SYSTEMS AND METHODS FOR SUPPRESSING SOUND LEAKAGE

    公开(公告)号:US20220217477A1

    公开(公告)日:2022-07-07

    申请号:US17656217

    申请日:2022-03-23

    Inventor: Xin QI Fengyun LIAO

    Abstract: A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.

    LOUDSPEAKERS AND ELECTRONIC DEVICES
    112.
    发明申请

    公开(公告)号:US20250159413A1

    公开(公告)日:2025-05-15

    申请号:US19026713

    申请日:2025-01-17

    Abstract: A loudspeaker and an electronic device are provided. The loudspeaker includes a basket and a coil. The coil includes an annular body and a lead wire connected with the annular body. The annular body is located on an inner side of the basket. The lead wire moves along with the annular body relative to the basket after an excitation signal is input into the loudspeaker. A soldering pad is disposed on the basket. The lead wire is provided with a first end close to the annular body and a second end away from the annular body. The second end is fixed on the soldering pad. A ratio of a length of the lead wire to a maximum amplitude of a movement of the coil relative to the basket is in a range of 8-75. The technical problem of stress concentration in the lead wire is improved.

    ACOUSTIC DEVICES
    113.
    发明申请

    公开(公告)号:US20250131906A1

    公开(公告)日:2025-04-24

    申请号:US19007599

    申请日:2025-01-02

    Abstract: The present disclosure provides an acoustic device including a microphone array, a processor, and at least one speaker. The microphone array may be configured to acquire an environmental noise. The processor may be configured to estimate a sound field at a target spatial position using the microphone array. The target spatial position may be closer to an ear canal of a user than each microphone in the microphone array. The processor may be configured to generate a noise reduction signal based on the environmental noise and the sound field estimation of the target spatial position. The at least one speaker may be configured to output a target signal based on the noise reduction signal. The target signal may be used to reduce the environmental noise. The microphone array may be arranged in a target area to minimize an interference signal from the at least one speaker to the microphone array.

    ACOUSTIC OUTPUT DEVICE
    114.
    发明申请

    公开(公告)号:US20250119680A1

    公开(公告)日:2025-04-10

    申请号:US18983424

    申请日:2024-12-17

    Abstract: The present disclosure provides an acoustic output device. The acoustic output device may comprise a bone conduction speaker configured to generate bone conduction acoustic waves. The acoustic output device may also comprise an air conduction speaker configured to generate air conduction acoustic waves, the air conduction speaker being independent of the bone conduction speaker. The acoustic output device may further comprise at least one housing configured to accommodate the bone conduction speaker and the air conduction speaker.

    TOUCH SENSOR DEVICES
    115.
    发明申请

    公开(公告)号:US20250085816A1

    公开(公告)日:2025-03-13

    申请号:US18955929

    申请日:2024-11-21

    Abstract: The embodiments of the present disclosure provide a touch sensor device. The touch sensor device comprises a housing, configured to provide a touch region; and at least one sensor, configured to be fixed near the touch region. The at least one sensor includes: a signal transmitting unit, configured to generate a vibration signal under the action of an excitation signal; a signal receiving unit, configured to receive the vibration signal and generate an output signal; and a processor, configured to recognize a touch operation performed on the touch region according to the output signal.

    ACOUSTIC OUTPUT DEVICES
    116.
    发明申请

    公开(公告)号:US20250071471A1

    公开(公告)日:2025-02-27

    申请号:US18942755

    申请日:2024-11-10

    Abstract: Embodiments of the present disclosure provide an acoustic output device including: a transducer configured to generate a mechanical vibration based on an electrical signal, the transducer including a magnetic circuit assembly and a vibration transmission sheet; a housing configured to accommodate the transducer, the housing including a panel and a shell, the magnetic circuit assembly being elastically connected to the housing through the vibration transmission sheet, and the transducer transmitting the mechanical vibration to a user through the panel; and an additional element connected to the magnetic circuit assembly. The additional element is elastically connected to the panel through the magnetic circuit assembly.

    BONE CONDUCTION MICROPHONE
    118.
    发明申请

    公开(公告)号:US20250030979A1

    公开(公告)日:2025-01-23

    申请号:US18908861

    申请日:2024-10-08

    Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.

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