公开(公告)号：US20070059865A1

公开(公告)日：2007-03-15

申请号：US11164322

申请日：2005-11-18

Applicant: Chien-Ping Huang ,  Fu-Di Tang

Inventor： Chien-Ping Huang ,  Fu-Di Tang

IPC: H01L21/00

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrier are filled with an encapsulant for encapsulating the chip during the molding process. After the carrier is removed, the part of the encapsulant filling the recessed portions forms outwardly protruded portions on a surface of the encapsulant, such that the semiconductor package can be attached to an external device via the protruded portions.

Abstract translation: 提供了具有支撑结构的半导体封装及其制造方法。 通过将芯片电连接到形成在载体上的电触头，进行成型工艺。 形成在载体上的多个凹部填充有用于在模制过程中封装芯片的密封剂。 在移除载体之后，填充凹部的密封剂的一部分在密封剂的表面上形成向外突出的部分，使得半导体封装可以经由突出部分附接到外部装置。

公开(公告)号：US20070034998A1

公开(公告)日：2007-02-15

申请号：US11580560

申请日：2006-10-12

Applicant: Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

Inventor： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC: H01L23/02

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

Abstract: A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.

Abstract translation: 提供具有积层的晶片级半导体封装，其包括具有用于接收其中的半导体芯片的通孔的玻璃框架，填充在形成在半导体芯片和玻璃框架之间的空间内的低模量缓冲材料， 形成在所述玻璃框架和所述半导体芯片上的堆积层，使得所述积层层电连接到所述半导体芯片，以及安装在所述积层层上的多个导电元件，使得所述半导体芯片电连接 到外部设备。 通过使用玻璃框架和低模量缓冲材料，由此获得的晶片级半导体封装没有翘曲，芯片裂纹和分层问题，并且其可靠性得到提高。 还提供了一种用于制造晶片级半导体封装的方法。

公开(公告)号：US20060292741A1

公开(公告)日：2006-12-28

申请号：US11471516

申请日：2006-06-21

Applicant: Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

Inventor： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC: H01L21/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat-dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted and electrically connected to a substrate. A heat-dissipating structure includes a heat sink and at least one supporting portion, wherein the supporting portion is attached to the substrate at a position outside a predetermined package area for the semiconductor package, and the semiconductor chip is disposed under the heat sink. An encapsulant is formed on the substrate to encapsulate the semiconductor chip and the heat-dissipating structure, wherein a projection area of the encapsulant on the substrate is larger in size than the predetermined package area. A cutting process is performed along edges of the predetermined package area to remove parts of the encapsulant, the supporting portion and the substrate, which are located outside the predetermined package area, so as to form the semiconductor package integrated with the heat-dissipating structure.

Abstract translation: 提供散热半导体封装及其制造方法。 半导体芯片安装并电连接到基板。 散热结构包括散热器和至少一个支撑部分，其中支撑部分在用于半导体封装的预定封装区域外的位置处附接到基板，并且半导体芯片设置在散热器下方。 在基板上形成密封剂以封装半导体芯片和散热结构，其中密封剂在基板上的投影面积大于预定封装面积。 沿着预定包装区域的边缘进行切割处理以去除位于预定包装区域外部的密封剂，支撑部分和基底的部分，以形成与散热结构集成的半导体封装。

公开(公告)号：US20060252245A1

公开(公告)日：2006-11-09

申请号：US11190271

申请日：2005-07-26

Applicant: Chun-Chi Ke ,  Chien-Ping Huang

Inventor： Chun-Chi Ke ,  Chien-Ping Huang

IPC: H01L21/44

CPC classification number: H01L24/03 ,  H01L2224/0401 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014

Abstract: A fabrication method of under bump metallurgy (UBM) structure is provided. A blocking layer is applied over a surface of a semiconductor element formed with at least one bond pad and a passivation layer thereon. The passivation layer covers the semiconductor element and exposes the bond pad, and the blocking layer covers the bond pad and the passivation layer. The blocking layer is formed with at least one opening at a position corresponding to the bond pad. Metallic layers are formed on a surface of the blocking layer and at the opening. The metallic layers are patterned to form a UBM structure at the opening corresponding to the bond pad. Then the blocking layer is removed. The blocking layer can separate the metallic layers for forming the UBM structure from the passivation layer to prevent metallic residues of the UBM structure from being left on the passivation layer.

Abstract translation: 提供了一种凸块下冶金（UBM）结构的制造方法。 在其上形成有至少一个接合焊盘和钝化层的半导体元件的表面上施加阻挡层。 钝化层覆盖半导体元件并暴露接合焊盘，并且阻挡层覆盖接合焊盘和钝化层。 阻挡层在对应于接合焊盘的位置处形成有至少一个开口。 金属层形成在阻挡层的表面和开口处。 金属层被图案化以在对应于接合焊盘的开口处形成UBM结构。 然后去除阻挡层。 阻挡层可以将用于形成UBM结构的金属层与钝化层分开，以防止UBM结构的金属残留物残留在钝化层上。

公开(公告)号：US07127377B2

公开(公告)日：2006-10-24

申请号：US11014960

申请日：2004-12-20

Applicant: Chien-Ping Huang ,  Hsin-Dar Tang

Inventor： Chien-Ping Huang ,  Hsin-Dar Tang

IPC: G06F11/00 ,  G06F15/00 ,  G06F1/00

CPC classification number: F04D27/001

Abstract: A monitoring method to monitor efficiency of air-blowing devices in a ventilation system. First, an optimal system curve is provided. Then, the air-blowing devices are activated with a first current frequency to obtain a first fan performance curve of the air-blowing devices according to the first current frequency and a test record. Next, first flow rates of the air-blowing devices are detected, and first system curves and efficiencies of the air-blowing devices are obtained by comparing the first flow rates with the first fan performance curve.

Abstract translation: 一种监测通风系统中吹风装置效率的监测方法。 首先，提供一个最佳的系统曲线。 然后，利用第一电​​流频率激活吹风装置，以根据第一当前频率和测试记录获得吹风装置的第一风扇性能曲线。 接下来，检测送风装置的第一流量，并且通过将第一流量与第一风扇性能曲线进行比较来获得吹气装置的第一系统曲线和效率。

公开(公告)号：US07084474B2

公开(公告)日：2006-08-01

申请号：US10959786

申请日：2004-10-05

Applicant: Chia-Yu Hung ,  Chien-Ping Huang ,  Ke-Chuan Yang

Inventor： Chia-Yu Hung ,  Chien-Ping Huang ,  Ke-Chuan Yang

IPC: H01L31/0232 ,  H01L31/0203

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A photosensitive semiconductor package and a method for fabricating the same are proposed. The package includes a carrier having a first surface, an opposite second surface, and an opening penetrating the carrier; a photosensitive chip having an active surface and a non-active surface, wherein a plurality of bond pads are formed close to edges of the active surface, and the chip is mounted via corner positions of its active surface to the second surface of the carrier, with the bond pads being exposed via the opening; a plurality of bonding wires formed in the opening, for electrically connecting the bond pads of the chip to the first surface of the carrier; a light-penetrable unit attached to the active surface of the chip and received in the opening; and an encapsulant for encapsulating the bonding wires and peripheral sides of the chip to seal the opening.

Abstract translation: 提出了一种光敏半导体封装及其制造方法。 该包装包括具有第一表面，相对的第二表面和穿透载体的开口的载体; 具有活性表面和非活性表面的感光芯片，其中多个接合焊盘形成在靠近有源表面的边缘处，并且芯片通过其有源表面的拐角位置安装到载体的第二表面， 接合垫通过开口露出; 形成在所述开口中的多个接合线，用于将所述芯片的接合焊盘电连接到所述载体的所述第一表面; 附着在芯片的活动表面并容纳在开口中的可透光单元; 以及用于封装芯片的接合线和周边的密封剂以密封开口。

公开(公告)号：US07057276B2

公开(公告)日：2006-06-06

申请号：US10690921

申请日：2003-10-21

Applicant: Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

Inventor： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L23/367 ,  H01L23/3672 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2224/05599

Abstract: A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.

Abstract translation: 提供了具有散热器的半导体封装。 连接到芯片的至少一个芯片和散热片安装在基板上。 在连接到基板的位置处，通过散热器的至少一个角部形成至少一个槽。 将粘合剂材料施加在散热器和衬底之间并且在填充在槽中并且粘合剂材料溢出出槽之外。 填充在槽中的粘合剂材料提供锚定效果并增加其与散热器的接触面积，从而将散热器牢固地固定在基板上。 此外，形成在散热器角落处的槽可以减轻积聚在散热器拐角处的热应力，从而防止散热器和基板之间的分层。

公开(公告)号：US20060103014A1

公开(公告)日：2006-05-18

申请号：US11232612

申请日：2005-09-21

Applicant: Chien-Ping Huang ,  Cheng-Hsu Hsiao

Inventor： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC: H01L23/34

CPC classification number: H01L24/97 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for encapsulating the chip, with a non-active surface of the chip being exposed from the encapsulant; and a heat spreader having a hollow portion and attached to the encapsulant, wherein the chip is received in the hollow portion and the non-active surface of the chip is completely exposed to the hollow portion, such that heat generated by the chip can be directly dissipated out of the package structure. The present invention also provides a method for fabricating the heat dissipating package structure.

Abstract translation: 散热封装结构包括芯片载体; 安装并电连接到芯片载体的半导体芯片; 形成在所述芯片载体上并用于封装所述芯片的密封剂，所述芯片的非活性表面从所述密封剂暴露出来; 以及具有中空部分并附着到密封剂的散热器，其中芯片被容纳在中空部分中，并且芯片的非活动表面完全暴露于中空部分，使得芯片产生的热量可以直接 从包装结构中消散掉。 本发明还提供一种制造散热封装结构的方法。

公开(公告)号：US20060091527A1

公开(公告)日：2006-05-04

申请号：US11026880

申请日：2004-12-29

Applicant: Ho-Yi Tsai ,  Chien-Ping Huang

Inventor： Ho-Yi Tsai ,  Chien-Ping Huang

IPC: H01L23/34

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

Abstract translation: 提出了具有散热器的半导体封装及其制造方法。 散热器在其顶表面上设置有刚性和耐热的分离构件，并且经由其底表面附接到安装在芯片载体上的芯片。 分离构件的尺寸大于散热器，并且可以容易地从散热器的顶表面去除。 随后，进行模制处理以形成用于完全封装芯片，散热器和分离构件的密封剂。 然后，进行切割处理，以沿着位于散热片的侧面和分离构件的相应侧面之间的预定切割线切割。 最后，分离构件和形成在分离构件上的密封剂的一部分从散热器移除。 上述制造方法降低了包装成本。

公开(公告)号：US07019406B2

公开(公告)日：2006-03-28

申请号：US10635168

申请日：2003-08-05

Applicant: Chien-Ping Huang ,  Cheng-Hsu Hsiao

Inventor： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/97 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83385 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

Abstract: A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.

Abstract translation: 提供一种热增强型半导体封装及其制造方法。 在芯片的有源表面上的接合焊盘上形成多个导电凸块。 散热器附着在芯片的非活性表面上，其表面积大于芯片的表面积。 封装体封装散热器，芯片和导电凸块，同时暴露散热片的底部或表面，而不是将散热片和导电凸块的端部外露。 多个导电迹线形成在封装主体上并电连接到导电凸块的端部。 焊接掩模层施加在导电迹线上并形成有多个用于暴露导电迹线的预定部分的开口。 在导电迹线的每个暴露部分上注入焊球。