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公开(公告)号：US20200076995A1
公开(公告)日：2020-03-05
申请号：US16170535
申请日：2018-10-25
Inventor： DING-NAN HUANG , CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H04N5/225
Abstract: A camera module with a strong and stable mounting which is geometrically precise includes a printed circuit board, an optical bearing structure, and an image sensor. The printed circuit board includes a mounting surface, the mounting surface defining a conductive circuit area and a surrounding non-conductive peripheral area. The peripheral area comprises a first contact layer, the first contact layer is frame-like and a size of the first contact layer is same as a size of bottom of the optical bearing structure. The optical bearing structure is on the first contact layer and carries a lens module. The image sensor is mounted on the conductive circuit area.
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公开(公告)号：US20200018949A1
公开(公告)日：2020-01-16
申请号：US16220307
申请日：2018-12-14
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： XIAO-MEI MA , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
Abstract: A camera device proofed against ghosting and light flare includes a printed circuit board, an image sensor mounted on the printed circuit board, a supporting bracket fixed on the printed circuit board, and a lens module. The supporting bracket includes supporting plate and perpendicular side wall, the supporting plate and the side wall together forming a receiving room over the image sensor. The supporting plate has a central through hole for light ingress and a flange barrier protruding. The protruding flange barrier surrounds the light through hole, the lens module is fixed on the supporting surface, and the protruding flange barrier locates inside an inner side surface of the lens module.
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Patent Agency Ranking
公开(公告)号：US20200014893A1
公开(公告)日：2020-01-09
申请号：US16051125
申请日：2018-07-31
Inventor： JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG , SHIN-WEN CHEN
Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.
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公开(公告)号：US20200003988A1
公开(公告)日：2020-01-02
申请号：US16182564
申请日：2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： KUN LI , SHIN-WEN CHEN , KE-HUA FAN , LONG-FEI ZHANG
Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket on the circuit board has the image sensor. The optical filter on the mounting bracket is above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board by a frame of adhesive. The surface of the mounting bracket facing away from the circuit board has positioning posts at corners of the surface of the mounting bracket. A surface of the lens unit connected to the mounting bracket has receiving grooves positioned at corners of the surface of the lens unit. The positioning posts are inserted into the receiving grooves.
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公开(公告)号：US20190335070A1
公开(公告)日：2019-10-31
申请号：US15979600
申请日：2018-05-15
Inventor： KE-HUA FAN , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
Abstract: A method for assembling a lens module to be free of dust and other pollutants includes providing a circuit board, an image sensor, an optical filter, and a mounting frame. The image sensor is connected to the circuit board. The optical filter is glued to the top side of the mounting frame, and the bottom side of the mounting frame is connected to the circuit board. The optical filter, the mounting frame, and the circuit board define a closed space receiving the image sensor. A lens is mounted in a lens holder to form a lens unit and the lens holder is attached to the circuit board, to position the lens above the image sensor, thereby obtaining the finished lens module.
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公开(公告)号：US20190170994A1
公开(公告)日：2019-06-06
申请号：US15856081
申请日：2017-12-28
Inventor： KUN LI , SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING
CPC classification number: G02B21/361 , G02B7/006 , G02B7/08 , G02B21/0008 , G02B21/02 , G02B21/362
Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.
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公开(公告)号：US20190129281A1
公开(公告)日：2019-05-02
申请号：US15832596
申请日：2017-12-05
Inventor： SHIN-WEN CHEN
Abstract: A durable camera module comprises a lens holder and a lens barrel. An opening is defined in the lens holder. The opening passes through the lens holder along an axial direction of the lens holder. At least one notch is defined in a side wall of the lens holder. The at least one notch extends radially through the side wall of the lens holder. The lens barrel is received in the opening. A first adhesive layer is formed between the lens barrel and lens holder. The first adhesive layer is positioned at an end of the lens holder and surrounds the lens barrel. A second adhesive layer is formed in each of the at least one notch, the second adhesive layer is bonded to the lens barrel.
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