DISK SUBSTRATE MOLDING APPARATUS, DISK SUBSTRATE MOLDING METHOD AND DISK SUBSTRATE MOLDING DIE
    121.
    发明申请
    DISK SUBSTRATE MOLDING APPARATUS, DISK SUBSTRATE MOLDING METHOD AND DISK SUBSTRATE MOLDING DIE 有权
    盘形基板成型装置,盘基板成型方法及盘基板成型模具

    公开(公告)号:US20110204535A1

    公开(公告)日:2011-08-25

    申请号:US13122030

    申请日:2010-09-01

    Applicant: Kazuo Inoue

    Inventor: Kazuo Inoue

    Abstract: A disk substrate molding apparatus has a disk substrate molding die and a temperature controller. The disk substrate molding die includes a stamper, a first die including a mirror member to which the stamper comes in contact, and a second die including a molding surface which forms a disk-shaped cavity between the molding surface and the stamper. The second die includes a protruding part which protrudes toward the stamper at an outer circumferential part of the molding surface. The temperature controller controls temperature of the second die so that the protruding part exhibits a higher temperature in comparison to a region further toward the inner circumferential side than the protruding part, and controls temperature of the first die so that a region opposite to the protruding part exhibits a lower temperature in comparison to the protruding part in the mirror member.

    Abstract translation: 盘基片成型装置具有盘基片成型模和温度控制器。 盘基片成形模具包括压模,第一模具,其包括与压模接触的反射镜部件,第二模具包括在模制表面和压模之间形成盘形腔的模制表面。 第二模具包括在模制表面的外圆周部分处向模具突出的突出部分。 温度控制器控制第二模具的温度,使得突出部分比与突出部分更靠内周侧的区域相比表现出更高的温度,并且控制第一模具的温度,使得与突出部分相对的区域 与镜构件中的突出部相比具有较低的温度。

    Sheet-like probe, method of producing the probe, and application of the probe
    122.
    发明授权
    Sheet-like probe, method of producing the probe, and application of the probe 有权
    片状探针,探针的制造方法和探针的应用

    公开(公告)号:US07671609B2

    公开(公告)日:2010-03-02

    申请号:US11587485

    申请日:2005-04-26

    Abstract: A sheet-like probe has a porous film. In the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are integrated such that a flexible resin insulation layer is included in a fine hole of the porous film. Electrode structure bodies are supported in a penetrating manner in the insulation layer. Each electrode structure body includes a surface electrode section exposed to the front surface of the insulation layer and projecting from the front surface of the insulation layer, a back surface electrode section exposed to the back surface of the insulation layer, a short-circuit section continuously extending from the base end of the front surface electrode section, penetrating the insulation layer in its thickness direction, and connected to the back surface electrode section, a holding section extending outward, along the front surface of the insulation layer, from the base end section of the front surface electrode section, and a supporting body supporting the insulation layer.

    Abstract translation: 片状探针具有多孔膜。 在片状探针中,在形成于多孔膜的贯通孔的各位置上,充分地将接触膜支撑在接触膜的周缘和多孔膜的一体,使得柔性树脂绝缘层包含在 多孔膜的细孔。 电极结构体以穿透方式被支撑在绝缘层中。 每个电极结构体包括暴露于绝缘层的前表面并从绝缘层的前表面突出的表面电极部分,暴露于绝缘层的背面的背面电极部分,连续的短路部分 从前表面电极部分的基端部延伸穿过绝缘层的厚度方向,并与背面电极部分连接,沿着绝缘层的前表面向外延伸的保持部分从基端部分 和支撑绝缘层的支撑体。

    Optical disk and method for producing the same
    123.
    发明授权
    Optical disk and method for producing the same 失效
    光盘及其制造方法

    公开(公告)号:US07488436B2

    公开(公告)日:2009-02-10

    申请号:US10911665

    申请日:2004-08-05

    Applicant: Kazuo Inoue

    Inventor: Kazuo Inoue

    CPC classification number: G11B7/263 Y10S425/81 Y10T428/21

    Abstract: An optical disk is constructed such that a thin film including a reflective layer is formed on a substrate, or on a thermoplastic resin layer on the substrate. A stamper having an asperity pattern corresponding to information signals is directly pressed against the thin film to transfer the asperity pattern on the thin film. Heat-pressing the stamper against the thin film makes it possible to further accurately transfer the asperity of the stamper to the reflective layer with less pressing force, in the case where the reflective layer is formed on the thermoplastic resin layer.

    Abstract translation: 构造光盘,使得在基板上或基板上的热塑性树脂层上形成包括反射层的薄膜。 将具有对应于信息信号的粗糙图案的压模直接压在薄膜上,以将薄片上的凹凸图案转印。 在热塑性树脂层上形成反射层的情况下,通过将压模热压到薄膜上,能够以较小的压力将精密凹凸的凹凸传递到反射层。

    Sheet-like probe, process for producing the same and its application
    124.
    发明授权
    Sheet-like probe, process for producing the same and its application 有权
    片状探针,其制造方法及其应用

    公开(公告)号:US07391227B2

    公开(公告)日:2008-06-24

    申请号:US10556782

    申请日:2004-05-12

    CPC classification number: G01R1/0735 G01R3/00

    Abstract: Disclosed herein are a sheet-like probe capable of surly preventing positional deviation between electrode structures and electrodes to be inspected by temperature changes in a bum-in test, even when the object of inspection is a wafer having a large area of 8 inches or greater in diameter or a circuit device, the pitch of electrodes to be inspected of which is extremely small, and thus capable of stably retaining a good electrically connected state, and a production process and applications thereof. The sheet-like probe of the present invention comprises a contact film obtained by holding a plurality of electrode structures arranged in accordance with a pattern corresponding to respective electrodes to be connected and having a front-surface electrode part exposed to a front surface and a back-surface electrode part exposed to aback surface by an insulating film composed of a flexible resin, and a frame plate supporting the contract film.

    Abstract translation: 这里公开了一种片状探针,即使当检查对象是具有8英寸或更大的面积的晶片时,能够防止电极结构和电极之间的位置偏移,从而可以通过烧伤测试中的温度变化进行检查 直径或电路装置,其检查的电极的间距极小,因此能够稳定地保持良好的电连接状态及其制造方法和应用。 本发明的片状探针包括通过保持根据与要连接的各个电极对应的图案布置的多个电极结构而获得的接触膜,并且具有暴露于前表面和背面的前表面电极部分 通过由柔性树脂构成的绝缘膜暴露于表面的表面电极部分和支撑合同膜的框架板。

    Anisotropic conductive connector and wafer inspection device
    125.
    发明授权
    Anisotropic conductive connector and wafer inspection device 有权
    各向异性导电连接器和晶圆检查装置

    公开(公告)号:US07384279B2

    公开(公告)日:2008-06-10

    申请号:US10559846

    申请日:2004-06-01

    CPC classification number: G01R1/0735 G01R1/07378 H01R4/04 H01R12/52

    Abstract: An anisotropically conductive connector suitable for use in a wafer inspection apparatus, and a wafer inspection apparatus comprising the anisotropically conductive connector, which anisotropically conductive connector comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film, which plate is formed of a metallic material having a coefficient of linear thermal expansion of 3×10−6 to 2×10−5K−1, the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 μm and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resistance between the conductive parts for connection is at least 10 MΩ.

    Abstract translation: 适用于晶片检查装置的各向异性导电连接器以及包括各向异性导电连接器的晶片检查装置,各向异性导电连接器包括由多个用于连接的导电部件构成的弹性各向异性导电膜和在其间形成的绝缘部件 用于连接的导电部件和用于支撑该膜的框架板,该板由具有3×10 -6至2×10 -5的线性热膨胀系数的金属材料形成 用于连接的导电部件是通过以高密度填充数均粒径为20〜80μm的导电性粒子,并且在高弹性聚合物质中显现出磁性的,导电性粒子 在其表面上具有由贵金属构成的厚度为至少20nm的涂层,每个用于连接的导电部件 具有10至35的硬度计硬度,并且用于连接的导电部件之间的电阻至少为10 MOmega。

    Method and device for producing optical part
    126.
    发明授权
    Method and device for producing optical part 有权
    光学部件的制造方法及装置

    公开(公告)号:US07332110B2

    公开(公告)日:2008-02-19

    申请号:US11005208

    申请日:2004-12-06

    Abstract: An annular insert (4) is arranged in the optical component molding cavity of a mold to surround an outer periphery of raw material resin in a direction in which the resin is distributed in the cavity to limit the distribution of the raw material resin and define an outer profile of a lens (L). With this arrangement, it is only necessary to provide raw material resin only by a quantity equal to the volume of the region surrounded by the molding surfaces of upper and lower mold inserts (14, 24) and the inner peripheral edge of the annular insert (4) of the mold, so that the required volume of the raw material resin can be reduced. Since the pressure is preserved at the outer periphery of the distributed resin by the presence of the annular insert (4), the residual strain of the resin is minimized to prevent generation of sink mark, thereby providing excellent optical characteristics on the lens (L).

    Abstract translation: 在模具的光学部件模制腔​​中设置环形插入件(4),以沿着树脂在空腔中分布的方向包围原料树脂的外周,以限制原料树脂的分布,并限定 透镜(L)的外轮廓。 通过这种布置,只需要提供等于由上模和下模插入件(14,24)和环形插入件的内周边缘(14,24)的模制表面包围的区域的体积的量的原料树脂 4),从而可以减少所需体积的原料树脂。 由于通过存在环形插入件(4)在分布式树脂的外周保持压力,所以树脂的残余应变被最小化以防止产生凹痕,从而在透镜(L)上提供优异的光学特性, 。

    Molding method and molding device utilizing ultrasonic vibration and optical lens
    127.
    发明申请
    Molding method and molding device utilizing ultrasonic vibration and optical lens 审中-公开
    使用超声波振动和光学透镜的成型方法和成型装置

    公开(公告)号:US20060249864A1

    公开(公告)日:2006-11-09

    申请号:US10554197

    申请日:2004-04-22

    CPC classification number: B29C45/568 B29L2011/0016

    Abstract: A molding method is provided which can further improve transferability and further reduce strain and which is suitable for molding of a product with high accuracy and high quality. The molding method in which a resin material is filled into a cavity formed in a mold and pressurized to mold a product in a predetermined shape, and the method comprises: preparing the mold having a product cavity to mold the product made of a resin, a dummy cavity to mold a dummy product, and a runner by which the product cavity and the dummy cavity are connected; filling the resin material into the product cavity and supplying the resin material to at least part of the dummy cavity; and applying ultrasonic vibration to the resin material in the dummy cavity at predetermined timing.

    Abstract translation: 提供了能够进一步提高转印性,进一步降低应变的成型方法,适用于高精度,高品质的成型。 将树脂材料填充到形成在模具中的空腔中并加压以将模具成型为预定形状的模制方法,并且该方法包括:制备具有产品腔的模具以模制由树脂制成的产品, 虚拟空腔以模制虚拟产品,并且产品空腔和虚拟腔连接的流道; 将树脂材料填充到产品空腔中,并将树脂材料供应到虚拟空腔的至少一部分; 并在预定的时刻对虚拟空腔中的树脂材料施加超声波振动。

    Anisotropic conductive sheet and wafer inspection device
    129.
    发明授权
    Anisotropic conductive sheet and wafer inspection device 有权
    各向异性导电片和晶圆检查装置

    公开(公告)号:US06870385B2

    公开(公告)日:2005-03-22

    申请号:US10432606

    申请日:2001-12-05

    Abstract: Disclosed herein are a wafer inspection apparatus which is small in size, prevented from shortening the service life of its circuit board for inspection, can collectively perform inspection as to a great number of electrodes to be inspected, has good electrical properties and can perform electrical inspection of high functional integrated circuits, and an anisotropically conductive sheet suitable for use in this wafer inspection apparatus. The anisotropically conductive sheet is composed of an insulating sheet body, in which a through-hole has been formed, and an elastic anisotropically conductive film arranged in the through-hole. The insulating sheet body is formed of a material having a modulus of elasticity of 1×108 to 1×1010 Pa, a coefficient of linear thermal expansion of 3×10−6 to 3×10−5 K−1 and a saturation magnetization lower than 0.1 wb/m2, the elastic anisotropically conductive film is composed of a plurality of conductive path-forming portions and insulating portions formed among these conductive path-forming portions, the conductive path-forming portions are obtained by filling conductive particles having a number average particle diameter of 30 to 150 μm, a coating layer composed of a noble metal and having a thickness of at least 20 nm is formed on surfaces of the conductive particles, each of the conductive path-forming portions has a durometer hardness of 15 to 45, and an electric resistance between conductive path-forming portions is at least 10 MΩ.

    Abstract translation: 这里公开了一种晶片检查装置,其尺寸小,防止其电路板的使用寿命缩短以供检查,可以共同对大量待检查的电极进行检查,具有良好的电气性能并且可以进行电气检查 的高功能集成电路,以及适用于该晶片检查装置的各向异性导电片。 各向异性导电片由其中形成有通孔的绝缘片体和布置在通孔中的弹性各向异性导电膜构成。 绝缘片体由弹性模量为1×10 8〜1×10 10 Pa,线性热膨胀系数为3×10 -6〜3×10 -5 K -1的材料形成, 饱和磁化强度低于0.1wb / m 2,弹性各向异性导电膜由多个导电路径形成部分和形成在这些导电路径形成部分之间的绝缘部分组成,导电路径形成部分由 填充数均粒径为30〜150μm的导电性粒子,在贵金属构成的厚度为20nm以上的被覆层形成在导电性粒子的表面上,各导电路径形成部具有 硬度计硬度为15至45,并且导电路径形成部分之间的电阻至少为10微米。

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