公开(公告)号：US11827021B2

公开(公告)日：2023-11-28

申请号：US17297612

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Christopher A. Leonard ,  Anthony M. Fuller

IPC: B41J2/16 ,  B41J2/045 ,  B29C45/14 ,  B29C45/00 ,  B29L31/00 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B29C45/0046 ,  B29C45/14639 ,  B41J2/04501 ,  B29L2031/7678 ,  B41J2002/14362 ,  B41J2202/01

Abstract: A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

公开(公告)号：US11745507B2

公开(公告)日：2023-09-05

申请号：US17311593

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Anthony M. Fuller ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1637

Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

公开(公告)号：US11721636B2

公开(公告)日：2023-08-08

申请号：US16603821

申请日：2018-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Anthony M. Fuller ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: H01L23/544 ,  B41J2/175 ,  H01L21/68

CPC classification number: H01L23/544 ,  B41J2/17546 ,  H01L21/68 ,  H01L2223/54426

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

公开(公告)号：US11691431B2

公开(公告)日：2023-07-04

申请号：US17699050

申请日：2022-03-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Si-lam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/18 ,  B41J2/14

CPC classification number: B41J2/18 ,  B41J2/14145 ,  B41J2202/12

Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

公开(公告)号：US11691423B2

公开(公告)日：2023-07-04

申请号：US17417875

申请日：2019-07-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael G. Groh ,  Bo Song

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1606 ,  B41J2/1433 ,  B41J2002/14475

Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.

公开(公告)号：US20230173495A1

公开(公告)日：2023-06-08

申请号：US18102412

申请日：2023-01-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Viktor Shkolnikov ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00

CPC classification number: B01L3/523 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/16 ,  B01L2300/041 ,  B01L2300/12 ,  B01L2300/16 ,  B01L2300/168 ,  B01L2300/1805

Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

公开(公告)号：US11654680B2

公开(公告)日：2023-05-23

申请号：US17340570

申请日：2021-06-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-Iam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen ,  Jeffrey R. Pollard

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/175 ,  B41J2/21

CPC classification number: B41J2/14145 ,  B41J2/14032 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/17503 ,  B41J2/21 ,  B41J2202/12

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

公开(公告)号：US20230143672A1

公开(公告)日：2023-05-11

申请号：US17912873

申请日：2020-04-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Michael G. Groh

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L3/502715

Abstract: A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.

公开(公告)号：US11433571B2

公开(公告)日：2022-09-06

申请号：US16772309

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Jimmy Perez

IPC: B29C33/30 ,  B41J2/14 ,  B29C33/00 ,  B29C33/14 ,  B29C33/42 ,  B29C39/10 ,  B29K63/00 ,  B29L31/00

Abstract: A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.

公开(公告)号：US11426900B2

公开(公告)日：2022-08-30

申请号：US14770198

申请日：2013-03-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Arun K. Agarwal

IPC: B29C33/00 ,  B41J2/16 ,  B29C39/02 ,  B29C39/26 ,  B29C39/36 ,  B29L31/00

Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.