公开(公告)号：US20110167912A1

公开(公告)日：2011-07-14

申请号：US13004295

申请日：2011-01-11

Applicant: Tameharu OHTA ,  Takeshi SHINODA ,  Itaru ISHII ,  Keisuke NAKANO

Inventor： Tameharu OHTA ,  Takeshi SHINODA ,  Itaru ISHII ,  Keisuke NAKANO

IPC: G01C19/56

CPC classification number: G01C19/5769 ,  B81B7/0058 ,  B81B2201/0242 ,  G01P1/023 ,  G01P15/125 ,  H01L2224/48465

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract translation: 物理量传感器包括感测部分，壳体，隔振部件，导电部分，焊盘和接合线。 壳体将感测部分包围在其中。 防振构件设置在感测部分和壳体之间以减小感测部分和壳体之间的相对振动。 接合线将设置在壳体上的导电部分和设置在感测部分的表面上的焊盘电连接。 接合线从焊盘延伸到导电部分并且包括弯曲部。 接合线被构造成满足20×d＆nlE; h的关系，其中d是接合线的外径，h是接合线相对于垂直于感测部分的表面的方向的尺寸 。

公开(公告)号：US20100154517A1

公开(公告)日：2010-06-24

申请号：US12342140

申请日：2008-12-23

Applicant: Firas Sammoura

Inventor： Firas Sammoura

IPC: G01M3/00

CPC classification number: G01M3/226 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C99/0045

Abstract: A microchip system has a package forming a hermetically sealed interior, and MEMS structure within the interior. The system also has a gas sensor for detecting the concentration of at least one of oxygen or hydrogen within the interior.

Abstract translation: 微芯片系统具有形成密封内部的封装和内部的MEMS结构。 该系统还具有用于检测内部的氧气或氢气中的至少一种的浓度的气体传感器。

公开(公告)号：US20090321857A1

公开(公告)日：2009-12-31

申请号：US12146014

申请日：2008-06-25

Applicant: Michael Foster ,  Mark Williams ,  Mark Eskridge

Inventor： Michael Foster ,  Mark Williams ,  Mark Eskridge

IPC: H01L29/84 ,  H01L21/00

CPC classification number: H01L29/84 ,  B81B1/00 ,  B81B2201/0242 ,  B81B2203/0307 ,  B81B2207/07 ,  B81C1/00039 ,  G01C19/5719

Abstract: Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

Abstract translation: 锚固系统和方法将微机电系统（MEMS）装置的部件锚定到基板上。 示例性实施例具有结合到基底的迹线锚固件，结合到基底的装置锚固件和构造成可挠曲地连接轨迹锚和装置锚固件的锚固件挠曲件，以基本上防止在轨迹锚中感应的应力的传递被传递到 设备锚点。

公开(公告)号：US20090267165A1

公开(公告)日：2009-10-29

申请号：US12094674

申请日：2006-11-24

Applicant: Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

Inventor： Takafumi Okudo ,  Yuji Suzuki ,  Yoshiyuki Takegawa ,  Toru Baba ,  Kouji Gotou ,  Hisakazu Miyajima ,  Kazushi Kataoka ,  Takashi Saijo

IPC: H01L29/84

CPC classification number: G01P1/023 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842

Abstract: A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

Abstract translation: 提供具有诸如加速度传感器和陀螺传感器的多个紧凑型传感器的晶片级封装结构。 该封装结构由具有多个传感器单元的半导体晶片和结合到半导体晶片的两个表面的一对封装晶片构成。 每个传感器单元具有一个具有开口的框架，一个保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动部分的位置偏移输出电信号。 由于通过在框架上形成的表面激活区域和形成在封装晶片上的表面激活区域之间没有扩散的固相直接接合将半导体晶片结合到每个封装晶片，因此可以防止这种变化 传感器特性由于接合界面处的残余应力而发生。

公开(公告)号：US20090212386A1

公开(公告)日：2009-08-27

申请号：US12034905

申请日：2008-02-21

Applicant: Jeff A. Ridley ,  Robert Higashi ,  James F. Detry

Inventor： Jeff A. Ridley ,  Robert Higashi ,  James F. Detry

IPC: H01L31/058 ,  H01L21/00

CPC classification number: B81B7/0087 ,  B81B2201/0242 ,  B81B2201/0278

Abstract: A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.

Abstract translation: MEMS器件包括形成在硅引脚上的PN器件，其连接到硅子组件，并且其中PN器件形成在硅衬底上，硅衬底在其被嵌入第一玻璃中之前用于制造硅销 晶圆。 在一个实施例中，形成P-N器件包括选择性地将杂质扩散到硅引脚中并且将P-N器件配置为用作温度传感器。

公开(公告)号：US20090194397A1

公开(公告)日：2009-08-06

申请号：US12359556

申请日：2009-01-26

Applicant: Angelo Merassi ,  Mario Francesco Cortese ,  Fultio Viola ,  Barbara Simoni ,  Andrea Rusconi Clerici Beltrami

Inventor： Angelo Merassi ,  Mario Francesco Cortese ,  Fultio Viola ,  Barbara Simoni ,  Andrea Rusconi Clerici Beltrami

IPC: H01H35/14

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P15/08 ,  G01P15/125 ,  G01P2015/0828

Abstract: A microelectromechanical device has a mobile mass that undergoes a movement, in particular a spurious movement, in a first direction in response to an external event; the device moreover has a stopper structure configured so as to stop said spurious movement. In particular, a stopper element is fixedly coupled to the mobile mass and is configured so as to abut against a stopper mass in response to the spurious movement, thereby stopping it. In detail, the stopper element is arranged on the opposite side of the stopper mass with respect to a direction of the spurious movement, protrudes from the space occupied by the mobile mass and extends in the space occupied by the stopper mass, in the first direction.

Abstract translation: 微机电装置具有响应于外部事件在第一方向上经历移动，特别是杂散运动的移动质量; 该装置还具有阻止结构，以便停止所述杂散运动。 特别地，止动元件固定地联接到移动块上，并被配置为响应于伪运动而抵靠止动块，从而停止它。 详细地说，止动件相对于杂散运动的方向设置在止动块的相对侧上，从移动体所占据的空间突出，并且在第一方向上在止动块所占据的空间中延伸 。

公开(公告)号：US20090183568A1

公开(公告)日：2009-07-23

申请号：US12342137

申请日：2008-12-23

Applicant: Kiyoko YAMANAKA ,  Hideaki Takano

Inventor： Kiyoko YAMANAKA ,  Hideaki Takano

IPC: G01P15/08

CPC classification number: G01P15/0802 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5719 ,  G01P1/02 ,  G01P15/125

Abstract: An angular rate sensor and an acceleration sensor are sealed at the same sealing pressure. The sealing pressure at this time is put into a reduced pressure state below the atmospheric pressure in view of improving a detection sensitivity of the angular rate sensor. Even in the reduced pressure atmosphere, to improve the detection sensitivity of the acceleration sensor, a shift suppressing portion (damper) for suppressing shifts of a movable body of the acceleration sensor is provided. This shift suppressing portion includes a plurality of protruding portions integrally formed with the movable body and a plurality of protruding portions integrally formed with a peripheral portion, and the protruding portions are alternately disposed separately at equal intervals.

Abstract translation: 在相同的密封压力下密封角速率传感器和加速度传感器。 鉴于提高角速度传感器的检测灵敏度，此时的密封压力被置于低于大气压的减压状态。 即使在减压气氛中，为了提高加速度传感器的检测灵敏度，提供了用于抑制加速度传感器的移动体的移动的偏移抑制部（阻尼器）。 该偏移抑制部包括与可动体一体形成的多个突出部和与周缘部一体形成的多个突出部，突出部以相等的间隔分开交替设置。

公开(公告)号：US07467552B2

公开(公告)日：2008-12-23

申请号：US11272154

申请日：2005-11-10

Applicant: Douglas C. MacGugan

Inventor： Douglas C. MacGugan

IPC: G01P1/02

CPC classification number: B81B7/007 ,  B81B7/0074 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A ceramic L-shaped or T-shaped packaging apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor die that translates the sensor sense axis perpendicular to the normal input plane for direct attachment to a system-level printed circuit board (PCB).

Abstract translation: 用于微机电系统（MEMS）惯性传感器管芯的陶瓷L形或T形包装装置，其将传感器感测轴垂直于正常输入平面转换，以直接附接到系统级印刷电路板（PCB） 。

公开(公告)号：US20080257045A1

公开(公告)日：2008-10-23

申请号：US12081049

申请日：2008-04-10

Applicant: Masaki Takashima

Inventor： Masaki Takashima

IPC: G01P15/125

CPC classification number: G01P15/125 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/56 ,  G01P1/023

Abstract: A sensor device includes a sensor chip, a circuit chip, a casing, a first adhesive member disposed between the sensor chip and the circuit chip, and a second adhesive member disposed between the circuit chip and the casing. The first adhesive member has an area smaller than that of the sensor chip and a distance between the first adhesive member and an outer peripheral edge of the sensor chip becomes a minimum at a portion adjacent to a centerline of the sensor chip. The second adhesive member has an area smaller than that of the circuit chip and a distance between the second adhesive member and an outer peripheral edge of the circuit chip becomes a minimum at a portion adjacent to a centerline of the circuit chip.

Abstract translation: 传感器装置包括传感器芯片，电路芯片，壳体，设置在传感器芯片和电路芯片之间的第一粘合构件，以及设置在电路芯片和壳体之间的第二粘合构件。 第一粘合构件的面积小于传感器芯片的面积，并且传感器芯片的第一粘合构件与外周边缘之间的距离在与传感器芯片的中心线相邻的部分处成为最小。 第二粘合部件的面积小于电路芯片的面积，并且第二粘合部件与电路芯片的外周边缘之间的距离在与电路芯片的中心线相邻的部分处成为最小。

公开(公告)号：US20080237757A1

公开(公告)日：2008-10-02

申请号：US12059242

申请日：2008-03-31

Applicant: Hiroaki INOUE ,  Takashi KATSUKI ,  Hiroshi ISHIKAWA ,  Fumihiko NAKAZAWA ,  Takayuki YAMAJI

Inventor： Hiroaki INOUE ,  Takashi KATSUKI ,  Hiroshi ISHIKAWA ,  Fumihiko NAKAZAWA ,  Takayuki YAMAJI

IPC: H01L29/84 ,  H01L21/02

CPC classification number: G01P15/0802 ,  B81B3/0008 ,  B81B2201/0242 ,  G01C19/5719 ,  G01P15/125 ,  G01P15/14

Abstract: A micro movable device is made by processing a material substrate of a multilayer structure including a first layer, a second layer having a finely rough region on its surface on the side of the first layer, and an intermediate layer provided between the first and the second layer. The micro movable device includes a first structure formed in the first layer and a second structure formed in the second layer. The second structure includes a portion opposing the first structure via a gap and having a finely rough region on the side of the first structure, and being relatively displaceable with respect to the first structure.

Abstract translation: 微移动装置是通过加工多层结构的材料基板制成的，所述多层结构包括第一层，在其第一层侧面上具有微细粗糙区域的第二层和设置在第一层和第二层之间的中间层 层。 微型可移动装置包括形成在第一层中的第一结构和形成在第二层中的第二结构。 第二结构包括经由间隙与第一结构相对的部分，并且在第一结构的侧面上具有微小的粗糙区域，并且可相对于第一结构相对移位。