公开(公告)号：US11331915B2

公开(公告)日：2022-05-17

申请号：US16465220

申请日：2017-03-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.

公开(公告)号：US11227807B2

公开(公告)日：2022-01-18

申请号：US16768553

申请日：2018-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen

IPC: H01L23/31 ,  H01L23/495

Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).

公开(公告)号：US20220002149A1

公开(公告)日：2022-01-06

申请号：US17482309

申请日：2021-09-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Devin A. Mourey ,  Michael G. Groh

IPC: B81C99/00 ,  B81C1/00 ,  B41J2/155 ,  B41J2/16 ,  B01L3/02

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

公开(公告)号：US11214065B2

公开(公告)日：2022-01-04

申请号：US16629142

申请日：2017-07-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen

IPC: B41J2/16 ,  B41J2/14

Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.

公开(公告)号：US11155086B2

公开(公告)日：2021-10-26

申请号：US16630020

申请日：2017-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-Iam Choy ,  Michael W Cumbie ,  Chien-Hua Chen ,  Jeffrey R Pollard

IPC: B41J2/14 ,  B41J2/16

Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

公开(公告)号：US11135839B2

公开(公告)日：2021-10-05

申请号：US16629120

申请日：2017-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Anthony Fuller ,  Chien-Hua Chen ,  Zhen Yi Li

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

公开(公告)号：US20210299662A1

公开(公告)日：2021-09-30

申请号：US16605619

申请日：2017-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Chien-Hua Chen ,  Michael W Cumbie

IPC: B01L3/00 ,  G01N15/14

Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.

公开(公告)号：US11130339B2

公开(公告)日：2021-09-28

申请号：US15644235

申请日：2017-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/155 ,  B41J2/175

Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

公开(公告)号：US20210283926A1

公开(公告)日：2021-09-16

申请号：US16466408

申请日：2017-03-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Reynaldo V Villavelez ,  Chien-Hua Chen

IPC: B41J2/335

Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

公开(公告)号：US20210245496A1

公开(公告)日：2021-08-12

申请号：US17251238

申请日：2019-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James R Przybyla ,  Chien-Hua Chen ,  Michaei G Groh

IPC: B41J2/045 ,  B41J2/14

Abstract: One example provides a fluidic device including a substrate and a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is disposed in direct contact with the nozzle layer and extending proximate to a portion of the nozzle orifices, the conductive trace having an electrical property indicative of damage to the nozzle layer.