Abstract:
A disk substrate molding apparatus has a disk substrate molding die and a temperature controller. The disk substrate molding die includes a stamper, a first die including a mirror member to which the stamper comes in contact, and a second die including a molding surface which forms a disk-shaped cavity between the molding surface and the stamper. The second die includes a protruding part which protrudes toward the stamper at an outer circumferential part of the molding surface. The temperature controller controls temperature of the second die so that the protruding part exhibits a higher temperature in comparison to a region further toward the inner circumferential side than the protruding part, and controls temperature of the first die so that a region opposite to the protruding part exhibits a lower temperature in comparison to the protruding part in the mirror member.
Abstract:
A sheet-like probe has a porous film. In the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are integrated such that a flexible resin insulation layer is included in a fine hole of the porous film. Electrode structure bodies are supported in a penetrating manner in the insulation layer. Each electrode structure body includes a surface electrode section exposed to the front surface of the insulation layer and projecting from the front surface of the insulation layer, a back surface electrode section exposed to the back surface of the insulation layer, a short-circuit section continuously extending from the base end of the front surface electrode section, penetrating the insulation layer in its thickness direction, and connected to the back surface electrode section, a holding section extending outward, along the front surface of the insulation layer, from the base end section of the front surface electrode section, and a supporting body supporting the insulation layer.
Abstract:
An optical disk is constructed such that a thin film including a reflective layer is formed on a substrate, or on a thermoplastic resin layer on the substrate. A stamper having an asperity pattern corresponding to information signals is directly pressed against the thin film to transfer the asperity pattern on the thin film. Heat-pressing the stamper against the thin film makes it possible to further accurately transfer the asperity of the stamper to the reflective layer with less pressing force, in the case where the reflective layer is formed on the thermoplastic resin layer.
Abstract:
Disclosed herein are a sheet-like probe capable of surly preventing positional deviation between electrode structures and electrodes to be inspected by temperature changes in a bum-in test, even when the object of inspection is a wafer having a large area of 8 inches or greater in diameter or a circuit device, the pitch of electrodes to be inspected of which is extremely small, and thus capable of stably retaining a good electrically connected state, and a production process and applications thereof. The sheet-like probe of the present invention comprises a contact film obtained by holding a plurality of electrode structures arranged in accordance with a pattern corresponding to respective electrodes to be connected and having a front-surface electrode part exposed to a front surface and a back-surface electrode part exposed to aback surface by an insulating film composed of a flexible resin, and a frame plate supporting the contract film.
Abstract:
An anisotropically conductive connector suitable for use in a wafer inspection apparatus, and a wafer inspection apparatus comprising the anisotropically conductive connector, which anisotropically conductive connector comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film, which plate is formed of a metallic material having a coefficient of linear thermal expansion of 3×10−6 to 2×10−5K−1, the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 μm and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resistance between the conductive parts for connection is at least 10 MΩ.
Abstract:
An annular insert (4) is arranged in the optical component molding cavity of a mold to surround an outer periphery of raw material resin in a direction in which the resin is distributed in the cavity to limit the distribution of the raw material resin and define an outer profile of a lens (L). With this arrangement, it is only necessary to provide raw material resin only by a quantity equal to the volume of the region surrounded by the molding surfaces of upper and lower mold inserts (14, 24) and the inner peripheral edge of the annular insert (4) of the mold, so that the required volume of the raw material resin can be reduced. Since the pressure is preserved at the outer periphery of the distributed resin by the presence of the annular insert (4), the residual strain of the resin is minimized to prevent generation of sink mark, thereby providing excellent optical characteristics on the lens (L).
Abstract:
A molding method is provided which can further improve transferability and further reduce strain and which is suitable for molding of a product with high accuracy and high quality. The molding method in which a resin material is filled into a cavity formed in a mold and pressurized to mold a product in a predetermined shape, and the method comprises: preparing the mold having a product cavity to mold the product made of a resin, a dummy cavity to mold a dummy product, and a runner by which the product cavity and the dummy cavity are connected; filling the resin material into the product cavity and supplying the resin material to at least part of the dummy cavity; and applying ultrasonic vibration to the resin material in the dummy cavity at predetermined timing.
Abstract:
An optical disk of the present invention includes a first substrate having a signal area on a principal plane and a central hole, and a second substrate that is transparent and attached to the first substrate. The second substrate is thinner than the first substrate, and has a central hole whose diameter is larger than that of the first substrate. The first substrate and the second substrate are attached to each other with radiation curable resin (adhesive member) disposed therebetween so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof.
Abstract:
Disclosed herein are a wafer inspection apparatus which is small in size, prevented from shortening the service life of its circuit board for inspection, can collectively perform inspection as to a great number of electrodes to be inspected, has good electrical properties and can perform electrical inspection of high functional integrated circuits, and an anisotropically conductive sheet suitable for use in this wafer inspection apparatus. The anisotropically conductive sheet is composed of an insulating sheet body, in which a through-hole has been formed, and an elastic anisotropically conductive film arranged in the through-hole. The insulating sheet body is formed of a material having a modulus of elasticity of 1×108 to 1×1010 Pa, a coefficient of linear thermal expansion of 3×10−6 to 3×10−5 K−1 and a saturation magnetization lower than 0.1 wb/m2, the elastic anisotropically conductive film is composed of a plurality of conductive path-forming portions and insulating portions formed among these conductive path-forming portions, the conductive path-forming portions are obtained by filling conductive particles having a number average particle diameter of 30 to 150 μm, a coating layer composed of a noble metal and having a thickness of at least 20 nm is formed on surfaces of the conductive particles, each of the conductive path-forming portions has a durometer hardness of 15 to 45, and an electric resistance between conductive path-forming portions is at least 10 MΩ.
Abstract translation:这里公开了一种晶片检查装置,其尺寸小,防止其电路板的使用寿命缩短以供检查,可以共同对大量待检查的电极进行检查,具有良好的电气性能并且可以进行电气检查 的高功能集成电路,以及适用于该晶片检查装置的各向异性导电片。 各向异性导电片由其中形成有通孔的绝缘片体和布置在通孔中的弹性各向异性导电膜构成。 绝缘片体由弹性模量为1×10 8〜1×10 10 Pa,线性热膨胀系数为3×10 -6〜3×10 -5 K -1的材料形成, 饱和磁化强度低于0.1wb / m 2,弹性各向异性导电膜由多个导电路径形成部分和形成在这些导电路径形成部分之间的绝缘部分组成,导电路径形成部分由 填充数均粒径为30〜150μm的导电性粒子,在贵金属构成的厚度为20nm以上的被覆层形成在导电性粒子的表面上,各导电路径形成部具有 硬度计硬度为15至45,并且导电路径形成部分之间的电阻至少为10微米。
Abstract:
An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.