公开(公告)号：US20120282444A1

公开(公告)日：2012-11-08

申请号：US13460068

申请日：2012-04-30

Applicant: Lars Zander ,  Pavel Gentschev ,  Hans-Georg Kinzelmann ,  Svenja Struempf ,  Nicole Ditges ,  Johann Klein

Inventor： Lars Zander ,  Pavel Gentschev ,  Hans-Georg Kinzelmann ,  Svenja Struempf ,  Nicole Ditges ,  Johann Klein

IPC: C09J183/00 ,  B32B15/082 ,  B32B27/10 ,  B32B27/08 ,  B32B7/12 ,  B32B33/00

CPC classification number: C09J201/10 ,  C08G18/10 ,  C08G18/12 ,  C08G18/289 ,  C08G18/4825 ,  C08G18/62 ,  C08G18/718 ,  C08G65/336 ,  C08G2650/36 ,  C08J5/128 ,  C08J2333/12 ,  C08J2371/02 ,  C08L33/06 ,  C08L43/04 ,  C09J143/04 ,  C09J163/00 ,  C09J171/02 ,  C09J175/04 ,  C08G18/307

Abstract: The invention relates to a one-component, moisture-curing adhesive containing at least one polyoxyalkylene and/or poly(methyl)acrylate prepolymer having at least one hydrolyzable silane group, at least one filler, and auxiliary materials and additives, wherein the prepolymer has a molecular weight of 4,000 to 40,000 g/mol and the adhesive has a viscosity of 200 to 10,000 mPas.

Abstract translation: 本发明涉及含有至少一种具有至少一个可水解硅烷基团的聚氧化烯和/或聚（甲基）丙烯酸酯预聚物，至少一种填料和辅助材料和添加剂的单组分湿润固化粘合剂，其中预聚物具有 分子量为4,000〜40,000g / mol，粘合剂的粘度为200〜10,000mPa·s。

公开(公告)号：US08129479B2

公开(公告)日：2012-03-06

申请号：US10586858

申请日：2005-01-26

Applicant: Kazuhiko Ueda ,  Hiroshi Iwakiri

Inventor： Kazuhiko Ueda ,  Hiroshi Iwakiri

IPC: C08L83/00 ,  B32B7/12

CPC classification number: C08G65/336 ,  C08L2205/02 ,  C08L2666/04 ,  C09J7/38 ,  C09J143/04 ,  C09J201/10 ,  Y10T428/2852

Abstract: The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.

Abstract translation: 本发明的目的是提供一种压敏粘合剂组合物，该组合物可以不使用有机溶剂而施加，并且表现出优异的压敏粘合特性。 该目的可以通过压敏粘合剂组合物来实现，该组合物作为必要组分包括以下：（A）每分子含有至少1.3个可水解甲硅烷基并且数均分子量为15,000的可水解甲硅烷基的有机聚合物 至100,000; （B）每分子含有0.3〜1.3个可水解甲硅烷基并且数均分子量为500〜15000的可水解甲硅烷基的有机聚合物; 和（C）增粘树脂。

公开(公告)号：US08013079B2

公开(公告)日：2011-09-06

申请号：US12088797

申请日：2006-10-02

Applicant: Noriko Matsushita ,  Hiroshi Iwakiri ,  Toshihiko Okamoto

Inventor： Noriko Matsushita ,  Hiroshi Iwakiri ,  Toshihiko Okamoto

IPC: C08F283/00

CPC classification number: C09K3/1018 ,  C08K5/3442 ,  C08L101/10 ,  C09D201/10 ,  C09J201/10 ,  C08L71/02

Abstract: The present invention has its object to provide a curable composition which allows slight bleedout of a liquid compound to occur to the cured product and shows good curability and adhesiveness using a non-organotin catalyst, an amine compound, as a silanol condensation catalyst.The present invention relates to a non-organotin-based curable composition which comprises: (A) an organic polymer having a silicon-containing group capable of crosslinking by siloxane bond formation, and (B) a specific amidine compound and/or a guanidine compound having a melting point of not lower than 23° C., as a silanol condensation catalyst.

Abstract translation: 本发明的目的是提供一种固化性组合物，其使固化物发生液体化合物的轻微渗出，并且使用非有机锡催化剂，胺化合物作为硅烷醇缩合催化剂显示良好的固化性和粘合性。 本发明涉及一种非有机锡基可固化组合物，其包含：（A）具有能够通过硅氧烷键形成交联的含硅基团的有机聚合物，和（B）特定的脒化合物和/或胍化合物 熔点不低于23℃，作为硅烷醇缩合催化剂。

公开(公告)号：US20070123662A1

公开(公告)日：2007-05-31

申请号：US10586858

申请日：2005-01-26

Applicant: Kazuhiko Ueda ,  Hiroshi Iwakiri

Inventor： Kazuhiko Ueda ,  Hiroshi Iwakiri

IPC: C08L71/02

CPC classification number: C08G65/336 ,  C08L2205/02 ,  C08L2666/04 ,  C09J7/38 ,  C09J143/04 ,  C09J201/10 ,  Y10T428/2852

Abstract: The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.

Abstract translation: 本发明的目的是提供一种压敏粘合剂组合物，该组合物可以不使用有机溶剂而施加，并且表现出优异的压敏粘合特性。 该目的可以通过压敏粘合剂组合物来实现，该组合物作为必要组分包括以下：（A）每分子含有至少1.3个可水解甲硅烷基并且数均分子量为15,000的可水解甲硅烷基的有机聚合物 至100,000; （B）每分子含有0.3〜1.3个可水解甲硅烷基并且数均分子量为500〜15000的可水解甲硅烷基的有机聚合物; 和（C）增粘树脂。

公开(公告)号：US20040176522A1

公开(公告)日：2004-09-09

申请号：US10739390

申请日：2003-12-18

Inventor： Michael Schaetzle ,  Gabriele Bride ,  Wolfgang Goldberger ,  Horst Beck

IPC: C08K003/04 ,  B60J001/00

CPC classification number: C09J11/08 ,  C08L75/00 ,  C08L75/04 ,  C08L101/10 ,  C09J175/04 ,  C09J201/10

Abstract: Solutions of non-functional thermoplastic polymers in preferably high-boiling dissolving agents/plasticizers are suitable as additive additions in high-strength adhesives/sealant comprising high percentages of carbon black as a reinforcing filler for windscreen glazing in automobile construction for increasing the electrical resistance and thus for improving the electrical properties of antennae integrated into the vehicle windscreens.

Abstract translation: 非功能性热塑性聚合物在优选高沸点溶解剂/增塑剂中的溶液适用于高强度粘合剂/密封剂中的添加剂添加剂，其包括高百分比的炭黑作为用于汽车结构中的挡风玻璃的增强填料，用于增加电阻和 从而改善集成到车辆挡风玻璃中的天线的电气性能。

公开(公告)号：US06784025B2

公开(公告)日：2004-08-31

申请号：US10301924

申请日：2002-11-20

Applicant: Osama M. Musa

Inventor： Osama M. Musa

IPC: H01L2158

CPC classification number: H01L24/83 ,  C09J201/10 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  Y10T428/31515 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond.

Abstract translation: 本发明涉及一种半导体封装，其中硅晶片用包含具有以下结构的树脂的粘合剂粘合到基底上：其中Q是含有至少一个碳 - 碳双键的低聚或聚合基团，A是烃基 基团或芳基，L是除了环氧基之外的官能团反应产生的连接基团，对于含有硅烷的部分的前体和不包括环氧基的官能团的前体，至少含有至少 一碳碳双键。