Abstract:
A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.
Abstract:
A light source such as a metal halide lamp is effectively cooled in an optical apparatus such as a liquid crystal projector. In an optical apparatus which includes a concave mirror 11, a light emitting section 12 arranged in a concave portion of the concave mirror along the optical axis and a cooling structure for cooling a periphery of the light emitting section, the cooling structure is provided with a means for generating an air flow 4, the direction of which is approximately perpendicular to the optical axis of the concave mirror 11, and a means for generating an air flow 5 circulating into the concave portion of the concave mirror 11.
Abstract:
A projector comprising liquid crystal display panels and a projection lens for projecting the modulated light to a screen. A back surface reflection mirror including a transparent plastic sheet and a reflecting film is arranged between the projection lens and the screen. The mirror is thin and light and may have optical anisotropy. In order to eliminate an uneven pattern appearing in the screen caused by optical isotropy of the mirror and the difference between the light distribution characteristics in the screen for P- and S-polarized light, the projection lens and the back surface reflection mirror are arranged in such a relationship that a wave normal vector of an arbitrary component of the light projected by the projection lens and made incident to the back surface reflection mirror is not parallel to the optical axis of the plastic sheet.
Abstract:
A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.
Abstract:
A method for producing bis(aminomethyl)cyclohexanes includes a nuclear hydrogenation step of producing hydrogenated phthalic acids or phthalic acid derivatives by nuclear hydrogenation of phthalic acids or phthalic acid derivatives of at least one selected from the group consisting of phthalic acids, phthalic acid esters, and phthalic acid amides; a cyanation step of treating the hydrogenated phthalic acids or phthalic acid derivatives obtained in the nuclear hydrogenation step with ammonia, thereby producing dicyanocyclohexanes; and an aminomethylation step of treating the dicyanocyclohexanes obtained in the cyanation step with hydrogen, thereby producing bis(aminomethyl)cyclohexanes. In the cyanation step, metal oxide is used as a catalyst, and the obtained dicyanocyclohexanes have a metal content of 3000 ppm or less.
Abstract:
A backlight device (2) that emits illumination light toward the exterior includes a white light-emitting diode (4) that emits white light, and a LED lighting circuit (lighting control section) (12) configured to be capable of controlling a lighting drive of the light-emitting diode (4) by using PWM dimming. The LED lighting circuit (12) adjusts a color tone of the illumination light by modifying ON time of a duty ratio by PWM dimming and a value of supply current to be supplied to the light-emitting diode (4).
Abstract:
In a direct backlight, a substrate on which LEDs are provided includes a plurality of module substrates. Each module substrate can be reduced in warping or deformation after a blanking process. In addition, each module substrate can be formed thin since bending due to its own weight is small. Consequently, the substrate as a whole and the backlight can be formed thin.
Abstract:
A substrate processing apparatus includes an anti-reflection film processing block, a resist film processing block, and a resist cover film processing block. In the processing blocks, an anti-reflection film, a resist film, and a resist cover film are formed on a substrate, respectively. Additionally, a film formed at a peripheral edge of the substrate is removed. The film formed at the peripheral edge of the substrate is removed by supplying a removal liquid capable of dissolving and removing the film to the peripheral edge of the substrate during rotation. When the peripheral edge of the film is removed, the position of the substrate is corrected such that the center of the substrate coincides with the center of a rotation shaft.
Abstract:
A side light type backlight includes a light source including a plurality of LEDs, and a light guide plate. One of the end surfaces of the light guide plate is a light incidence surface at which a plurality of R-LEDs, a plurality of G-LEDs and a plurality of B-LEDs are arranged. LEDs satisfy the relationship of: a distribution range of light emitted from G-LEDs
Abstract:
A backlight structure includes: light source modules 1 and 1; a light guide plate 2 disposed between the light source modules 1 and 1; a rear plate 3 disposed at the rear side of the light source modules 1 and the light guide plate 2; a fan-mount plate 4 disposed at the rear side of the rear plate 3; and a cooling fan 5 mounted on the fan-mount plate 4. The rear plate 3 has portions thereof at the rear side of the light source modules 1 and 1 formed into protruding portions 3a, and has a portion thereof between the upper and lower protruding portions 3a formed into a flat surface 3b. A cooling wind passage 11 is formed between a front surface 4a of the fan-mount plate and the flat surface 3b of the rear plate. Heat from LED chips 1a of the light source modules is made to concentrate at the protruding portions 3a of the rear plate and is then rejected into the outside by the wind guided from the cooling fan 5 into the cooling wind passage 11.