公开(公告)号：US20250002666A1

公开(公告)日：2025-01-02

申请号：US18883366

申请日：2024-09-12

Applicant: JSP Corporation

Inventor： Tatsuya HAYASHI ,  Akinobu HIRA

IPC: C08J9/18

Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.

公开(公告)号：US12129350B2

公开(公告)日：2024-10-29

申请号：US17273232

申请日：2019-09-04

Applicant: JSP Corporation

Inventor： Tatsuya Hayashi ,  Akinobu Hira

IPC: C08J9/18 ,  C08J9/16

CPC classification number: C08J9/18 ,  C08J2377/06

Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.

公开(公告)号：US20240301158A1

公开(公告)日：2024-09-12

申请号：US18549445

申请日：2022-03-11

Applicant: JSP CORPORATION

Inventor： Takumi SAKAMURA ,  Hajime OHTA

IPC: C08J9/18 ,  B29C44/02 ,  B29C44/34 ,  B29K23/00 ,  B29K105/00 ,  B29K105/04 ,  B29K105/16 ,  B29K507/04 ,  C08J3/12 ,  C08J9/00 ,  C08J9/12

CPC classification number: C08J9/18 ,  B29C44/3461 ,  C08J3/126 ,  C08J9/0066 ,  C08J9/122 ,  B29C44/02 ,  B29C44/3415 ,  B29K2023/12 ,  B29K2023/16 ,  B29K2105/0005 ,  B29K2105/0032 ,  B29K2105/0085 ,  B29K2105/046 ,  B29K2105/16 ,  B29K2105/251 ,  B29K2507/04 ,  B29K2995/0063 ,  C08J2323/16 ,  C08J2323/18

Abstract: A method for producing polypropylene-based resin (PPBR) expanded beads may include dispersing, first expanding, and second expanding. In the dispersing, resin particles are dispersed in a dispersion medium, the resin particles each including a core layer, containing carbon black blended into PPBR in a predetermined ratio, based on 100 parts by mass of PPBR, and a covering layer covering the core layer, containing carbon black blended into a polyolefin-based resin (POBR) in a predetermined ratio, based on 100 parts by mass of POBR. The first expanding expands the core layer of the resin particle to obtain a first expanded bead having a bulk ratio of 5 to 25 times. The second expanding expands the first expanded beads further to obtain second expanded beads. An M2/M1 ratio of a bulk ratio M2 of the second expanded beads to a bulk ratio M1 of the first expanded beads is 1.2 to 3.0.

公开(公告)号：US20240286334A1

公开(公告)日：2024-08-29

申请号：US18019619

申请日：2021-08-06

Applicant: JSP CORPORATION

Inventor： Ryuichi TANIGUCHI ,  Takashi NISHIMOTO

IPC: B29C48/00 ,  B29C48/21 ,  B29K25/00 ,  B29K105/00 ,  B29K105/04 ,  B29L7/00

CPC classification number: B29C48/0012 ,  B29C48/21 ,  B29K2023/06 ,  B29K2025/06 ,  B29K2105/0008 ,  B29K2105/0067 ,  B29K2105/04 ,  B29K2995/0005 ,  B29L2007/002

Abstract: The multilayer foam sheet includes a polyethylene resin foam layer and a resin layer laminated on at least one of the two surfaces of the foam layer. The resin layer has a multilayer structure formed from a surface layer and an intermediate layer. Both the surface layer and the intermediate layer contain a polyethylene resin and a polymeric antistatic agent. The polymeric antistatic agent is contained in the intermediate layer at a proportion of 30-70 wt % (inclusive). The polymeric antistatic agent is contained in the surface layer at a proportion of at least 5 wt % to less than 30 wt %.

公开(公告)号：US11993690B2

公开(公告)日：2024-05-28

申请号：US17168762

申请日：2021-02-05

Applicant: JSP CORPORATION

Inventor： Tatsuya Hayashi

IPC: C08J9/18 ,  C08J9/228

CPC classification number: C08J9/18 ,  C08J9/228 ,  C08J2201/03 ,  C08J2203/14 ,  C08J2377/00

Abstract: The polyamide-based resin expanded beads are expanded beads including a polyamide-based resin as a base resin, in which the average value of bead weight of the expanded beads is 0.5 mg or more and 8 mg or less, the coefficient of variation of the bead weight of the expanded beads is 10% or less, and the average value of the ratio of a long diameter to a short diameter (a long diameter/a short diameter) of the expanded beads measured with a projection image photographing type bead size distribution analyzer is 1 or more and 1.5 or less, the coefficient of variation of the ratio (a long diameter/a short diameter) is 12% or less, the average value of the a short diameter is 1 mm or more and 4 mm or less, and the coefficient of variation of the a short diameter is 10% or less.

公开(公告)号：US20240025093A1

公开(公告)日：2024-01-25

申请号：US18217651

申请日：2023-07-03

Applicant: JSP CORPORATION

Inventor： Hisashi MASUMOTO

IPC: B29C44/44

CPC classification number: B29C44/445 ,  B29K2023/12

Abstract: An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 μm and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 μm which is smaller than the average cell diameter of the expanded bead.

公开(公告)号：US20240017451A1

公开(公告)日：2024-01-18

申请号：US18033741

申请日：2021-10-08

Applicant: JSP Corporation

Inventor： Katsunori HISAMATSU ,  Keiichi HASHIMOTO

IPC: B29C44/20 ,  B29K23/00 ,  B29K105/04

CPC classification number: B29C44/206 ,  B29K2023/00 ,  B29K2995/0082 ,  B29K2995/0094 ,  B29K2105/048

Abstract: The present invention relates to a method for producing a laminate, wherein the laminate is obtained by integrally laminating an expanded beads molded article (a) composed of expanded beads A and having interconnected voids and an expanded beads molded article (b) composed of expanded particles B and having interconnected voids, the difference [Pb−Pa] between the voidage (Pa) of the expanded beads molded article (a) and the voidage (Pb) of the expanded beads molded article (b) is 5% or more, and the expanded beads A and the expanded beads B satisfy the following (1) to (3): (1) a difference [dB−dA] between an average hole diameter (dA) of the through-holes of the expanded beads (A) and an average hole diameter (dB) of the through-holes of the expanded beads (B) is 0.3 mm or more and 2 mm or less; (2) the expanded beads (B) have an average outer diameter DB of 3.5 mm or more and 5 mm or less; (3) a difference [DB−DA] between an average outer diameter DA of the expanded beads (A) and an average outer diameter DB of the expanded beads (B) is −0.3 mm or more and 2 mm or less.

公开(公告)号：US11680148B2

公开(公告)日：2023-06-20

申请号：US16761467

申请日：2018-11-08

Applicant: JSP Corporation

Inventor： Toshio Morita ,  Hidehiro Sasaki ,  Tomohiro Hoshino

IPC: C08J9/35 ,  C08K7/02 ,  B29C67/20 ,  B32B5/24 ,  C08J9/36

CPC classification number: C08J9/35 ,  B29C67/20 ,  B32B5/24 ,  C08J9/36 ,  C08K7/02

Abstract: Provided are composite particles in which reinforcing fibers adhere to the surface of thermoplastic resin expanded beads via a thermosetting resin being in an uncured state, a cured product of the composite particles, an in-mold molded article of the composite particles, a laminate of the composite particles and a reinforcing fiber sheet material, a composite of the composite particles, and a method for producing composite particles.

公开(公告)号：US20230119472A1

公开(公告)日：2023-04-20

申请号：US17905890

申请日：2021-02-12

Applicant: JSP CORPORATION

Inventor： Takashi OI ,  Hajime OHTA

IPC: B32B27/08 ,  B32B27/32

Abstract: A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σ50 of a 50% compressive stress σ50 [kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σ5 of the expanded beads molded article is 5 kPa to 25 kPa.

公开(公告)号：US20230075291A1

公开(公告)日：2023-03-09

申请号：US17760410

申请日：2021-02-17

Applicant: JSP CORPORATION

Inventor： Yohei KANEKO ,  Kenji HARAGUCHI

IPC: C08F220/18 ,  C08F212/08 ,  C08F2/32 ,  C08F218/04 ,  C08J9/22

Abstract: A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.