Abstract:
Disclosed is a method and apparatus for contacting the thermal connectors of expansion circuit boards characterized by having a thermal connector. The apparatus configured to be contacted by the thermal connector of an expansion circuit board when the expansion circuit board is installed and cooled by a combination of cooling means and heat transfer means including heatpipes, fans and heatsinks.
Abstract:
A water-cooled heat sink includes a base, a box, a propelling module, a driving module, and a plurality of conduits. The box is disposed above the base, and receives a cooled liquid. The driving module includes a first magnet. The base defines a plurality of channels. The propelling module includes a cylinder, a piston, a second magnet, and a valve. The cylinder is disposed on an inner wall of the box. The piston is disposed in the cylinder, and defines a through hole in a middle portion thereof. The second magnet is fixed to the piston. The valve is fixed in the through hole. The conduits interconnect the cylinder and the box. The first magnet can repel or attract the second magnet, thereby sliding the piston toward the cylinder to close the valve or away from the cylinder to open the valve.
Abstract:
A data center container includes a chassis, a cooling system, a draining mechanism, and a latching member. The chassis includes a front plate with a securing hole. The cooling system includes a water tray and a drainer tray. The water tray communicates with the drainer tray. The draining mechanism communicates with the drainer tray and extends out of the chassis. The latching member is attached to the draining mechanism. The latching member includes an inserting post, and the inserting post being engaged in the securing hole, to position the draining mechanism to the front plate.
Abstract:
An aircraft signal computer system includes a plurality of modular signal computer units and a liquid cooling device for cooling the modular signal computer units. The liquid cooling device includes a coolant line, which is connectable to a central liquid cooling system of an aircraft in order to supply a liquid coolant medium at a desired low temperature to the liquid cooling device. The coolant line of the liquid cooling device is in thermal surface contact with the modular signal computer units in order to dissipate heat from the modular signal computer units. A heat-emitting component of the modular signal computer units may be in thermal contact with a coolant bath or an internal heat conductor for removing heat energy.
Abstract:
An adjustable coolant quick coupler has a coolant supplier seat and a transmission seat that can be optionally connected or disconnected. The coolant supplier seat has a regulator assembly. The regulator assembly is able to adjust quantity of flow-in coolant and quantity of flow-out coolant. When the coolant supplier seat is connected to the transmission seat, the coolant can flow automatically from the coolant supplier seat to the transmission seat, so as to cool down electronic components inside a rack. When the coolant supplier seat is disconnected from the transmission seat, the coolant instantly stops flowing into the transmission seat. Because of the quick coupler, the rack installed inside a narrow space is convenient to set up or disassemble. Furthermore, by adjusting the quantity of flow-in coolant and the quantity of flow-out coolant, the electronic components can have a better effect of heat-dissipation.
Abstract:
Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.
Abstract:
The invention relates to a heat sink for an interchangeable expansion module that can be connected to a computer board, said heat sink having at least one cooling module in which a coolant flows, and at least one first electrical connector, wherein said expansion module (4) has at least one second electrical connector configured to be connected to said first electrical connector of said board, and has at least one heat-exchange surface (18, 19), said heat sink (20) comprising at least one heat-transfer device (21) configured to be removably placed against said exchange surface (18, 19), and said device (21) further being configured such that it is in thermal contact with said cooling module and is mechanically attached, in a removable manner, to said cooling module of said board when said extension module (4) is connected to said board.
Abstract:
Managing waste water discharge of a computing system, the computing system including one or more evaporative coolers, including: determining, by a waste water management module, a waste water discharge limit, wherein the waste water discharge limit specifies the amount of waste water that can be discharged within a period of time; determining, by the waste water management module, the amount of waste water that has been discharged during a current measurement period; and updating, by the waste water management module, operating parameters for the computing system in dependence upon the amount of waste water that has been discharged during the current measurement period and the waste water discharge limit.
Abstract:
A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.
Abstract:
A data center cooling system is operated in a first mode, and has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second mode; and, in response, the data center cooling system is switched to the second mode. The second mode is different than the first mode.