请号：US29821957

申请日：2022-01-05

Applicant: NIPPON LIGHT METAL COMPANY, LTD. ,  SOODE NAGANO Co,. Ltd.

Designer： Yoshihiko Moriyama ,  Kazuyuki Fujita ,  Takuma Hachisu ,  Donghai Piao ,  Tatsuya Chigusa ,  Takayuki Sode

公开(公告)号：US12250881B2

公开(公告)日：2025-03-11

申请号：US17145412

申请日：2021-01-11

Applicant: FUJIFILM Corporation

Inventor： Tomoaki Yoshioka ,  Tomoyuki Mashiko ,  Koichi Iwasaki

IPC: H10K85/60 ,  H10K30/80 ,  H10K85/20

Abstract: The present invention is to provide a photoelectric conversion element having excellent heat resistance. In addition, an imaging element and an optical sensor which include the photoelectric conversion element are provided. Furthermore, a compound applied to the photoelectric conversion element is provided. A photoelectric conversion element according to the present invention includes a conductive film, a photoelectric conversion film, and a transparent conductive film, in this order, in which the photoelectric conversion film contains a compound represented by Formula (1). In Formula (1), Y1 represents a group represented by Formula (1-1) or a group represented by Formula (1-2).

公开(公告)号：US12250769B2

公开(公告)日：2025-03-11

申请号：US17842796

申请日：2022-06-17

Applicant: Kuan-Yu Chen ,  Hsiao-Lung Lin

Inventor： Kuan-Yu Chen ,  Hsiao-Lung Lin

IPC: H05K1/11 ,  H05K1/05 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.

公开(公告)号：US12249930B2

公开(公告)日：2025-03-11

申请号：US18313362

申请日：2023-05-07

Applicant: Sumitomo Riko Company Limited

Inventor： Shinya Tahara ,  Masaki Nasu ,  Katsuhiko Nakano

IPC: H02N1/00 ,  B06B1/02 ,  H04R1/06 ,  H04R19/00

Abstract: An electrostatic transducer (1) includes: an insulator sheet (11); a first electrode sheet (12); a lead (30); a first bonding part (61), electrically bonding the first electrode sheet (12) with a core wire (30a) of the lead (30) in a first area (Pa) where the first electrode sheet (12) and the core wire (30a) of the lead (30) are disposed overlapping each other; and a second bonding part (62), bonding the insulator sheet (11) with a coating (30b) of the lead (30) in a second area (Pb) where the insulator sheet (11) and the coating (30b) of the lead (30) are disposed overlapping each other.

公开(公告)号：US12249607B2

公开(公告)日：2025-03-11

申请号：US18152781

申请日：2023-01-11

Applicant: United Microelectronics Corp.

Inventor： Sheng Zhang ,  Chunyuan Qi ,  Xingxing Chen ,  Chien-Kee Pang

IPC: H01L27/12 ,  H01L21/762 ,  H01L21/84 ,  H01L21/02

Abstract: Provided are a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a carrier substrate, a trap-rich layer, a dielectric layer, an interconnect structure, a device structure layer and a circuit structure. The trap-rich layer is disposed on the carrier substrate. The dielectric layer is disposed on the trap-rich layer. The interconnect structure is disposed on the dielectric layer. The device structure layer is disposed on the interconnect structure and electrically connected to the interconnect structure. The circuit structure is disposed on the device structure layer and electrically connected to the device structure layer.