公开(公告)号：US20020063269A1

公开(公告)日：2002-05-30

申请号：US09982333

申请日：2001-10-18

Inventor： Joseph T. DiBene II

IPC: H01L029/80 ,  H01L023/48 ,  H01L029/40

CPC classification number: H05K1/024 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P1/184 ,  H01Q3/36 ,  H05K2201/0187 ,  H05K2201/0269 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A method, apparatus, article of manufacture, and a memory structure for selectively phase shifting one or more frequency components of a signal is described. The apparatus comprises a conductor, a ground plane, a dielectric disposed between the ground plane and the conductor, wherein the dielectric is characterized by a non-homogeneous dielectric constant.

Abstract translation: 描述了用于选择性地相移信号的一个或多个频率分量的方法，装置，制品和存储器结构。 该设备包括导体，接地平面，设置在接地平面和导体之间的电介质，其中电介质的特征在于非均匀的介电常数。

公开(公告)号：US06261671B1

公开(公告)日：2001-07-17

申请号：US09402475

申请日：1999-10-12

Applicant: Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

Inventor： Motoo Asai ,  Yoshitaka Ono ,  Masato Kawade ,  Kouta Noda ,  Youko Nishiwaki

IPC: B32B300

CPC classification number: H05K3/4676 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/24 ,  C23C18/405 ,  C23C18/50 ,  C23C18/54 ,  H05K3/4673 ,  H05K2201/0212 ,  H05K2201/0269 ,  H05K2203/0773 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917

Abstract: The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

Abstract translation: 公开了用于化学镀的粘合剂，其有利于确保线间和层之间的绝缘可靠性同时保持实用的剥离强度，并且使用粘合剂的印刷电路板。 粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为 不超过1.5个妈妈。

公开(公告)号：US5293504A

公开(公告)日：1994-03-08

申请号：US949598

申请日：1992-09-23

Applicant: John U. Knickerbocker ,  Charles H. Perry ,  Donald R. Wall

Inventor： John U. Knickerbocker ,  Charles H. Perry ,  Donald R. Wall

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/4061 ,  H01L23/49866 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0269 ,  H05K2201/0352 ,  H05K2201/096 ,  H05K3/4611 ,  H05K3/4629

Abstract: Disclosed is a multilayer ceramic substrate for electronic applications including:(a) at least one internal layer having vias at least partially filled with a metallic material;(b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer; and(c) a cap of material interposed between the aligned vias.Also disclosed is a method of forming the multilayer ceramic substrate.

Abstract translation: 公开了一种用于电子应用的多层陶瓷基板，包括：（a）至少一个内部层，其具有至少部分地填充有金属材料的通孔; （b）至少一个密封层，其具有至少部分填充有陶瓷和金属材料的混合物的复合材料的通孔，其中来自内层的至少一个通孔与来自密封层的至少一个通孔对准; 和（c）插入在对齐的通孔之间的材料盖。 还公开了形成多层陶瓷基板的方法。