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公开(公告)号:US11810885B2
公开(公告)日:2023-11-07
申请号:US17187452
申请日:2021-02-26
Applicant: WASEDA UNIVERSITY
Inventor: Kohei Tatsumi , Yasunori Tanaka
IPC: H01L23/00 , H01L23/495
CPC classification number: H01L24/29 , H01L24/32 , H01L24/83 , H01L23/49582 , H01L24/05 , H01L2224/05124 , H01L2224/27464 , H01L2224/29247 , H01L2224/29255 , H01L2224/29324 , H01L2224/29355 , H01L2224/32245 , H01L2224/8384 , H01L2224/83091 , H01L2224/83099 , H01L2224/83192 , H01L2224/83395 , H01L2224/83455 , H01L2224/83951 , H01L2924/10272 , H01L2924/15738 , H01L2924/15747 , H01L2924/3512
Abstract: A semiconductor element bonding structure capable of strongly bonding a semiconductor element and an object to be bonded and relaxing thermal stress caused by a difference in thermal expansion, by interposing metal particles and Ni between the semiconductor element and the object to be bonded, the metal particles having a lower hardness than Ni and having a micro-sized particle diameter. A plurality of metal particles 5 (aluminum (Al), for example) having a lower hardness than nickel (Ni) and having a micro-sized particle diameter are interposed between a semiconductor chip 3 and a substrate 2 to be bonded to the semiconductor chip 3, and the metal particles 5 are fixedly bonded by the nickel (Ni). Optionally, aluminum (Al) or an aluminum alloy (Al alloy) is used as the metal particles 5, and aluminum (Al) or an aluminum alloy (Al alloy) is used on the surface of the semiconductor chip 3 and/or the surface of the substrate 2.
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122.
公开(公告)号:US20230252192A1
公开(公告)日:2023-08-10
申请号:US18003275
申请日:2021-06-23
Inventor: Shinichi NAGATA , Koji TAKAHASHI , Nozomu TOGAWA , Masaru OYA
IPC: G06F21/71 , G06F30/327
CPC classification number: G06F21/71 , G06F30/327
Abstract: A hardware trojan detection method is provided including an input and output updating step of updating input and output values of all logic cells by performing computations according to logical expressions of all logic cells included in a netlist to be verified and a detection step of performing hardware trojan detection based on a comparison result of the updated input and output values and a threshold.
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公开(公告)号:US20230243364A1
公开(公告)日:2023-08-03
申请号:US18148624
申请日:2022-12-30
Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. , WASEDA UNIVERSITY
Inventor: Satoshi Maeda , Takeshi Sano , Shinji Fukao , Atsushi Nakagawa , Keisuke Matsumoto , Kazuyoshi Miyagawa
CPC classification number: F04D29/242 , F01D5/225
Abstract: An impeller includes a hub having a circular plate shape with an axial line as a center, a shroud disposed to face the hub in a direction of the axial line, and a plurality of blades disposed with a space from each other in a circumferential direction between the hub and the shroud. A meridian plane shape of the impeller differs in the circumferential direction.
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124.
公开(公告)号:US20230204863A1
公开(公告)日:2023-06-29
申请号:US18013337
申请日:2021-07-08
Applicant: WASEDA UNIVERSITY
Inventor: Takao AOKI
CPC classification number: G02B6/3536 , G02B6/34 , G02B6/2713 , G06N10/40
Abstract: In order to deterministically operate a quantum computing unit (13-m) having a plurality of quantum systems trapped thereto, quantum computing is carried out with use of a quantum computing unit including: an optical nanofiber (131-m) optically connected, via a tapered portion, to an optical fiber (12) through which a photon entering thereto is propagated; and a plurality of quantum systems (132-m) arranged outside the optical nanofiber so as to be arrayed at intervals along a longitudinal direction of the optical nanofiber. Note that at least any one of the quantum systems functions as a qubit interacting with the photon.
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125.
公开(公告)号:US20220323967A1
公开(公告)日:2022-10-13
申请号:US17676841
申请日:2022-02-22
Applicant: Honda Motor Co., Ltd. , Waseda University , National University Corporation Kumamoto University
Inventor: Satoshi OYAMA , Naoki Kishimoto , Chiharu Tokoro , Soowon Lim , Taketoshi Koita , Masataka Kondo , Takao Namihira
Abstract: An electric pulse decomposition method for separating a composite material by an electric pulse, the composite material being obtained by bonding or joining a plurality of conductors to each other with an insulating member, the electric pulse decomposition method including a protrusion formation step for forming a protrusion in a specific site, on a side on which the composite material is arranged, of at least one of the plurality of conductors, and a separation step for separating the plurality of conductors in the composite material 1 by respectively bringing electrodes into contact with surfaces of the plurality of conductors and applying an electric pulse between the electrodes to destroy the insulating member. This makes it possible to separate the plurality of conductors from the composite material by making a shock wave caused by a current of the dielectric breakdown functioning as an adhesive to effectively destroy the insulating member.
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公开(公告)号:US20220259697A1
公开(公告)日:2022-08-18
申请号:US17628075
申请日:2020-07-06
Applicant: WASEDA UNIVERSITY , DOWA METALS & MINING CO., LTD. , NIPPON PGM CO., LTD.
Inventor: Keiichi SUGAWARA , Hiromitsu YATSUHASHI , Katsunori YAMAGUCHI , Takashi MURATA
Abstract: There is provided a method for recovering PGM, in which at least one base metal oxide selected from a group consisting of copper oxide, iron oxide, tin oxide, nickel oxide and lead oxide is added to and melted in a molten slag, and a PGM alloy contained in the molten slag is recovered.
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公开(公告)号:US11364486B2
公开(公告)日:2022-06-21
申请号:US16078737
申请日:2017-02-17
Applicant: WASEDA UNIVERSITY , ZEON CORPORATION
Inventor: Suguru Noda , Kosuke Kawabata , Takayoshi Hongo
IPC: B01J23/745 , B01J23/94 , C01B32/162 , B01J21/12 , B01J35/02 , B01J35/10 , B01J38/12 , C23C16/01 , C23C16/26 , B01J37/02 , B01J37/08 , B01J37/14 , B01J23/74 , C23C28/00 , C23C16/40 , C23C16/44 , D01F9/127 , B01J29/89 , B82Y30/00 , B82Y40/00
Abstract: A supported catalyst comprises: a support that is particulate; and a composite layer laminate formed outside the support and including two or more composite layers, wherein each of the composite layers includes a catalyst portion containing a catalyst and a metal compound portion containing a metal compound, the support contains 10 mass % or more of each of Al and Si, and a volume-average particle diameter of the support is 50 μm or more and 400 μm or less.
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公开(公告)号:US20220175242A1
公开(公告)日:2022-06-09
申请号:US17599069
申请日:2020-03-26
Applicant: WASEDA UNIVERSITY
Inventor: Hiroyasu Iwata , Ryoichi Kato , Kazuhiro Yasuda
IPC: A61B3/024 , H04N13/398 , A61B3/08 , A61B3/00
Abstract: A visual perception function evaluation system 10 includes: a display device 12 configured to three-dimensionally display a three-dimensional test image 20 including an object 22 to a subject; a processing device 13 connected to the display device 12; and an input device 11 through which a reply related to whether the object 22 can be perceived is input from the subject to the processing device 13. The processing device 13 includes a display control means 15 for controlling the state of display of the test image 20 on the display device 12, and a neglect region specifying means 16 for specifying a neglect region in a three-dimensional space based on the reply. The display control means 15 controls display so that the three-dimensional position of a display point P varies over time. The neglect region specifying means 16 determines three-dimensional position information on a boundary part between a perception region and the neglect region based on a position of the display point P where it is replied that the object 22 cannot be perceived and an adjacent position of the display point P where it is replied that the object 22 can be perceived.
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公开(公告)号:US11075144B2
公开(公告)日:2021-07-27
申请号:US16944345
申请日:2020-07-31
Applicant: FUJI ELECTRIC CO., LTD. , WASEDA UNIVERSITY
Inventor: Ryoichi Kato , Hiromichi Gohara , Yoshinari Ikeda , Tomoyuki Miyashita , Yoshihiro Tateishi , Shunsuke Numata
IPC: H01L23/473 , H01L23/498
Abstract: Provided is a cooler having high cooling efficiency and low pressure loss of fluid. A cooler includes: a flow-channel part at least including a plate-like fin (top plate) and a plate-like fin (bottom plate); and a continuous groove-like flow channel defined between the top plate and the bottom plate to flow fluid, the cooler being configured to cool semiconductor elements. When the flow-channel part is viewed from the direction parallel to the top plate and intersecting the flow channel, the flow channel has a corrugated shape so that a face of the flow channel closer to the top plate and a face of the flow channel closer to the bottom plate bend in a synchronized manner toward the top plate and the bottom plate.
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130.
公开(公告)号:US20210179431A1
公开(公告)日:2021-06-17
申请号:US16078809
申请日:2016-10-21
Applicant: DENSO CORPORATION , WASEDA UNIVERSITY
Inventor: Aun OTA , Hisayoshi OSHIMA , Suguru NODA , Yu YOSHIHARA
IPC: C01B32/162 , B01J21/04 , B01J23/745 , B01J37/02 , B01J37/08 , B01J15/00
Abstract: A carbon nanotube attached member has a substrate, which is mainly made of aluminum, and a aligned CNT film which is aligned along an alignment direction ORD. A carbon nanotube/CNT, which forms the aligned CNT film, has a length of 200 micrometers or longer. The CNT is synthesized starting from a mixed gas of acetylene, hydrogen, and argon. Furthermore, carbon dioxide is added to maintain catalyst activity. A ratio of acetylene:carbon dioxide is adjusted from 1:10 to 1:300. The aligned CNT film is partially formed. The formation range of the aligned CNT film is set by inhibiting synthesis and/or aligned growth of the CNT by a rough surface or a carbon-containing substance.
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