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公开(公告)号：US10691274B2
公开(公告)日：2020-06-23
申请号：US16252165
申请日：2019-01-18
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Yu-Ju Chen
Abstract: A touch sensor with enhanced and small-scale sensitivity includes a substrate, a piezoelectric layer on the substrate, a first electrode layer between the substrate and the piezoelectric layer, a second electrode layer on the piezoelectric layer, and an outer touch layer. The touch layer is made of flexible and deformable material. The touch layer includes a base layer covering the second electrode layer and finely-shaped protrusions protruding from a surface of the base layer away from the piezoelectric layer. The base layer and the protrusions are integrally formed. The disclosure also provides a method for making such touch sensor.
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公开(公告)号：US10656736B2
公开(公告)日：2020-05-19
申请号：US16002390
申请日：2018-06-07
Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Po Ching Lin
Abstract: A curved touch module structure and a method for laminating the same, which are the theremoplastic technologies, are used to solve the problem with wrinkles at stress-accumulated positions easily caused by a laminated material during a process of laminating a curved surface. The internal curved surface of an appearance-protecting layer has a planar structure whose position corresponds to the bonding area of a touch element layer. When the touch element layer is theremoplastically laminated to the curved surface of the appearance-protecting layer, the first bonding pads of the bonding area are formed on the planar structure. As a result, when a rear-end process for hot pressing and bonding is performed, a bonding platform needs to be designed according to the shape and curvature of products without modifying the other existing elements, thereby increasing the fabrication yield and reducing the production cost.
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公开(公告)号：US10461497B1
公开(公告)日：2019-10-29
申请号：US16233112
申请日：2018-12-27
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Hsien-Ying Chou , Chun-Ta Chen , Fu-Cheng Wei , Chih-Lin Liao
Abstract: A light emitting device includes a substrate, a light emitting element, a shielding layer, and a collimator. The light emitting element is embedded in the substrate. The shielding layer is disposed on the substrate and has an opening exposing the light emitting element. The collimator is disposed on the shielding layer.
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公开(公告)号：US20190317618A1
公开(公告)日：2019-10-17
申请号：US16002390
申请日：2018-06-07
Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： PO CHING LIN
Abstract: A curved touch module structure and a method for laminating the same, which are the theremoplastic technologies, are used to solve the problem with wrinkles at stress-accumulated positions easily caused by a laminated material during a process of laminating a curved surface. The internal curved surface of an appearance-protecting layer has a planar structure whose position corresponds to the bonding area of a touch element layer. When the touch element layer is theremoplastically laminated to the curved surface of the appearance-protecting layer, the first bonding pads of the bonding area are formed on the planar structure. As a result, when a rear-end process for hot pressing and bonding is performed, a bonding platform needs to be designed according to the shape and curvature of products without modifying the other existing elements, thereby increasing the fabrication yield and reducing the production cost.
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公开(公告)号：US10414122B2
公开(公告)日：2019-09-17
申请号：US15459409
申请日：2017-03-15
Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Chin-Yang Wu
IPC: B32B7/02 , B32B27/36 , G06F3/00 , B29C45/14 , B29L31/30 , B29K69/00 , B29K633/04 , B29K669/00 , B29L31/34
Abstract: A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming. The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.
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Patent Agency Ranking
公开(公告)号：US10386979B2
公开(公告)日：2019-08-20
申请号：US15818776
申请日：2017-11-21
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Chun-Ming Chen
Abstract: The present disclosure provides a touch panel structure, including a display device, a dielectric layer, a first sensing circuit, a second sensing circuit and a shielding layer. The dielectric layer is disposed on the display device. The first sensing circuit includes a plurality of first sensing electrodes and a plurality of conducting bridges, wherein the first sensing electrodes are disposed on the dielectric layer, and the conducting bridges are disposed between the dielectric layer and the display device. Adjacent ones of the first sensing electrodes are electrically connected with each other through one of the conducting bridges. The second sensing circuit includes a plurality of second sensing electrodes, which are disposed on the dielectric layer. The second sensing circuit is insulated from and crosses the first sensing circuit. The shielding layer is disposed between the dielectric layer and the display device and coplanar with the conducting bridges.
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公开(公告)号：US20190239359A1
公开(公告)日：2019-08-01
申请号：US15947858
申请日：2018-04-08
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Shuenn-Ching WANG
Abstract: The present disclosure provides a printed circuit board connecting structure including a first printed circuit board, a protection layer, an ACF (anisotropy conductive film), and a second printed circuit board. The first printed circuit board includes a first circuit. The protection layer covers a first area of the first circuit. The ACF covers a second area of the first circuit and extending to the protection layer. The second printed circuit board includes a second circuit facing the first circuit. The second printed circuit board partially overlaps with the ACF on the second area of the first circuit, and there is a gap between the second printed circuit board and the protection layer.
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公开(公告)号：US10275632B2
公开(公告)日：2019-04-30
申请号：US15224653
申请日：2016-07-31
Inventor： Chun-Chi Chen , Shang-Yu Huang , Chen-You Chen , Shih-Yu Wang
IPC: G06K9/00 , G02F1/1362 , G02F1/1335 , G02F1/1368 , G02F1/1333 , G02F1/1343 , G02F1/133
Abstract: A display apparatus which is also able to receive and identify fingerprints comprises a first substrate, a second substrate, a liquid crystal layer, a plurality of dummy pixel units located in a non-display region, a fingerprint identification module, and a plurality of data extending lines. Each of the dummy units comprises first and second auxiliary electrodes. The fingerprint identification module comprises signal transmitting layer and signal receiving components on the signal transmitting layer. The signal receiving component receives reflected ultrasonic wave and converts the received waves into fingerprint signal. The data extending line is electrically connected with the dummy pixel unit. The signal receiving component transmits the fingerprint signals to the at least one first auxiliary electrode and the data extending line thus receives the fingerprint signal.
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公开(公告)号：US20190121460A1
公开(公告)日：2019-04-25
申请号：US15907414
申请日：2018-02-28
Applicant: INTERFACE OPTOELECTRONIC (CHENGDU) CO., LTD , INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： HSIAO-CHUN TING
Abstract: An acoustic touch device able to distinguish between user finger touches and other noise-making events includes ultrasonic transmitting and receiving units, and a controller. The ultrasonic receiving unit generates low-frequency electrical signals when the acoustic touch device is touched by an external object or affected by acoustic noise. The low frequency electrical signals cause variation in the output electrical signals of the ultrasonic receiving unit. The controller is configured to power on or power off the ultrasonic transmitting unit according to such variation.
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公开(公告)号：US20190009302A1
公开(公告)日：2019-01-10
申请号：US15940917
申请日：2018-03-29
Applicant: INTERFACE OPTOELECTRONIC (CHENGDU) CO., LTD , INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： XIAO-BING ZHENG
IPC: B06B1/06 , H01L41/113 , H01L41/09 , H01L41/187 , H01L41/18 , H01L41/04 , H01L41/311 , H01L41/338
Abstract: A thin-profile ultrasonic sensor includes a piezoelectric material layer having a first surface and a second surface, a plurality of thin film transistors (TFTs) on the first surface, and an electrode layer on the second surface. The first surface and the second surface are on opposite sides facing away from each other. The piezoelectric material layer is configured as a substrate to support the plurality of TFTs, no other substrate being required. The piezoelectric material layer is configured to transmit and receive ultrasonic signals.
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