公开(公告)号：US20140167908A1

公开(公告)日：2014-06-19

申请号：US14185310

申请日：2014-02-20

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Pascal Fornara ,  Christian Rivero ,  Antonio di-Giacomo

IPC: H01H37/52

CPC classification number: H01H37/52 ,  B81B3/0024 ,  G01K3/005 ,  G01K5/486 ,  H01L23/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit comprising a mechanical device for electrical switching comprising a first assembly being thermally deformable and having a beam held at at least two different locations by at least two arms, the beam and the arms being metal and disposed within the same metallization level, and further comprising at least one electrically conducting body. The first assembly has a first configuration at a first temperature and a second configuration at a second temperature different from the first temperature. The beam is out of contact with the electrically conducting body in one configuration in contact with the body in the other configuration. The beam establishes or breaks an electrical link passing through the said at least one electrically conducting body and through the said beam in the different configurations.

Abstract translation: 一种集成电路，包括用于电开关的机械装置，包括可热变形的第一组件，并且具有通过至少两个臂保持在至少两个不同位置处的梁，所述梁和所述臂是金属并且设置在相同的金属化水平内，以及 还包括至少一个导电体。 第一组件具有在第一温度下的第一构型和在与第一温度不同的第二温度下的第二构型。 在与另一种结构中的身体接触的一种结构中，光束与导电体脱离接触。 光束建立或断开通过所述至少一个导电体并通过所述光束的不同构造的电连接。

公开(公告)号：US08704327B2

公开(公告)日：2014-04-22

申请号：US13688022

申请日：2012-11-28

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio di-Giacomo

IPC: H01L31/058

CPC classification number: H01L28/40 ,  G01K5/486 ,  G01K5/62

Abstract: An integrated circuit, comprising a capacitive device having a thermally variable capacitive value and comprising a thermally deformable assembly disposed within an enclosure, and comprising an electrically-conducting fixed body and a beam held at least two different locations by at least two arms rigidly attached to edges of the enclosure, the beam and the arms being metal and disposed within the first metallization level. A part of the said thermally deformable assembly may form a first electrode of the capacitive device and a part of the said fixed body may form a second electrode of the capacitive device. The thermally deformable assembly has a plurality of configurations corresponding respectively to various temperatures of the said assembly and resulting in a plurality of distances separating the two electrodes and various capacitive values in the capacitive device corresponding to the plurality of distances.

Abstract translation: 一种集成电路，包括具有热可变电容值的电容性装置，并且包括设置在外壳内的热变形组件，并且包括导电固定体和通过至少两个不同位置保持的梁，刚性地连接至 外壳的边缘，梁和臂是金属的并且设置在第一金属化层内。 所述热变形组件的一部分可以形成电容性装置的第一电极，并且所述固定体的一部分可以形成电容性装置的第二电极。 热变形组件具有分别对应于所述组件的各种温度的多个构造，并且导致分离两个电极的多个距离和对应于多个距离的电容性装置中的各种电容值。