Abstract:
The disclosed embodiments relate to a technique for inductively charging an electronic device. This technique involves winding an audio cable for the electronic device around a charging mechanism multiple times so that one or more conductors in the audio cable form an inductive receiving coil. Next, a magnetic field is created through the charging mechanism to induce a current in the inductive receiving coil. Finally, the induced current in the inductive receiving coil is used to charge a rechargeable battery for the electronic device.
Abstract:
Apparatus, systems and methods for shock mounting glass for an electronic device are disclosed. The glass for the electronic device can provide an outer surface for at least a portion of a housing for the electronic device. In one embodiment, the shock mounting can provide a compliant interface between the glass and the electronic device housing. In another embodiment, the shock mounting can provide a mechanically actuated retractable. For example, an outer glass member for an electronic device housing can be referred to as cover glass, which is often provided at a front surface of the electronic device housing.
Abstract:
Apparatus, systems and methods for characteristics of glass components through use of one or more coatings are disclosed. The coatings are typically thin coatings, such as thin film coatings. The coatings can serve to increase strength of the glass components and/or provide durable user interfacing surfaces. Accordingly, glass articles that have received coatings are able to be not only thin but also sufficiently strong so as to resist damage from impact events. The coated glass articles are well suited for use in consumer products, such as consumer electronic devices (e.g., electronic devices).
Abstract:
Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.
Abstract:
Flexible printed circuit structures may be provided that have regions with different electrical and mechanical properties. A flexible printed circuit substrate may be formed from a sheet of polymer having different regions with different thicknesses. The flexible printed circuit substrate may be bent in a thin region of the substrate. Additional flexible printed circuit substrate portions may be coupled to the flexible printed circuit substrate. The additional portions may have different substrate thicknesses. A groove or other recess may be formed in a flexible printed circuit substrate to promote bending. Openings may also be formed in the substrate to promote bending.