公开(公告)号：US20250044609A1

公开(公告)日：2025-02-06

申请号：US18920130

申请日：2024-10-18

Applicant: Texas Instruments Incorporated

Inventor： Alexander Lyubarsky

IPC: G02B30/35 ,  G02B3/08 ,  G02B26/08 ,  G02B27/01 ,  G02B27/18 ,  G02B30/36 ,  H04N13/32 ,  H04N13/324 ,  H04N13/351

Abstract: An example device includes a screen, a first light source configured to emit a first light at a first angle during a first time period and a second light source configured to emit a second light at a second angle during a second time period. The second angle is different than the first angle. The second time period is different than the first time period. The device includes a spatial light modulator configured to provide a first view of digital content based on the first angle of the first light emitted during the first time period and a second view of the digital content based on the second angle of the second light emitted during the second time period and projection optics configured to project the first view and the second view for presentation via the screen.

公开(公告)号：US20250044576A1

公开(公告)日：2025-02-06

申请号：US18924372

申请日：2024-10-23

Applicant: Texas Instruments Incorporated

Inventor： Patrick Ian Oden ,  James Norman Hall

IPC: G02B26/08 ,  G02B6/35

Abstract: In accordance with at least one example of the description, a microelectromechanical systems (MEMS) device includes a hinge. The MEMS device also includes a spring tip. Additionally, the MEMS device includes a top layer including a recessed shelf and a top surface, where the recessed shelf is coupled to the hinge.

公开(公告)号：US12219450B2

公开(公告)日：2025-02-04

申请号：US17850784

申请日：2022-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yaron Alpert ,  Maxim Altshul ,  Yaniv Weizman

IPC: H04W4/80 ,  H04W76/15

Abstract: In an example, a method includes communicating between a first BLUETOOTH device and a second BLUETOOTH device via a first channel within a channel set at a first connection event using first channel specific parameters. The method also includes determining, by the first BLUETOOTH device, one or more channel cluster operation parameters for a second channel within the channel set at a second connection event using second channel specific parameters. The method includes communicating over the second channel during the second connection event from the first BLUETOOTH device to the second BLUETOOTH device using renegotiated second channel specific parameters.

公开(公告)号：US12219156B2

公开(公告)日：2025-02-04

申请号：US17726463

申请日：2022-04-21

Applicant: Texas Instruments Incorporated

Inventor： Ajit Deepak Gupte ,  Ranga Ramanujam Srinivasan

IPC: H04N19/107 ,  H04N19/147 ,  H04N19/176 ,  H04N19/186

Abstract: Several methods and systems for chroma residual data prediction for encoding blocks corresponding to video data are disclosed. In an embodiment, at least one coefficient correlating reconstructed luma residual samples and corresponding reconstructed chroma residual samples is computed for one or more encoded blocks of video data. Predicted chroma residual samples are generated for encoding a block of video data based on corresponding reconstructed luma residual samples and the at least one coefficient.

公开(公告)号：US12218190B2

公开(公告)日：2025-02-04

申请号：US17731510

申请日：2022-04-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Alexei Sadovnikov ,  Guruvayurappan S. Mathur

IPC: H01L29/06 ,  H01L21/762 ,  H01L29/78

Abstract: A method of manufacturing an integrated circuit includes forming first and second false collector regions of a first conductivity type adjacent to a surface of an epitaxial layer of semiconductor material. The first false collector region is located laterally on a first side of a base region. The base region is formed within the epitaxial layer and has a second conductivity type. The second false collector region is located laterally on a second side of the base region. The second side is opposite the first side of the base region. The base region is a base of a parasitic bipolar junction in an isolation region of an active semiconductor device.

公开(公告)号：US20250039859A1

公开(公告)日：2025-01-30

申请号：US18227821

申请日：2023-07-28

Applicant: Texas Instruments Incorporated

Inventor： Ariton Xhafa ,  Yaron Alpert

IPC: H04W72/12 ,  H04W72/50 ,  H04W72/566

Abstract: An example apparatus includes: interface circuitry; and programmable circuitry configured to: transmit a first schedule to a set of battery modules, the first schedule to assign transmission slots to one or more of the set of battery modules for a first communication period; create a second schedule different from the first schedule; and transmit the second schedule to the set of battery modules, the second schedule to assign transmission slots to one or more of the set of battery modules for a second communication period.

公开(公告)号：US20250038644A1

公开(公告)日：2025-01-30

申请号：US18359387

申请日：2023-07-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Janne PAHKALA ,  Ari VAANANEN

IPC: H02M1/088 ,  H02M1/00 ,  H02M1/14 ,  H02M3/158

Abstract: A circuit includes a controller. The controller includes: a first control circuit; a second control circuit; a detection circuit; mode control logic; and driver circuitry. A first input of the mode control logic is coupled to an output of the first control circuit. A second input of the mode control logic coupled to an output of the second control circuit. A third input of the mode control logic is coupled to an output of the detection circuit. A first input of the driver circuitry is coupled to a first output of the mode control logic. A second input of the driver circuitry is coupled to a second output of the mode control logic.

公开(公告)号：US20250038077A1

公开(公告)日：2025-01-30

申请号：US18360873

申请日：2023-07-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： CHU-YUN LO ,  MEGAN CHANG ,  YUH-HARNG CHIEN

IPC: H01L23/495

Abstract: An electronic device includes a leadframe having a die pad, inner leads, and outer leads. The die is attached to the die pad, where the die includes an active side. Lead locks are disposed adjacent to the inner leads. The lead locks include a side support disposed on each side of the inner leads and an opening defined between each side support and the inner leads. Wire bonds are attached from the active side of the die to the inner leads and a mold compound is formed to encapsulate the die, the inner leads, the lead locks, and the wire bonds.

公开(公告)号：US20250038009A1

公开(公告)日：2025-01-30

申请号：US18361747

申请日：2023-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kengo Aoya ,  Masamitsu Matsuura ,  Daiki Komatsu

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor package has a relief recess in the mold compound, extending around the perimeter over the leads. The relief recess has a relief width greater than a thickness of the leads under the relief recess. Top surfaces of the leads may be exposed at the relief recess, or may be covered by the mold compound under the relief recess. In both cases, a height difference between the mold compound under the relief recess and the leads under the relief recess is less than the thickness of the leads under the relief recess. A majority of exposed side faces of the leads are characteristic of sawn surfaces, which includes leads being free of vertical striations or having burrs along bottom edges. The semiconductor package is singulated by sawing through the leads.

公开(公告)号：US20250036573A1

公开(公告)日：2025-01-30

申请号：US18914845

申请日：2024-10-14

Applicant: Texas Instruments Incorporated

Inventor： Naveen Bhoria ,  Timothy David Anderson ,  Pete Michael Hippleheuser

IPC: G06F12/128 ,  G06F9/30 ,  G06F9/54 ,  G06F11/10 ,  G06F12/02 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0806 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/0817 ,  G06F12/0853 ,  G06F12/0855 ,  G06F12/0864 ,  G06F12/0884 ,  G06F12/0888 ,  G06F12/0891 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/12 ,  G06F12/121 ,  G06F12/126 ,  G06F12/127 ,  G06F13/16 ,  G06F15/80 ,  G11C5/06 ,  G11C7/10 ,  G11C7/22 ,  G11C29/42 ,  G11C29/44

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for read-modify-write support in multi-banked data RAM cache for bank arbitration. An example data cache system includes a store queue including a plurality of bank queues including a first bank queue having a write and read port configured to receive a respective write and read operation, storage coupled to the store queue including a plurality of data banks including a first data bank having a first port configured to receive the write or the read operation, first through third multiplexers, and bank arbitration logic including first arbiters including a first arbiter and second arbiters including a second arbiter, the first arbiter coupled to the second arbiter, the second and third multiplexers, the second arbiter coupled to the first multiplexer.